公开(公告)号：US20160216493A1

公开(公告)日：2016-07-28

申请号：US14605298

申请日：2015-01-26

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu ,  Jau-Jan Deng

IPC: G02B13/00 ,  B29C45/00 ,  B29C45/14 ,  B29D11/00

CPC classification number: G02B13/0085 ,  B29C45/0053 ,  B29C45/14336 ,  B29C45/14778 ,  B29C2045/14868 ,  B29D11/00307 ,  B29D11/00807 ,  B29L2011/0016

Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

Abstract translation: 包装方法适用于包装多个晶片级透镜。 每个晶片级透镜包括（a）具有相对的第一和第二表面的衬底和（b）在第一和第二表面中的至少一个上的相应透镜元件。 每个透镜元件具有背离基板的透镜表面。 该方法包括使用壳体材料部分地包围多个晶片级透镜以产生封装的晶片级透镜的晶片。 在封装的晶片级透镜的晶片中，壳体材料通过接触相应的基板来支撑多个晶片级透镜中的每一个，并且壳体被成形为分别为多个晶片级透镜形成多个壳体 。

公开(公告)号：US09386203B2

公开(公告)日：2016-07-05

申请号：US14064813

申请日：2013-10-28

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2254 ,  H01L27/14627 ,  H01L2224/48227 ,  H04N5/2252

Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.

Abstract translation: 一种装置包括分割成N个图像传感器区域的图像传感器。 图像传感器连接到电路板。 包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。 间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构 设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。

公开(公告)号：US10437025B2

公开(公告)日：2019-10-08

申请号：US14605298

申请日：2015-01-26

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu ,  Jau-Jan Deng

IPC: G02B13/00 ,  B29D11/00 ,  B29C45/00 ,  B29C45/14 ,  B29L11/00

Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

公开(公告)号：US20150116562A1

公开(公告)日：2015-04-30

申请号：US14064813

申请日：2013-10-28

Applicant: Omnivision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu

IPC: H04N5/378 ,  H04N5/369

CPC classification number: H04N5/2254 ,  H01L27/14627 ,  H01L2224/48227 ,  H04N5/2252

Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.

Abstract translation: 一种装置包括分割成N个图像传感器区域的图像传感器。 图像传感器连接到电路板。 包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。 将间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构 设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。