公开(公告)号：US20240170360A1

公开(公告)日：2024-05-23

申请号：US18422166

申请日：2024-01-25

Applicant: MEDIATEK Inc.

Inventor： Chun-Yin LIN ,  Yu-Jin LI ,  Tai-Yu CHEN ,  Pu-Shan HUANG

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/32257 ,  H01L2224/33055 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.

公开(公告)号：US20230197667A1

公开(公告)日：2023-06-22

申请号：US18172409

申请日：2023-02-22

Applicant: MEDIATEK Inc.

Inventor： Yu-Jin LI ,  Bo-Jiun YANG ,  Tai-Yu CHEN ,  Tsung-Yu PAN ,  Chun-Yin LIN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L24/32 ,  H01L23/3107 ,  H01L23/373 ,  H01L24/16 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/49816

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.