公开(公告)号：US10442032B2

公开(公告)日：2019-10-15

申请号：US15300207

申请日：2015-01-26

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Kenji Muta ,  Toshiya Watanabe ,  Takashi Ishide

IPC: B23K26/062 ,  B23K26/082 ,  B23K26/21 ,  B23K26/32 ,  B23K26/342 ,  H01S5/042 ,  B23K26/40 ,  H01S5/024 ,  H01S5/42 ,  H01S5/00 ,  H01S5/40 ,  B23K26/0622 ,  B23K26/38 ,  B23K26/08 ,  B23K26/34 ,  B23K103/04

Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

公开(公告)号：US11548097B2

公开(公告)日：2023-01-10

申请号：US14381507

申请日：2013-02-28

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Toshiya Watanabe

IPC: B23K26/38 ,  B23K26/08 ,  B23K26/06 ,  B29C59/16 ,  C04B41/00

Abstract: Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece. A control device (22) calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece (8) and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

公开(公告)号：US11344952B2

公开(公告)日：2022-05-31

申请号：US16613565

申请日：2017-08-08

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Ryuichi Narita ,  Toshiya Watanabe ,  Akio Kondou ,  Hidetaka Haraguchi ,  Shuji Tanigawa ,  Masashi Kitamura

IPC: B22F10/85 ,  B22F10/38 ,  B22F10/28 ,  B22F10/368 ,  G01B11/25 ,  G01N21/95 ,  B22F3/16 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: A three-dimensional additive manufacturing device is configured to emit a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor is configured to detect the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected based on the detection result, before completion of forming of the next layer.

公开(公告)号：US11185925B2

公开(公告)日：2021-11-30

申请号：US16615530

申请日：2017-08-08

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Ryuichi Narita ,  Toshiya Watanabe ,  Akio Kondou ,  Masashi Kitamura ,  Hidetaka Haraguchi ,  Shuji Tanigawa ,  Claus Thomy ,  Henry Koehler ,  Michael Kalms

IPC: B22F10/00 ,  B22F10/20 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  G01B11/25 ,  B22F10/30

Abstract: A process abnormality detection system for a three-dimensional additive manufacturing device which performs additive modeling by emitting a beam to a powder bed determines that a laying abnormality of the powder bed is occurring if at least one of a first condition that an average height of the powder bed from a reference position is out of a first predetermined range or a second condition that a height variation of the powder bed is out of a second predetermined range is satisfied, on the basis of a detection result of a shape measurement sensor.

公开(公告)号：US09862055B2

公开(公告)日：2018-01-09

申请号：US14770015

申请日：2013-11-22

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Minoru Danno ,  Toshiya Watanabe ,  Takashi Ishide ,  Tsugumaru Yamashita ,  Yoshihito Fujita ,  Makoto Yamasaki ,  Ryu Suzuki ,  Kohei Kanaoka

IPC: B23K26/064 ,  B23K26/082 ,  B23K26/21 ,  B23K26/352 ,  B23K26/36 ,  B23K26/06 ,  B23K26/38

CPC classification number: B23K26/0652 ,  B23K26/082 ,  B23K26/36 ,  B23K26/38

Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

公开(公告)号：US20230251128A1

公开(公告)日：2023-08-10

申请号：US18149928

申请日：2023-01-04

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. ,  National Institute of Advanced Industrial Science and Technology

Inventor： Ryuichi Narita ,  Toshiya Watanabe ,  Misaki Fukuyama ,  Takeshi Kaneko ,  Takayuki Numata

IPC: G01J1/04 ,  G01J1/02

CPC classification number: G01J1/0418 ,  G01J1/0403 ,  G01J1/0252

Abstract: A laser light profile measuring device of the present disclosure includes a reflection attenuation part reflecting and attenuating at least part of laser light incident from a first direction in a direction different from the first direction to generate measurement target laser light traveling in the first direction, a capture unit placed on one side of the reflection attenuation part in the first direction and which captures the measurement target laser light, a cooling body covering at least part of the reflection attenuation part and the capture unit in a circumferential direction with respect to the first direction, a refrigerant supply unit forcibly feeding a refrigerant toward the cooling body, and a rotation support part supporting the reflection attenuation part, the cooling body, and the refrigerant supply unit to be rotatable around a rotation axis extending in a horizontal direction.

公开(公告)号：US20190176271A1

公开(公告)日：2019-06-13

申请号：US16308891

申请日：2017-06-20

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Minoru Danno ,  Toshiya Watanabe

IPC: B23K26/382 ,  B23K26/06

Abstract: A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

公开(公告)号：US11590578B2

公开(公告)日：2023-02-28

申请号：US16613543

申请日：2017-08-08

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Ryuichi Narita ,  Toshiya Watanabe ,  Akio Kondou ,  Masashi Kitamura ,  Hidetaka Haraguchi ,  Shuji Tanigawa ,  Claus Thomy ,  Henry Koehler

IPC: B22F12/90 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B22F10/36 ,  B22F10/28 ,  G01N25/18 ,  G01N25/72

Abstract: An internal defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of an internal defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether an internal defect exists on the basis of the cooling speed.

公开(公告)号：US10792759B2

公开(公告)日：2020-10-06

申请号：US14911663

申请日：2015-01-26

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Atsushi Takita ,  Minoru Danno ,  Toshiya Watanabe ,  Takashi Ishide

IPC: B23K26/0622 ,  B23K26/40 ,  B23K26/382 ,  B23K26/06 ,  B23K26/388 ,  B23K103/16 ,  B23K26/356 ,  B23K101/00

Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

公开(公告)号：US20150014889A1

公开(公告)日：2015-01-15

申请号：US14381507

申请日：2013-02-28

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Toshiya Watanabe

IPC: B23K26/38 ,  C04B41/00 ,  B29C59/16

CPC classification number: B23K26/38 ,  B23K26/0652 ,  B23K26/0869 ,  B29C59/16 ,  C04B41/0036

Abstract: Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece. A control device (22) calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece (8) and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

Abstract translation: 提供了一种用激光束照射工件（8）的加工装置（10），加工单元和加工方法，以对工件（8）进行切削或镗孔加工。 本发明具有激光输出装置（12），引导激光束的引导光学系统（14）和引导激光束并用激光束照射工件（8）的照射头（16）。 照射头（16）通过旋转机构一体地旋转第一棱镜（52）和第二棱镜（54），从而使激光束的光路围绕旋转机构的旋转轴线旋转并照射工件（8） 同时将照射位置旋转到工件。 控制装置（22）基于工件（8）的再熔化层的容许厚度与旋转频率之间的关系，或者根据工件（8）的允许厚度之间的关系，来计算激光束的容许旋转频率范围 氧化层和旋转频率，将包括在容许旋转频率范围内的旋转频率确定为旋转机构的旋转频率，并使旋转机构旋转到所确定的旋转频率，从而能够进行高精度的加工 配置简单。