公开(公告)号：US20240170360A1

公开(公告)日：2024-05-23

申请号：US18422166

申请日：2024-01-25

Applicant: MEDIATEK Inc.

Inventor： Chun-Yin LIN ,  Yu-Jin LI ,  Tai-Yu CHEN ,  Pu-Shan HUANG

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/32257 ,  H01L2224/33055 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.

公开(公告)号：US20240063078A1

公开(公告)日：2024-02-22

申请号：US18497043

申请日：2023-10-30

Applicant: MEDIATEK INC.

Inventor： Che-Hung KUO ,  Chun-Yin LIN

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/367 ,  H01L23/3135 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/162 ,  H01L24/48 ,  H01L2224/08146 ,  H01L2224/08225 ,  H01L2224/16157 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/19011 ,  H01L2924/19041

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a thermal spreader, a molding material, and a second redistribution layer. The first semiconductor die and the second semiconductor die are disposed side-by-side over the first redistribution layer. The thermal spreader vertically overlaps with the first semiconductor die and/or the second semiconductor die. The molding material surrounds the thermal spreader, the first semiconductor die and the second semiconductor die. The second redistribution layer is disposed over the molding material.

公开(公告)号：US20230197667A1

公开(公告)日：2023-06-22

申请号：US18172409

申请日：2023-02-22

Applicant: MEDIATEK Inc.

Inventor： Yu-Jin LI ,  Bo-Jiun YANG ,  Tai-Yu CHEN ,  Tsung-Yu PAN ,  Chun-Yin LIN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L24/32 ,  H01L23/3107 ,  H01L23/373 ,  H01L24/16 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/49816

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.