Semiconductor memory device that provides a memory die

    公开(公告)号:US11694754B2

    公开(公告)日:2023-07-04

    申请号:US17469095

    申请日:2021-09-08

    Inventor: Yuzuru Shibazaki

    CPC classification number: G11C16/32 G11C16/0483 G11C16/10 G11C16/3459

    Abstract: ABSTRACT A semiconductor memory device provides a first memory cell array including a plurality of first memory blocks, a second memory cell array comprising a plurality of second memory blocks, and a voltage supply line electrically connected to the plurality of first memory blocks and the plurality of second memory blocks. Moreover, this semiconductor memory device is configured to execute a write operation. At a first timing of this write operation, the voltage supply line is not electrically continuous with the first and second memory blocks. Moreover, a voltage of the voltage supply line at the first timing in the case of the write operation being executed on the first and second memory blocks is larger than a voltage of the voltage supply line at the first timing in the case of the write operation being executed on the first memory block.

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