公开(公告)号：US09757816B2

公开(公告)日：2017-09-12

申请号：US14655281

申请日：2013-11-22

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Yoshihito Fujita ,  Tsugumaru Yamashita ,  Saneyuki Goya ,  Makoto Yamasaki ,  Ryu Suzuki ,  Kohei Kanaoka ,  Takashi Ishide ,  Toshiya Watanabe

IPC: B23K26/00 ,  B23K26/03 ,  B23K26/14 ,  B23K26/046 ,  B23K26/06 ,  B23K26/34 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K26/26 ,  B23K103/04 ,  B23K103/08 ,  B23K103/14 ,  B23K103/16 ,  B23K103/00 ,  B23K103/18

CPC classification number: B23K26/032 ,  B23K26/00 ,  B23K26/046 ,  B23K26/06 ,  B23K26/0652 ,  B23K26/14 ,  B23K26/26 ,  B23K26/34 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/14 ,  B23K2103/16 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52

Abstract: Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

公开(公告)号：US09956582B2

公开(公告)日：2018-05-01

申请号：US14437414

申请日：2013-10-28

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Yusuke Ikeda ,  Toshiyuki Funato ,  Yosuke Ikeda ,  Akihito Suzuki ,  Kunihiro Kuroi ,  Takahiro Inagaki ,  Yuji Kondo ,  Tsugumaru Yamashita

IPC: B05D1/00 ,  B05B3/02 ,  B05C13/02 ,  F16B33/00 ,  B05C5/02 ,  F16B33/06

CPC classification number: B05D1/002 ,  B05B3/02 ,  B05C5/0216 ,  B05C13/02 ,  F16B33/004 ,  F16B33/06

Abstract: A sealant applying apparatus includes a fastener rotating unit which supports a fastener to be rotatable around a central axis, and a sealant discharging unit which applies a sealant to the fastener by discharging the sealant. The fastener rotating unit includes a first holding member and a second holding member which hold the fastener to be rotatable, and a base which supports the first and second holding members. The first holding member is installed to the base to be exchangeable.

公开(公告)号：US10220469B2

公开(公告)日：2019-03-05

申请号：US14914795

申请日：2014-05-23

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Tsugumaru Yamashita ,  Yoshihito Fujita ,  Kiyotaka Nakagawa ,  Shinnosuke Osafune ,  Haruhiko Niitani ,  Yoshikatsu Sato

IPC: B23K26/00 ,  B23P23/04 ,  F02M61/16 ,  B23K37/02 ,  B23K26/06 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/382

Abstract: Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.

公开(公告)号：US10189115B2

公开(公告)日：2019-01-29

申请号：US15104627

申请日：2014-07-30

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Kiyotaka Nakagawa ,  Yoshihito Fujita ,  Tsugumaru Yamashita

IPC: B23K26/06 ,  B23K26/00 ,  B23K26/38 ,  B23K26/08 ,  B23K37/02 ,  B23K26/382

Abstract: Provided is a laser processing apparatus provided with: a first optical system including a first prism and a second prism; a second optical system including a third prism and a fourth prism; a condensing optical system that condenses laser light to guide the condensed laser light to a workpiece; a first driving device that rotates the first prism and rotates the second prism synchronously with the first prism; a second driving device that rotates the third prism and rotates the fourth prism synchronously with the third prism; and a controller that controls the first driving device and the second driving device such that the workpiece is irradiated with the laser light while the laser light turns. The controller adjusts irradiation conditions of the laser light including an incidence position and an incidence angle of the laser light with respect to the workpiece, by adjusting a relative position between the first prism and the second prism and a relative position between the third prism and the fourth prism in a rotational direction.

公开(公告)号：US09862055B2

公开(公告)日：2018-01-09

申请号：US14770015

申请日：2013-11-22

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Minoru Danno ,  Toshiya Watanabe ,  Takashi Ishide ,  Tsugumaru Yamashita ,  Yoshihito Fujita ,  Makoto Yamasaki ,  Ryu Suzuki ,  Kohei Kanaoka

IPC: B23K26/064 ,  B23K26/082 ,  B23K26/21 ,  B23K26/352 ,  B23K26/36 ,  B23K26/06 ,  B23K26/38

CPC classification number: B23K26/0652 ,  B23K26/082 ,  B23K26/36 ,  B23K26/38

Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

公开(公告)号：US20150251212A1

公开(公告)日：2015-09-10

申请号：US14437414

申请日：2013-10-28

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Yusuke Ikeda ,  Toshiyuki Funato ,  Yosuke Ikeda ,  Akihito Suzuki ,  Kunihiro Kuroi ,  Takahiro Inagaki ,  Yuji Kondo ,  Tsugumaru Yamashita

IPC: B05D1/00 ,  B05B3/02

CPC classification number: B05D1/002 ,  B05B3/02 ,  B05C5/0216 ,  B05C13/02 ,  F16B33/004 ,  F16B33/06

Abstract: A sealant applying apparatus includes a fastener rotating unit which supports a fastener to be rotatable around a central axis, and a sealant discharging unit which applies a sealant to the fastener by discharging the sealant. The fastener rotating unit includes a first holding member and a second holding member which hold the fastener to be rotatable, and a base which supports the first and second holding members. The first holding member is installed to the base to be exchangeable.

Abstract translation: 密封剂施加装置包括：紧固件旋转单元，其支撑紧固件能够围绕中心轴线旋转;以及密封剂排出单元，其通过排出密封剂而向紧固件施加密封剂。 紧固件旋转单元包括第一保持构件和保持紧固件可旋转的第二保持构件和支撑第一和第二保持构件的基部。 第一个保持构件安装在基座上可更换。