公开(公告)号：US20170018597A1

公开(公告)日：2017-01-19

申请号：US15272913

申请日：2016-09-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01L27/146 ,  H01P11/00 ,  H01Q13/02 ,  H01L31/18

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。

公开(公告)号：US09478458B2

公开(公告)日：2016-10-25

申请号：US14149965

申请日：2014-01-08

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01Q13/02 ,  H01L21/762 ,  H01L23/66 ,  H01Q23/00 ,  H01L23/055 ,  H01L23/14 ,  H01P11/00 ,  H01L23/00

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。

公开(公告)号：US09960204B2

公开(公告)日：2018-05-01

申请号：US15272913

申请日：2016-09-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01Q13/02 ,  H01L27/146 ,  H01L21/762 ,  H01L23/66 ,  H01Q23/00 ,  H01P11/00 ,  H01L31/18 ,  H01L23/055 ,  H01L23/14 ,  H01L23/00

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

公开(公告)号：US20250007468A1

公开(公告)日：2025-01-02

申请号：US18215439

申请日：2023-06-28

Applicant: Northrop Grumman Systems Corporation

Inventor： Manouchehr Ghanevati ,  Kevin M. Leong ,  Mansoor K. Siddiqui

IPC: H03F1/32 ,  H03F3/19

Abstract: An exemplary RF amplifier circuit has a LNA with its output coupling RF signals to a load. A post distortion (PD) circuit having a semiconductor device with a control gate biased to cause the semiconductor device to operate in a nonlinear region at or near pinch-off that is coupled to the output of the LNA. The PD circuit generates at least one PD intermodulation product at the PD port in response to the RF signals being received from the LNA through the coupling. The at least one PD intermodulation product being out of phase to an intermodulation product produced by the LNA that is present at the output. The at least one PD intermodulation product combining with the intermodulation product produced by the LNA to cause a reduction of the intermodulation product at the load by at least several dB for at least one frequency in the range of frequencies.

公开(公告)号：US20140254979A1

公开(公告)日：2014-09-11

申请号：US14149965

申请日：2014-01-08

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: G02B6/42 ,  G02B6/13 ,  H01L21/762

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。