公开(公告)号：US20230282626A1

公开(公告)日：2023-09-07

申请号：US18163417

申请日：2023-02-02

Applicant: MEDIATEK INC.

Inventor： Tai-Yu CHEN ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Yin-Fa CHEN ,  Ta-Jen YU ,  Bo-Hao MA ,  Wen-Sung HSU ,  Yao-Pang HSU

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L23/147 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1511 ,  H01L2924/152

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

公开(公告)号：US20230260866A1

公开(公告)日：2023-08-17

申请号：US18157159

申请日：2023-01-20

Applicant: MEDIATEK INC.

Inventor： Yin-Fa CHEN ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA ,  Chih-Wei CHANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L23/3675 ,  H01L24/73 ,  H01L24/16 ,  H01L24/32 ,  H01L24/17 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/13 ,  H01L2924/1511 ,  H01L2924/15151 ,  H01L2924/152 ,  H01L2924/15331 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/17051 ,  H01L2924/1011

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.

公开(公告)号：US20240274517A1

公开(公告)日：2024-08-15

申请号：US18418419

申请日：2024-01-22

Applicant: MEDIATEK INC.

Inventor： Fa-Chuan CHEN ,  Ta-Jen YU ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/498 ,  H01L21/28 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L21/28132 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2924/01029 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/351

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

公开(公告)号：US20230197667A1

公开(公告)日：2023-06-22

申请号：US18172409

申请日：2023-02-22

Applicant: MEDIATEK Inc.

Inventor： Yu-Jin LI ,  Bo-Jiun YANG ,  Tai-Yu CHEN ,  Tsung-Yu PAN ,  Chun-Yin LIN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L24/32 ,  H01L23/3107 ,  H01L23/373 ,  H01L24/16 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/49816

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.