公开(公告)号：US20200073097A1

公开(公告)日：2020-03-05

申请号：US16120966

申请日：2018-09-04

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Jau Jan Deng ,  Wei-Ping Chen

IPC: G02B17/02 ,  H01S5/00 ,  H01S5/42 ,  G02B27/42

Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.