摘要:
This invention provides a multi-charged-particle beam exposure apparatus capable of easily correcting at a high precision the electron-optic characteristics of each column which constitutes an electron-optic system. The exposure apparatus has magnetic lens arrays (ML1, ML2, ML3, and ML4) which commonly adjust the electron-optic characteristics of a plurality of columns which constitute the electron-optic system, and dynamic focus lenses or deflector arrays which individually correct the electron-optic characteristics of the columns.
摘要:
An electron beam exposure apparatus for exposing a wafer by an electron beam incorporates a circuit structure for conducting a scan test to self-diagnose the electrical connections. The electron beam exposure apparatus includes: an electron beam generating section for generating the electron beam; a plurality of deflectors for deflecting the corresponding electron beams; a deflection control section for outputting a deflection control signal for causing the deflector to deflect the electron beam; and a control signal storage section for storing a value of the deflection control signal output from the deflection control section. The control signal storage section connects the plurality of deflectors in series when conducting the scan test. The control signal storage section and the deflector may be monolithically integrated on a semiconductor substrate.
摘要:
An electron beam exposure apparatus for controlling deflection timing of an electron beam with high precision, including: a blanking-electrode array having a deflecting electrode for deflecting an electron beam; a deflection timing control section for outputting the control signal for controlling the blanking-electrode array; a load circuit, of which the impedance is the same as that of the blanking-electrode array, where the wire length between the deflection timing control section and the load circuit is shorter than the wire length between the deflection timing control section and the deflecting electrode of the blanking-electrode array; and a switching section, connecting with the deflection timing control section, the blanking-electrode array, and the load circuit, for switching the destination of the control signal output from the deflection timing control section between the blanking-electrode array and the load circuit.
摘要:
The present invention provides a beam monitoring sensor which can offer both high beam monitoring precision and high speed monitoring in a multi-electron beam writing system and a monitoring method using the same. In a Faraday cup for electron beam monitoring, tantalum or a heavy metal material having an atomic number larger than that of tantalum is used to provide a Faraday cup construction having a high aspect ratio. The micro Faraday cup permits electron beam monitoring having less beam leak to a high acceleration electron beam.
摘要:
A charged particle beam exposure apparatus has a beam shaping optical system which forms an image of a charged particle source that emits charged particle beams, an aperture array and electrostatic lens which form a plurality of images of the charged particle source from the image of the charged particle source, a reduction electron optical system which reduces and projects the plurality of images of the charged particle source onto a wafer, and the first stigmator which generates astigmatism when the beam shaping optical system forms the image of the charged particle source in order to correct astigmatism generated in the reduction electron optical system. A charged particle beam exposure method of exposing a substrate by scanning with charged particle beams includes an adjustment step of making the size in the scanning direction of charged particle beams on the substrate smaller than the size in a direction perpendicular to the direction.
摘要:
An electron beam exposure apparatus which exposes a wafer (118) by using a plurality of electron beams corrects the positional error of the electron beams by using multi-deflector arrays (105, 106) capable of independently deflecting the positions of the electron beams, and pattern data to be projected onto the wafer (118). More specifically, when each of the electron beams is deflected to a predetermined exposure position on the basis of the pattern data, a static positional error independent of the deflection position is corrected by the multi-deflector arrays (105, 106), and a dynamic positional error depending on the deflection position is corrected on the basis of the pattern data.
摘要:
A charged particle beam exposure apparatus which exposes a substrate using a plurality of charged particle beams comprises a first measurement member for making the plurality of charged particle beams come incident and measuring a total current value of the charged particle beams, and a second measurement member for making the plurality of charged particle beams come incident and multiplying electrons of each of the incident charged particle beams, thereby measuring a relative value of a current of each of the charged particle beams.
摘要:
A charged particle beam lithography machine for exposing a target exposure surface by using a plurality of charged particle beams. The machine includes a charged particle source to emit a charged particle beam, an aperture substrate which has a plurality of apertures to divide the charged particle beam from the charged particle source into a plurality of charged particle beams, a plurality of electron optical systems which have the apertures as pupils, a charged particle beam optical system which projects, to the target exposure surface, charged particle source images formed by the plurality of electron optical systems, a unit adapted to set the apertures of the aperture substrate to an aperture for exposure and an aperture for aberration measurement to make the plurality of charged particle beams strike the charged particle beam optical system at different incident angles, and a detecting unit adapted to detect a position where the plurality of charged particle beams, which have passed through the aperture for aberration measurement, form images on an image surface of the charged particle beam optical system.
摘要:
The aberrations of a charged particle beam optical system in a lithography machine are measured. Control amounts to control optical elements included in the charged particle beam optical system are changed, the variations of the aberrations are obtained by executing the aberration measuring step, and the aberration sensitivities of the control amounts are obtained. The control amounts are decided on the basis of the aberrations of the charged particle beam optical system and the aberration sensitivities of the control amounts to set the aberrations of the charged particle beam optical system to target aberrations.
摘要:
A charged particle beam exposure apparatus which exposes a substrate using a plurality of charged particle beams includes a first measurement member for making the plurality of charged particle beams come incident and measuring a total current value of the charged particle beams. A second measurement member makes the plurality of charged particle beams come incident and multiplies electrons of each of the incident charged particle beams, thereby measuring a relative value of a current of each of the charged particle beams.