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公开(公告)号：US12251081B2
公开(公告)日：2025-03-18
申请号：US17747803
申请日：2022-05-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Wei-Feng Lin , Jau-Jan Deng
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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公开(公告)号：US11943525B2
公开(公告)日：2024-03-26
申请号：US17674675
申请日：2022-02-17
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Jau-Jan Deng , Wei-Feng Lin
CPC classification number: H04N23/555 , H04N23/55 , H04N23/56 , H04N23/57
Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
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公开(公告)号：US11526020B2
公开(公告)日：2022-12-13
申请号：US16180177
申请日：2018-11-05
Applicant: OmniVision Technologies, Inc.
Inventor： Tingyu Cheng , Jau-Jan Deng
Abstract: A projector assembly includes three coaxially aligned lenses and an aperture stop. The three coaxially aligned lenses include a first lens and, in order of increasing distance therefrom and on a same side thereof, a second lens and a positive meniscus lens. The first lens is a positive lens. The second lens is a negative lens. The second lens is located between the aperture stop and the positive meniscus lens. The projector assembly is one-sided telecentric at a plane proximate the positive meniscus lens.
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公开(公告)号：US10437025B2
公开(公告)日：2019-10-08
申请号：US14605298
申请日：2015-01-26
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu , Jau-Jan Deng
Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.
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公开(公告)号：US10288854B2
公开(公告)日：2019-05-14
申请号：US15365418
申请日：2016-11-30
Applicant: OmniVision Technologies, Inc.
Inventor： Wei Lin Tung , Jau-Jan Deng
Abstract: An athermal compound lens includes a plano-concave lens and a plano-convex lens. The plano-concave lens has a first focal length, a first refractive index n1, and planar object-side surface opposite a concave image-side surface. The plano-convex lens is axially aligned with the plano-concave lens and has (i) a second focal length, (ii) a second refractive index n2, (iii) a planar image-side surface, and (iv) a convex object-side surface between the planar image-side surface and the concave image-side surface. In a free-space wavelength range and temperature range: (a) the first focal length divided by the second focal length is less than −0.68, and (b) first and second refractive indices n1 and n2 have respective temperature dependences Δ n 1 Δ T and Δ n 2 Δ T that satisfy ( Δ n 1 Δ T ) / ( Δ n 2 Δ T ) ≥ 2.
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Patent Agency Ranking
公开(公告)号：US10204947B2
公开(公告)日：2019-02-12
申请号：US15261324
申请日：2016-09-09
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Jau-Jan Deng , Chia-Yang Chang , Wei-Feng Lin
IPC: G02B3/00 , H04N5/247 , H04N5/359 , H04N5/374 , H01L27/146
Abstract: A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.
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公开(公告)号：US09897778B2
公开(公告)日：2018-02-20
申请号：US14993347
申请日：2016-01-12
Applicant: OmniVision Technologies, Inc.
Inventor： Chuen-Yi Yin , Jau-Jan Deng
CPC classification number: G02B13/0015 , G02B13/0005 , G02B13/004 , G02B13/006 , G02B27/0025 , G06K7/1413
Abstract: A four-surface narrow field-of-view compound lens includes a first biplanar substrate between a first lens and a second lens, the first lens being plano-convex and the second lens being plano-concave. The compound lens also includes a second biplanar substrate between a third lens and a fourth lens, the third lens being plano-convex and the fourth lens being plano-concave. The second lens and third lens are between the first biplanar substrate and the second biplanar substrate. The first lens, second lens, third lens, and fourth lens are coaxial and are formed of materials having a first, second, third, and fourth Abbe number respectively and focal lengths F1, F2, F3, and F4 respectively. The first Abbe number exceeds the second Abbe number and the third Abbe number exceeds the fourth Abbe number. Ratio F1/F2 may satisfy −0.32
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公开(公告)号：US20170199348A1
公开(公告)日：2017-07-13
申请号：US14993347
申请日：2016-01-12
Applicant: OmniVision Technologies, Inc.
Inventor： Chuen-Yi Yin , Jau-Jan Deng
CPC classification number: G02B13/0015 , G02B13/0005 , G02B13/004 , G02B13/006 , G02B27/0025 , G06K7/1413
Abstract: A four-surface narrow field-of-view compound lens includes a first biplanar substrate between a first lens and a second lens, the first lens being plano-convex and the second lens being plano-concave. The compound lens also includes a second biplanar substrate between a third lens and a fourth lens, the third lens being plano-convex and the fourth lens being plano-concave. The second lens and third lens are between the first biplanar substrate and the second biplanar substrate. The first lens, second lens, third lens, and fourth lens are coaxial and are formed of materials having a first, second, third, and fourth Abbe number respectively and focal lengths F1, F2, F3, and F4 respectively. The first Abbe number exceeds the second Abbe number and the third Abbe number exceeds the fourth Abbe number. Ratio F1/F2 may satisfy −0.32
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公开(公告)号：US20170097497A1
公开(公告)日：2017-04-06
申请号：US14875012
申请日：2015-10-05
Applicant: OmniVision Technologies, Inc.
Inventor： Tingyu Cheng , Jau-Jan Deng
CPC classification number: G02B13/0085 , G02B1/041 , G02B9/04 , G02B13/003 , G02B13/006 , G02B13/04
Abstract: A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substrate having a second planar surface facing away from the image plane, (ii) a third substrate bonded to the second substrate and having a third planar surface facing the image plane, (iii) a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and (iv) a third lens element bonded to the third planar surface and having a third lens surface facing the image plane.
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10.发明申请Wide-Angle Camera Using Achromatic Doublet Prism Array And Method of Manufacturing The Same 有权使用消色差双棱镜阵列的广角相机及其制造方法公开(公告)号：US20160231473A1
公开(公告)日：2016-08-11
申请号：US14616925
申请日：2015-02-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Jau-Jan Deng , Tsung-Wei Wan , Chuen-Yi Yin
CPC classification number: B29D11/0074 , B29K2995/0026 , G02B3/0006 , G02B3/0031 , G02B3/0056 , G02B5/045 , G02B13/006 , G02B13/0065
Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.
Abstract translation: 广角照相机及其制造方法包括具有多个像素子阵列的传感器和在基板的第一侧上的光学元件阵列。 每个光学元件能够从视野形成图像到不同的像素子阵列上。 广角摄像机还包括在衬底的第二侧上的消色差双棱镜阵列，其中每个消色差双棱镜对准以提供与不同的一个光学元件的视角。 传感器捕获广角视野，同时具有紧凑的格式。
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