摘要:
A method and apparatus for modulating an optical signal using a micromechanical modulator are disclosed. The modulator comprises a membrane, which consists of at least one layer, and a substrate, spaced to form an air gap. The layers of the membrane are characterized in that there is a relationship between the refractive indices of the layers and the refractive index of the substrate. The membrane is suspended in a first position over the substrate by a flexible support arrangement. Bias is applied to the membrane and the substrate to create an electrostatic force to move the membrane towards the substrate to a second position. The reflectivity of the device to an optical signal changes as the membrane moves from the first position to the second position, thereby modulating the signal.
摘要:
A technique is described for the preparation of a thin film of a silicon nitride diffusion barrier to gallium on a silicon integrated circuit chip. The technique involves reacting nitrogen and silane in a ratio of 53:1 to 300:1 in a plasma enhanced chemical vapor deposition apparatus. The described technique is of interest for use in the monolithic integration of interconnected GaAs/AlGaAs double heterostructures, modulators and silicon MOSFET structures.
摘要:
Nonpolar substrates comprising off-axis growth regions for the growth of polar semiconductors, and a method for making such substrates, are disclosed. According to the invention, an erodible material, such as a photoresist, is applied to a substrate at a site and is exposed to radiation at that site which has an linear variation in energy at the surface of the erodible material. Due to this variation in exposure energy, a taper results in the erodible material after development. The tapered region is then etched in a manner which etches both the erodible layer and the underlying substrate. The taper in the erodible layer provides a varying attenuation during the etching process such that the taper of the erodible layer is transferred to the substrate.
摘要:
This invention concerns with a non-alloyed ohmic contact to III-V semiconductor material in a III-V semiconductor device on a Si base. The ohmic contact includes at least one set of layers comprising a delta-doped monolayer and a thin layer of undoped III-V semiconductor material which is 2.5 nm or less in thickness, said at least one set of layers being upon a doped III-V semiconductor layer. An epitaxial layer of metal upon an uppermost of the layers of the said set of layers completes the ohmic contact, said metal being capable of wetting the surface of the III-V semiconductor material and of being epitaxially grown on the said III-V semiconductor material. At least the said at least one set of layers and the metal layer are deposited by Molecular Beam Epitaxy, thus avoiding formation of oxides and growing the metal epitaxially so that the metal layer is crystalline at least near the interface between the metal and the semiconductor material. The epitaxial deposition of the metal is conducted at a relatively low temperature of the semiconductor material. In an illustrative embodiment the metal is Al capable of being epitaxially deposited at a temperature within a range of from 10.degree. C. to 100.degree. C., preferably to a temperature ranging from 20.degree. C. to 50.degree. C., with 25.degree. C. being most preferable. The resultant contacts exhibit specific resistance which is lower and higher current passing capabilities which are higher than those of prior art non-alloyed ohmic contacts. However, the most noteworthy advantage of using Al in an integrated opto-electronic circuit comprising a III-V semiconductor device on a Si base, is the avoidance of "purple plague". The "purple plague" may arise when gold-based contacts in III-V semiconductor devices and Al-based contacts in Si-devices being used in an integrated circuit come in contact, especially at higher, e.g. 300.degree. C., temperatures.
摘要:
Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles the upper surface of the mechanically compliant bump. The wall, which is capable of flexing or deforming under pressure provides mechanical compliance. The wall is able to flex or deform under pressure even if the bump is formed from high-temperature metal. These mechanically compliant bumps facilitate sound electrical connections even when an electronics device is brought into contact for bonding out of parallel.
摘要:
A robotic optical cross-connect to operate with three motors irrespective of the number of input fibers. A preferred embodiment includes a ferrule loader arm operated by a first motor; a ferrule loader ring rotatably operated by a second motor; and a loading piston upon which the ferrule loader-ring is mounted. The first motor imparts a motion to the ferrule loader arm in a first direction. The loading piston imparts a motion to the ferrule loader ring in a second direction, the second direction being substantially orthogonal to the first direction. A plurality of connectorized patch fibers is connected at a first end (leaving a second end free) to a first fiber bundle arranged in a substantially circular fashion. A second fiber bundle is also arranged in a substantially circular fashion and is configured to receive connections from the free second end of the plurality of patch fibers. Ferrules are loaded from the ferrule loader arm onto the ferrule loader ring. By operating the second motor, the ferrule loader ring is rotated to an appropriate (arbitrary, prescribed) position within contact or within a free-space coupling region. Thereafter a connection between the fibers from the first fiber bundle and the second fiber bundle is established.
摘要:
A direct-view display comprising an array of micro-mechanical modulators is disclosed, he modulator used to form the display comprises a suspended, vertically moving membrane and a substrate. The device functions based on optical interference effects between the membrane and the substrate which cause the modulator to either substantially reflect or absorb an optical signal. The interference effects are a function of the size of the air gap between the membrane and substrate, which varies as the membrane moves. The membrane moves in response to a data signal, representative of an image, delivered to the modulator. The display generates an image based on the pattern of light and dark sections of the display corresponding to the reflectivity of each modulator at a given point in time.
摘要:
An in-situ method is disclosed for highly accurate lattice matching using reflection high energy electron diffraction dynamics. The method includes the steps of providing a substrate of a first semiconductor material and initiating growth of a second semiconductor material thereon. The oscillation amplitude of intensity I of waveform cycles is monitored using reflection high energy electron diffraction. A maximum intensity I.sup.+ and a minimum intensity I.sup.- is determined over a predetermined number of waveform cycles. The intensity drop .DELTA.I from initial reflectivity to minimum reflectivity of the waveform cycles is determined and normalized figure of merit FM is calculated for the predetermined number of waveform cycles using the relationship: ##EQU1## The fluxes of the second semiconductor material are then adjusted to maximize FM and optimize matching. A multiple quantum well light modulator is also provided including a semiconductor substrate of InP, a multiple quantum well region, disposed above the InP substrate, composed of InGaAs and having a thickness of about 4 .mu.m. The modulator is characterized by a lattice mismatch of less than 2.times.10.sup.4.
摘要:
A method for desorbing the surface oxide on a silicon substrate is performed by implanting particles such at atomic or ionic hydrogen into the oxide layer on the silicon substrate. The oxide is then removed by breaking the bonds between the silicon and oxygen atoms within the oxide. The bonds may be broken by heating the substrate, for example. The temperature to which the substrate must be raised is substantially less than the temperature required to desorb an oxide layer that has not undergone an implantation step. In one particular example, the particles implanted into the oxide surface are hydrogen ions generated by electron cyclotron resonance.
摘要:
A modulator that provides low insertion loss and wide bandwidth. The modulator has a single layer, quarter wave membrane that is suspended over a substrate. The membrane has a refractive index, nm, in a range of about 1.1ns0.5≦nm≦1.4ns0.5. When actuated, the membrane moves toward the substrate, altering the reflectivity of the modulator. In some embodiments, the substrate is germanium, which has a protective layer disposed thereon to protect it from etchant during MEMS fabrication procedures.