公开(公告)号：US20050224978A1

公开(公告)日：2005-10-13

申请号：US10517670

申请日：2003-06-23

申请人： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

发明人： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

IPC分类号： C09J7/02 ,  H01L21/58 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

摘要翻译： 提供一种热固性粘合剂组合物和适于切割半导体的粘合剂制品和切割的半导体芯片的裸片接合，半导体装置和使用该粘合剂组合物和制品的半导体装置的制备方法。 在一个实施方案中，本发明提供了包含己内酯改性的环氧树脂和降粘组分的热固性粘合剂组合物。 本发明的另一个实施方案提供了一种粘合剂制品，其包含热可固化粘合剂组合物的热固化粘合剂层，所述热固化粘合剂组合物包含己内酯改性的环氧树脂，降粘组分和在所述粘合剂层的至少一部分上承载所述粘合剂层的背衬层 背层。

公开(公告)号：US20080090085A1

公开(公告)日：2008-04-17

申请号：US11933787

申请日：2007-11-01

申请人： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

发明人： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

IPC分类号： B32B27/38

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

摘要翻译： 提供一种热固性粘合剂组合物和适于半导体的切割和切割的半导体芯片的芯片结合的粘合剂制品，以及半导体装置和使用该粘合剂组合物和制品的半导体装置的制备方法。 在一个实施方案中，本发明提供了包含己内酯改性的环氧树脂和降粘组分的热固性粘合剂组合物。 本发明的另一个实施方案提供了一种粘合剂制品，其包含热可固化粘合剂组合物的热固化粘合剂层，所述热固化粘合剂组合物包含己内酯改性的环氧树脂，降粘组分和在所述粘合剂层的至少一部分上承载所述粘合剂层的背衬层 背层。

公开(公告)号：US08398866B2

公开(公告)日：2013-03-19

申请号：US13525639

申请日：2012-06-18

申请人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

发明人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

IPC分类号： B01F5/08

CPC分类号： B01F3/0807 ,  B01F5/0646 ,  B01F5/0653 ,  B01F13/0062 ,  Y10T137/87652

摘要： A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.

摘要翻译： 用于形成乳液的微芯片具有第一玻璃基板，第二玻璃基板和硅基板。 硅衬底在其中形成有第一流体流过的第一流体流动路径和不与第一流体混合的第二流体流过的第二流体流动路径。 第一流体流动路径具有连接在接合部分处的多个分支流路。 第二流体流路与接合部连通。 硅衬底中形成有乳液形成流动路径，其在接合部分处面向第二流体流路的边缘部分。 在乳液形成流动路径中形成由第一流体和第一流体包围的由第一流体包围的乳液。

公开(公告)号：US08263152B2

公开(公告)日：2012-09-11

申请号：US13048215

申请日：2011-03-15

申请人： Shoji Takeuchi

发明人： Shoji Takeuchi

IPC分类号： A23G9/00

CPC分类号： A23G9/04 ,  A23G1/22 ,  A23G3/0031 ,  A23G3/0268 ,  A23G9/22 ,  A23G9/50

摘要： An ice-candy forming container is provided which produces ice-candies having a complicated shape copying the face of a cartoon character or the like with higher quality and without a loss in shape. A forming container includes a first mold having a pattern portion formed in one face thereof, and a second mold configured to slide over and along the one face of the first mold, in a close contact relation, in directions designated by arrows A1-A2, so as to contain the first mold therein. In such a containing position, the second mold contacts externally and closely substantially an entire surface of the outer periphery of the pattern portion.

摘要翻译： 提供了一种冰糖成型容器，其产生具有复杂形状的冰糖，以更高质量复制卡通人物等的面部，并且没有形状损失。 成形容器包括：第一模具，其具有形成在其一个面上的图案部分;以及第二模具，其被构造成沿着箭头A1-A2所示的方向以紧密接触的方式在第一模具的一个面上滑动， 以便容纳其中的第一模具。 在这种容纳位置中，第二模具在图案部分的外周的外表面附近大致接近。

公开(公告)号：US20100027372A1

公开(公告)日：2010-02-04

申请号：US12507369

申请日：2009-07-22

申请人： Yutaka OZAWA ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

发明人： Yutaka OZAWA ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

IPC分类号： B01F13/00 ,  B01F5/06 ,  B32B37/12

CPC分类号： B01F3/0807 ,  B01F5/0646 ,  B01F5/0653 ,  B01F13/0062 ,  Y10T137/87652

摘要： A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.

摘要翻译： 用于形成乳液的微芯片具有第一玻璃基板，第二玻璃基板和硅基板。 硅衬底在其中形成有第一流体流过的第一流体流动路径和不与第一流体混合的第二流体流过的第二流体流动路径。 第一流体流动路径具有连接在接合部分处的多个分支流路。 第二流体流路与接合部连通。 硅衬底中形成有乳液形成流动路径，其在接合部分处面向第二流体流路的边缘部分。 在乳液形成流动路径中形成由第一流体和第一流体包围的由第一流体包围的乳液。

公开(公告)号：US5142849A

公开(公告)日：1992-09-01

申请号：US710485

申请日：1991-06-05

申请人： Tomohiko Amimoto ,  Shoji Takeuchi

发明人： Tomohiko Amimoto ,  Shoji Takeuchi

IPC分类号： A01D44/00 ,  E02B15/00

CPC分类号： A01D44/00

摘要： An aquatic plant cutting apparatus comprises a first fixed edge having a ribbon-like shape and having a cutting edge portion at its edge and at least one rotary edge juxtaposed along the front edge portion of the first fixed edge, and an aquatic plant recovery boat is constituted by fitting the aquatic plant cutting apparatus to floating means having a propeller through a connection member.

摘要翻译： 一种水生植物切割装置包括具有带状形状的第一固定边缘及其边缘处的切割边缘部分和沿着第一固定边缘的前边缘部分并置的至少一个旋转边缘，水生植物回收船是 通过将水生植物切割装置装配到具有螺旋桨的浮动装置通过连接构件构成。

公开(公告)号：US08906644B2

公开(公告)日：2014-12-09

申请号：US13392226

申请日：2010-07-28

申请人： Hitoshi Matsui ,  Yasuyuki Sakai ,  Teruo Fujii ,  Shoji Takeuchi ,  Yukiko Tsuda

发明人： Hitoshi Matsui ,  Yasuyuki Sakai ,  Teruo Fujii ,  Shoji Takeuchi ,  Yukiko Tsuda

IPC分类号： G01N21/64 ,  C12M1/12 ,  C12M1/34 ,  C12M1/00 ,  C12N5/071 ,  C12M1/04 ,  G01N33/50

CPC分类号： C12M23/20 ,  C12M23/24 ,  C12M25/14 ,  C12M41/46 ,  C12N5/0671 ,  C12N2503/00 ,  C12N2533/30 ,  C12N2533/54 ,  G01N33/5044

摘要： A method for culturing hepatocytes, wherein hepatocytes embedded in an extracellular matrix is placed on a gas-permeable membrane and the hepatocytes are cultured while being supplied with oxygen from the gas-permeable membrane side. By this, the polarity in the hepatocytes can be induced and a bile canaliculus can be formed in a short period of time. Further, the formed polarity can be maintained for a longer period.

摘要翻译： 一种培养肝细胞的方法，其中将包埋在细胞外基质中的肝细胞置于透气膜上，并且在从透气膜侧供给氧的同时培养肝细胞。 由此，可以诱导肝细胞中的极性，并且可以在短时间内形成胆小管。 此外，所形成的极性可以保持更长的时间。

公开(公告)号：US20140010960A1

公开(公告)日：2014-01-09

申请号：US13980496

申请日：2012-01-06

申请人： Hideaki Shibata ,  Shoji Takeuchi ,  Yun-Jung Heo

发明人： Hideaki Shibata ,  Shoji Takeuchi ,  Yun-Jung Heo

IPC分类号： B81C1/00

CPC分类号： B81C1/00373 ,  B82Y30/00 ,  C08F2/10 ,  C08F220/56 ,  C08F222/385

摘要： A method of producing a microstructured gel in a shape in accordance with a pattern comprises: dropping a polymerizable monomer aqueous solution containing a polymerizable monomer component onto a portion of a surface of a substrate having a pattern comprising a fine groove in the surface; moving by capillary action the polymerizable monomer aqueous solution along the groove constituting the pattern; and subjecting the polymerizable monomer aqueous solution in the groove to polymerization.

摘要翻译： 根据图案的形状的微结构凝胶的制造方法包括：将含有可聚合单体组分的可聚合单体水溶液滴落到表面上具有包括细槽的图案的基材表面的一部分上; 通过毛细作用沿着构成图案的槽移动可聚合单体水溶液; 并使槽中的可聚合单体水溶液聚合。

公开(公告)号：US08513165B2

公开(公告)日：2013-08-20

申请号：US12744794

申请日：2008-11-26

申请人： Shoji Takeuchi ,  Hiroaki Suzuki ,  Sadao Ota ,  Wei-Heong Tan

发明人： Shoji Takeuchi ,  Hiroaki Suzuki ,  Sadao Ota ,  Wei-Heong Tan

IPC分类号： C40B60/00 ,  C12M1/34

CPC分类号： C40B60/00 ,  B01L3/5027 ,  B01L3/502738 ,  B01L2200/0605 ,  B01L2200/0642 ,  B01L2200/0673 ,  B01L2300/041 ,  B01L2300/0864 ,  B01L2400/0487 ,  G01N33/54306 ,  G01N33/54366 ,  G01N33/92 ,  G01N2405/04

摘要： There is provided a planar lipid bilayer array formed by microfluidic technique and a method of analysis using the planar lipid bilayers, providing the advantages such as portability, decreased analysis time, a smaller amount of required reagents, and parallel automation with high reproducibility. The planar lipid bilayer array formed by microfluidic technique is a planar lipid bilayer array formed by microfluidic technique (PDMS device) 1 saturated with water by preliminarily immersing in water, comprising microchannels 2 connected to an inlet of a microfluidic channel and arranged in parallel, and microchambers 3 having apertures on both sides of the microchannel 2.

摘要翻译： 提供了通过微流控技术形成的平面脂质双层阵列和使用平面脂双层的分析方法，提供了便携性，降低的分析时间，较少量的所需试剂和具有高再现性的并行自动化的优点。 通过微流体技术形成的平面脂双层阵列是通过预先浸入水中的通过微水洗技术（PDMS装置）1形成的平面脂双层阵列，其包括连接到微流体通道的入口并平行布置的微通道2，以及 微通道3在微通道2的两侧具有孔。

公开(公告)号：US20130165348A1

公开(公告)日：2013-06-27

申请号：US13513896

申请日：2010-12-08

申请人： Teruo Fujii ,  Soo-Hyeon Kim ,  Shoji Takeuchi ,  Dominique Fourmy ,  Satoko Yoshizawa

发明人： Teruo Fujii ,  Soo-Hyeon Kim ,  Shoji Takeuchi ,  Dominique Fourmy ,  Satoko Yoshizawa

IPC分类号： C40B50/08 ,  C40B60/14

CPC分类号： C12P21/02

摘要： Provided are a method and a device for synthesizing proteins from DNA molecules captured in microchambers, whereby the distance between microchambers can be shortened, thereby allowing the density of arrays to be increased. Microchambers (32) are arranged at a high density. A DNA solution (34) which has been diluted so as to capture one DNA molecule on average is enclosed in the microchambers (32). Then, mRNA is synthesized using one DNA molecule on average as a template. Based on this mRNA, a protein (37) is extracellularly synthesized.

摘要翻译： 本发明提供了一种用于从微室中捕获的DNA分子合成蛋白质的方法和装置，由此能够缩短微室之间的距离，从而增加阵列的密度。 微型仓（32）以高密度排列。 已经稀释以便平均捕获一个DNA分子的DNA溶液（34）被包封在微室（32）中。 然后，使用一个DNA分子平均作为模板合成mRNA。 基于该mRNA，蛋白质（37）在细胞外合成。