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公开(公告)号：US12064090B2
公开(公告)日：2024-08-20
申请号：US17504105
申请日：2021-10-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Jau-Jan Deng , Wei-Feng Lin , Chun-Sheng Fan
CPC classification number: A61B1/051 , A61B1/00096 , A61B1/0638 , A61B1/0684
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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公开(公告)号：US11280988B2
公开(公告)日：2022-03-22
申请号：US16120966
申请日：2018-09-04
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan , Jau-Jan Deng
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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3.发明授权公开(公告)号：US09902120B2
公开(公告)日：2018-02-27
申请号：US14616925
申请日：2015-02-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Jau-Jan Deng , Tsung-Wei Wan , Chuen-Yi Yin
CPC classification number: B29D11/0074 , B29K2995/0026 , G02B3/0006 , G02B3/0031 , G02B3/0056 , G02B5/045 , G02B13/006 , G02B13/0065
Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.
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公开(公告)号：US09467606B2
公开(公告)日：2016-10-11
申请号：US14301124
申请日：2014-06-10
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tsung-Wei Wan , Jau-Jan Deng , Wei-Ping Chen
IPC: H04N5/225
CPC classification number: H04N5/2254 , H04N5/2257
Abstract: An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.
Abstract translation: 一种装置包括结合到间隔件的图像传感器。 间隔件具有在隔离件的第一端处限定了内壁中的台阶和凹部的变薄的壁。 图像传感器被结合到间隔件的凹部内的台阶上，使得图像传感器完全接受在间隔件的凹部内。 玻璃晶片安装在间隔件的第二端上。 透镜安装在玻璃晶片上，使得光被引导通过透镜到图像传感器。
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5.发明授权公开(公告)号：US09349765B2
公开(公告)日：2016-05-24
申请号：US14276527
申请日：2014-05-13
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung Wei Wan , Wei-Ping Chen
IPC: G02B13/00 , H01L27/146 , G02B7/02 , B32B38/00
CPC classification number: H01L27/14627 , B32B38/0004 , G02B7/02 , G02B7/021 , G02B13/0085 , G03B17/12 , H01L27/14632 , H04N5/2254
Abstract: A suspended lens system, for imaging a scene, includes (a) a single-piece lens for receiving light from the scene, wherein the single-piece lens includes a concave surface, and (b) a substrate including a side that faces the concave surface, for holding the single-piece lens, wherein the substrate has non-zero optical transmission and contacts only portions of the single-piece lens that are away from the concave surface. A wafer-level method for manufacturing a suspended lens system includes molding a lens array, wherein each lens of the lens array includes a concave surface, and bonding the lens array to a surface of a substrate that has non-zero optical transmission, such that the concave surfaces face the substrate, to form a suspended lens wafer.
Abstract translation: 一种用于对场景成像的悬挂透镜系统包括（a）用于接收来自场景的光的单片透镜，其中所述单片透镜包括凹面，以及（b）基板，其包括面向所述凹面的一侧 表面，用于保持单片透镜，其中基板具有非零光学透射并且仅接触远离凹面的单片透镜的部分。 用于制造悬挂透镜系统的晶片级方法包括模制透镜阵列，其中透镜阵列的每个透镜包括凹面，并且将透镜阵列粘合到具有非零光透射的基板的表面，使得 凹面朝向基板，以形成悬挂的透镜晶片。
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Patent Agency Ranking
公开(公告)号：US11063083B2
公开(公告)日：2021-07-13
申请号：US16600180
申请日：2019-10-11
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Ying Chung , Chen-Yu Hung
IPC: H01L31/0232 , H01L27/146
Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.
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公开(公告)号：US10333277B2
公开(公告)日：2019-06-25
申请号：US15795130
申请日：2017-10-26
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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公开(公告)号：US20180324336A1
公开(公告)日：2018-11-08
申请号：US15585483
申请日：2017-05-03
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
CPC classification number: H04N5/2254 , A61B1/00096 , A61B1/00186 , A61B1/051 , G02B13/0055 , G02B13/0085 , G02B23/2407 , G02B23/2484 , G03B11/045 , G03B17/08 , H04N5/2257 , H04N2005/2255
Abstract: A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.
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公开(公告)号：US09386203B2
公开(公告)日：2016-07-05
申请号：US14064813
申请日：2013-10-28
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2254 , H01L27/14627 , H01L2224/48227 , H04N5/2252
Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.
Abstract translation: 一种装置包括分割成N个图像传感器区域的图像传感器。 图像传感器连接到电路板。 包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。 间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构 设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。
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10.发明申请公开(公告)号：US20200073097A1
公开(公告)日：2020-03-05
申请号：US16120966
申请日：2018-09-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Jau Jan Deng , Wei-Ping Chen
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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