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11 条记录 (耗时 0.014 秒)

    SYSTEM
    1.
    发明公开
    SYSTEM 审中-公开

    公开(公告)号：US20240154300A1

    公开(公告)日：2024-05-09

    申请号：US18496975

    申请日：2023-10-30

    申请人： NXP B.V.

    发明人： Harshitha Thippur Shivamurthy ,  Rabia Syeda ,  Rocío Gabriela Molina Moreno ,  Cristine Aguila Badiao ,  Pieter Lok ,  Adrianus Buijsman ,  Leo van Gemert ,  Maarten Lont ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

    IPC分类号： H01Q1/38 ,  H01Q1/22

    CPC分类号： H01Q1/38 ,  H01Q1/2283

    摘要： A system comprising: a waveguide assembly comprising a plurality of waveguides, the plurality of waveguides comprising at least a first waveguide and a second waveguide, and an integrated circuit package, IC package, comprising a plurality of launchers to one or more of transmit signalling to and receive signalling from a respective one of the plurality of waveguides, wherein the waveguide assembly comprises a surface configured to be coupled to the IC package and each of the plurality of waveguides comprises an opening in the surface configured to be aligned with its respective launcher, and wherein each of the openings has a major dimension and a minor dimension, wherein the major dimension is larger than the minor dimension, and wherein the major dimension of at least the opening of the first waveguide is oriented perpendicular to the major dimension of the opening of the second waveguide.

    METHOD AND APPARATUS COMPRISING A SEMICONDUCTOR DEVICE AND TEST APPARATUS
    2.
    发明申请
    METHOD AND APPARATUS COMPRISING A SEMICONDUCTOR DEVICE AND TEST APPARATUS 有权

    公开(公告)号：US20210239754A1

    公开(公告)日：2021-08-05

    申请号：US17118828

    申请日：2020-12-11

    申请人： NXP B.V.

    发明人： Jan-Peter Schat ,  Abdellatif Zanati ,  Henrik Asendorf ,  Maristella Spella ,  Waqas Hassan Syed ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

    IPC分类号： G01R31/311

    摘要： A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

    Method and Apparatus for Coupling a Waveguide Structure to an Integrated Circuit Package
    3.
    发明申请
    Method and Apparatus for Coupling a Waveguide Structure to an Integrated Circuit Package 有权

    公开(公告)号：US20210075081A1

    公开(公告)日：2021-03-11

    申请号：US16563292

    申请日：2019-09-06

    申请人： NXP B.V.

    发明人： Antonius Hendrikus Jozef Kamphuis ,  Antonius Johannes Matheus de Graauw ,  Adrianus Buijsman ,  Michael B. Vincent

    IPC分类号： H01P5/107 ,  H01L23/66

    摘要： A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.

    Method and apparatus comprising a semiconductor device and test apparatus
    4.
    发明授权
    Method and apparatus comprising a semiconductor device and test apparatus 有权

    公开(公告)号：US11415626B2

    公开(公告)日：2022-08-16

    申请号：US17118828

    申请日：2020-12-11

    申请人： NXP B.V.

    发明人： Jan-Peter Schat ,  Abdellatif Zanati ,  Henrik Asendorf ,  Maristella Spella ,  Waqas Hassan Syed ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

    IPC分类号： G01R31/311

    摘要： A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

    Package
    7.
    发明授权
    Package 有权

    公开(公告)号：US11777204B2

    公开(公告)日：2023-10-03

    申请号：US17453199

    申请日：2021-11-02

    申请人： NXP B.V.

    发明人： Giorgio Carluccio ,  Michael B. Vincent ,  Maristella Spella ,  Antonius Johannes Matheus de Graauw ,  Harshitha Thippur Shivamurthy

    IPC分类号： H01Q1/22 ,  H01Q1/46

    CPC分类号： H01Q1/46 ,  H01Q1/2283

    摘要： A package includes an integrated circuit, IC, die having circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher. The die is coupled to an interconnect layer extending out from a footprint of the die. The launcher is formed in a launcher-substrate, separate from the die. The launcher is coupled to the die to pass the signalling therebetween by a connection in the interconnect layer. The launcher includes a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity including a ground plane arranged opposed to and spaced from the first plane. The waveguide-cavity is further defined by at least one side wall extending from the ground plane towards the first plane. The die and launcher are at least partially surrounded by mould material of the package.

    Apparatuses and methods for coupling a waveguide structure to an integrated circuit package
    8.
    发明授权
    Apparatuses and methods for coupling a waveguide structure to an integrated circuit package 有权

    公开(公告)号：US11380634B2

    公开(公告)日：2022-07-05

    申请号：US16415069

    申请日：2019-05-17

    申请人： NXP B.V.

    发明人： Antonius Johannes Matheus de Graauw ,  Antonius Hendrikus Jozef Kamphuis ,  Sander Jacobus Geluk

    IPC分类号： H01L23/66 ,  G01S7/03 ,  H01L23/495 ,  H01L23/552 ,  H01L23/00

    摘要： Aspects are directed to a waveguide structure that can couple to an integrated circuit package. The IC package includes a plurality of pillars to provide a path for carrying millimeter-wave signals, each of the pillars having a first end portion to connect to the IC package and a second end portion to connect to a waveguide antenna. Also, as may be optionally included, waveguide shields provide electro-magnetic isolation for the pillars and a micro-strip connector to provide connection between the second end portions (of the pillars) and to the waveguide antenna. Further included in the apparatus are a plurality of bond wires to connect the IC package and a lead frame, and to carry signals form circuitry of the IC package to the printed circuit board on which the package is mounted for transmission of radar signals via the waveguide antenna.

    PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS
    10.
    发明申请
    PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS 有权

    公开(公告)号：US20220328432A1

    公开(公告)日：2022-10-13

    申请号：US17226376

    申请日：2021-04-09

    申请人： NXP B.V.

    发明人： Waqas Hassan Syed ,  Cicero Silveira Vaucher ,  Antonius Johannes Matheus de Graauw

    IPC分类号： H01L23/66 ,  H01L23/498 ,  H03H7/42 ,  G01S7/02 ,  G01S13/931

    摘要： A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.