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公开(公告)号:US11876647B2
公开(公告)日:2024-01-16
申请号:US17857022
申请日:2022-07-03
Applicant: KIOXIA CORPORATION
Inventor: Kensuke Yamamoto , Kosuke Yanagidaira
IPC: H04L25/02 , G11C29/02 , G11C11/4093 , G11C7/10 , G11C11/16 , G11C11/409 , H03K19/00 , H03K19/17764
CPC classification number: H04L25/0278 , G11C7/1057 , G11C11/1673 , G11C11/409 , G11C11/4093 , G11C29/022 , G11C29/028 , H03K19/0005 , H03K19/17764 , G11C2207/105 , G11C2207/2254
Abstract: A semiconductor device includes a first chip and a second chip. The first chip includes a first circuit having a first output terminal. The second chip includes a second circuit having a second output terminal, which is electrically connected to the first output terminal via a first signal line. When the first chip and the second chip receive a first command, the second circuit calibrates an output impedance at the second output terminal through a first calibration operation based on an output impedance at the first output terminal.
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公开(公告)号:US11495307B2
公开(公告)日:2022-11-08
申请号:US17202590
申请日:2021-03-16
Applicant: Kioxia Corporation
Inventor: Masato Dome , Kensuke Yamamoto , Masaru Koyanagi , Ryo Fukuda , Junya Matsuno , Kenro Kubota
Abstract: According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.
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公开(公告)号:US11380406B2
公开(公告)日:2022-07-05
申请号:US17017726
申请日:2020-09-11
Applicant: Kioxia Corporation
Inventor: Yousuke Hagiwara , Kensuke Yamamoto , Takeshi Hioka , Satoshi Inoue
Abstract: In general, according to one embodiment, an output circuit includes first to third power supply lines, a pad, first to second transistors, and a first circuit. A first end of the first transistor is coupled to the first power supply line. A second end of the first transistor is coupled to the pad. A first end of the second transistor is coupled to the second power supply line. A second end of the second transistor is coupled to the pad. The first circuit is coupled to each of the third power supply line and a gate of the first transistor. In a first case, the first circuit applies a fourth voltage to the gate of the first transistor.
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公开(公告)号:US12068043B2
公开(公告)日:2024-08-20
申请号:US17959098
申请日:2022-10-03
Applicant: Kioxia Corporation
Inventor: Masato Dome , Kensuke Yamamoto , Masaru Koyanagi , Ryo Fukuda , Junya Matsuno , Kenro Kubota
CPC classification number: G11C16/30 , G11C16/0483
Abstract: According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.
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公开(公告)号:US11961586B2
公开(公告)日:2024-04-16
申请号:US17577650
申请日:2022-01-18
Applicant: Kioxia Corporation
Inventor: Kensuke Yamamoto
Abstract: A semiconductor device according to an embodiment includes: a logic control circuit to which a signal is input; a timing information storage circuit configured to store timing information related to a start timing of correction processing that corrects a duty cycle of the signal; and a sequencer configured to start execution of the correction processing based on the timing information when a command related to the execution of the correction processing is received.
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公开(公告)号:US11868648B2
公开(公告)日:2024-01-09
申请号:US17575749
申请日:2022-01-14
Applicant: Kioxia Corporation
Inventor: Kensuke Yamamoto
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0679 , G06F13/1668 , G11C7/1063 , G11C7/22
Abstract: A memory system outputs read enable signals RE and /RE during a period of a standby time tWHR2 necessary for a process of output to a controller, and causes an output, circuit to output dummy data preset in signals DQS and /DQS.
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公开(公告)号:US11381425B2
公开(公告)日:2022-07-05
申请号:US17125830
申请日:2020-12-17
Applicant: KIOXIA CORPORATION
Inventor: Kensuke Yamamoto , Kosuke Yanagidaira
IPC: H04L25/02 , G11C29/02 , G11C11/4093 , G11C7/10 , G11C11/16 , G11C11/409 , H03K19/00 , H03K19/17764
Abstract: A semiconductor device includes a first chip and a second chip. The first chip includes a first circuit having a first output terminal. The second chip includes a second circuit having a second output terminal, which is electrically connected to the first output terminal via a first signal line. When the first chip and the second chip receive a first command, the second circuit calibrates an output impedance at the second output terminal through a first calibration operation based on an output impedance at the first output terminal.
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公开(公告)号:US11495308B2
公开(公告)日:2022-11-08
申请号:US17202661
申请日:2021-03-16
Applicant: Kioxia Corporation
Inventor: Junya Matsuno , Kenro Kubota , Masato Dome , Kensuke Yamamoto , Kei Shiraishi , Kazuhiko Satou , Ryo Fukuda , Masaru Koyanagi
IPC: G11C16/32 , G11C16/04 , H01L27/115 , G11C16/08 , G11C16/26
Abstract: According to an embodiment, a semiconductor device includes a first circuit, a second circuit, and a third circuit. The first circuit is configured to receive a first signal, and output a first voltage to a first node in accordance with a voltage of the first signal being at a first level and output a second voltage to the first node in accordance with the voltage of the first signal being at a second level. The first voltage is higher than the second voltage. The second circuit is coupled to the first node and configured to latch data based on a voltage of the first node. The third circuit includes a first inverter. The first inverter includes a first input terminal coupled to the first node and a first output terminal coupled to the first node.
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公开(公告)号:US12034443B2
公开(公告)日:2024-07-09
申请号:US18125081
申请日:2023-03-22
Applicant: Kioxia Corporation
Inventor: Junya Matsuno , Kensuke Yamamoto , Ryo Fukuda , Masaru Koyanagi , Kenro Kubota , Masato Dome
IPC: G11C7/10 , G11C7/06 , G11C11/419 , H03K19/0185
CPC classification number: H03K19/018521 , G11C7/1048 , G11C7/1063 , G11C7/109 , H03K19/018571 , G11C7/065 , G11C7/1087 , G11C11/419
Abstract: A device includes a memory cell array configured to store data; and a signal propagation circuit configured to propagate a signal between the memory cell array and a host. The signal propagation circuit includes a first inverted signal output circuit, a second inverted signal output circuit including an input terminal connected to i) an output terminal of the first inverted signal output circuit and ii) an output terminal of the second inverted signal output circuit, a third inverted signal output circuit including an input terminal connected to i) the output terminal of the first inverted signal output circuit and ii) the output terminal of the second inverted signal output circuit, and a fourth inverted signal output circuit including an input terminal connected to i) an output terminal of the third inverted signal output circuit and ii) an output terminal of the fourth inverted signal output circuit.
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公开(公告)号:US12135898B2
公开(公告)日:2024-11-05
申请号:US18520612
申请日:2023-11-28
Applicant: Kioxia Corporation
Inventor: Kensuke Yamamoto
Abstract: A semiconductor memory device includes a memory cell storing data; a signal pad inputting write data to the memory cell and from which read data read from the memory cell is output to an external controller; a first control pad receiving a first timing control signal from the external controller; and a second control pad outputting a second timing control signal to the external controller. In a first time period after a data out command is received, dummy data are output from the signal pad while the second timing control signal from the second control pad is toggling in response to toggling of the first timing control signal input to the first control pad. In a second time period after the first time period, read data are output from the signal pad while the second timing control signal is toggling in response to toggling of the first timing control signal.
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