Method of forming a 3D stacked compute and memory

    公开(公告)号:US11637090B2

    公开(公告)日:2023-04-25

    申请号:US17390829

    申请日:2021-07-30

    摘要: Described is a packaging technology to improve performance of an AI processing system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die includes memory and the second die includes computational logic. The first die comprises a ferroelectric RAM (FeRAM) having bit-cells. Each bit-cell comprises an access transistor and a capacitor including ferroelectric material. The access transistor is coupled to the ferroelectric material. The FeRAM can be FeDRAM or FeSRAM. The memory of the first die may store input data and weight factors. The computational logic of the second die is coupled to the memory of the first die. The second die is an inference die that applies fixed weights for a trained model to an input data to generate an output. In one example, the second die is a training die that enables learning of the weights.

    MANGANESE OR SCANDIUM DOPED FERROELECTRIC PLANAR DEVICE AND DIFFERENTIAL BIT-CELL

    公开(公告)号:US20230116124A1

    公开(公告)日:2023-04-13

    申请号:US18048019

    申请日:2022-10-19

    IPC分类号: G11C11/22 H01L21/02

    摘要: Described is a low power, high-density non-volatile differential memory bit-cell. The transistors of the differential memory bit-cell can be planar or non-planer and can be fabricated in the frontend or backend of a die. A bit-cell of the non-volatile differential memory bit-cell comprises first transistor first non-volatile structure that are controlled to store data of a first value. Another bit-cell of the non-volatile differential memory bit-cell comprises second transistor and second non-volatile structure that are controlled to store data of a second value, wherein the first value is an inverse of the second value. The first and second volatile structures comprise ferroelectric material (e.g., perovskite, hexagonal ferroelectric, improper ferroelectric).

    Ferroelectric based latch
    9.
    发明授权

    公开(公告)号:US11616507B2

    公开(公告)日:2023-03-28

    申请号:US17390831

    申请日:2021-07-30

    IPC分类号: H03K19/23 H03K19/00 H03K19/21

    摘要: A low power sequential circuit (e.g., latch) uses a non-linear polar capacitor to retain charge with fewer transistors than traditional CMOS sequential circuits. The sequential circuit includes a 3-input majority gate having first, second, and third inputs, and a first output. The sequential circuit includes a driver coupled to the first output, wherein the driver is to generate a second output. The sequential circuit further includes an exclusive-OR (XOR) gate to receive a clock and the second output, wherein the XOR gate is to generate a third output which couples to the second input, where the first input is to receive a data, and wherein the third input is to receive the second output.