Invention Application
- Patent Title: METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
- Patent Title (中): 金属层压板和印刷线路板
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Application No.: US14359909Application Date: 2012-11-21
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Publication No.: US20140311781A1Publication Date: 2014-10-23
- Inventor: Koji Kishino , Hiroharu Inoue , Takeshi Kitamura
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2011-254966 20111122
- International Application: PCT/JP2012/007462 WO 20121121
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.
Public/Granted literature
- US09516746B2 Metal-clad laminate and printed wiring board Public/Granted day:2016-12-06
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