公开(公告)号：US20240154300A1

公开(公告)日：2024-05-09

申请号：US18496975

申请日：2023-10-30

Applicant: NXP B.V.

Inventor： Harshitha Thippur Shivamurthy ,  Rabia Syeda ,  Rocío Gabriela Molina Moreno ,  Cristine Aguila Badiao ,  Pieter Lok ,  Adrianus Buijsman ,  Leo van Gemert ,  Maarten Lont ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

IPC: H01Q1/38 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/2283

Abstract: A system comprising: a waveguide assembly comprising a plurality of waveguides, the plurality of waveguides comprising at least a first waveguide and a second waveguide, and an integrated circuit package, IC package, comprising a plurality of launchers to one or more of transmit signalling to and receive signalling from a respective one of the plurality of waveguides, wherein the waveguide assembly comprises a surface configured to be coupled to the IC package and each of the plurality of waveguides comprises an opening in the surface configured to be aligned with its respective launcher, and wherein each of the openings has a major dimension and a minor dimension, wherein the major dimension is larger than the minor dimension, and wherein the major dimension of at least the opening of the first waveguide is oriented perpendicular to the major dimension of the opening of the second waveguide.

公开(公告)号：US20240106105A1

公开(公告)日：2024-03-28

申请号：US18469605

申请日：2023-09-19

Applicant: NXP B.V.

Inventor： Waqas Hassan Syed ,  Ralph Matthijs van Schelven ,  Giorgio Carluccio ,  Pieter Lok ,  Antonius Johannes Matheus de Graauw ,  Konstantinos Doris ,  Daniele Cavallo ,  Andrea Neto

IPC: H01Q1/22 ,  H01Q1/42 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01Q1/42 ,  H01Q21/061

Abstract: In accordance with a first aspect of the present disclosure, an antenna unit is provided, comprising: an integrated circuit package containing an integrated circuit die and an antenna structure coupled to the integrated circuit die; a dielectric layer separated from the integrated circuit package, wherein the dielectric layer is placed at a predefined distance above an upper surface of the integrated circuit package. In accordance with a second aspect of the present disclosure, a corresponding method of producing an antenna unit is conceived.

公开(公告)号：US10021652B2

公开(公告)日：2018-07-10

申请号：US15816945

申请日：2017-11-17

Applicant: NXP B.V.

Inventor： Kai Peter Ludwig Gossner ,  Pieter Lok

IPC: H04B7/00 ,  H04W52/18 ,  H04W16/28 ,  H04B3/08 ,  H04W16/26

CPC classification number: H04W52/18 ,  H04B1/18 ,  H04B1/40 ,  H04B3/08 ,  H04W16/26 ,  H04W16/28 ,  H04W88/085

Abstract: A remote antenna system is provided. The remote antenna system comprises an antenna controller circuit and a remote antenna circuit coupled to the antenna controller circuit by a cable. The remote antenna system further comprises a bidirectional data signal path for carrying transmit and received data signals between the antenna controller circuit and the remote antenna circuit; and a control path for carrying control information between the antenna controller circuit and the remote antenna circuit. The control path is a bidirectional control path. The control path comprises a transmit circuit comprising an input to receive control information and configured to convert the control information into a series of pulses; and a receive circuit comprising a comparator circuit configure to receive the series of pulses and reconstruct them to the control signal.