公开(公告)号：US08257542B2

公开(公告)日：2012-09-04

申请号：US12576500

申请日：2009-10-09

申请人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

发明人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

IPC分类号： B29C65/00 ,  B32B37/00

CPC分类号： B32B5/26 ,  B32B3/02 ,  B32B5/024 ,  B32B7/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/00 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/24149 ,  Y10T428/24942 ,  Y10T428/249923 ,  Y10T428/24994 ,  Y10T428/249945 ,  Y10T442/643 ,  Y10T442/659 ,  Y10T442/668 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

摘要： A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.

摘要翻译： 形成50层第一沥青基碳纤维片的叠层，制成两组堆叠在其中的两个第二沥青基碳纤维片。 此时，第二碳纤维片的热膨胀系数大于第一碳纤维片的热膨胀系数。 接下来，将第一碳纤维片的叠层保持在两组第二碳纤维片之间。 然后将第一和第二碳纤维片材的叠层用环氧树脂基树脂组合物浸渍，并使树脂固化。 结果得到由第一和第二碳纤维片材构成的预浸料和由环氧基树脂组合物构成的树脂组分。 此后，在预浸料坯上形成互连等，从而完成多层互连板。

公开(公告)号：US07622184B2

公开(公告)日：2009-11-24

申请号：US11339511

申请日：2006-01-26

申请人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

发明人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

IPC分类号： B32B5/26 ,  B32B7/02 ,  B32B7/04 ,  H05K1/03 ,  H01L23/485

CPC分类号： B32B5/26 ,  B32B3/02 ,  B32B5/024 ,  B32B7/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/00 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/24149 ,  Y10T428/24942 ,  Y10T428/249923 ,  Y10T428/24994 ,  Y10T428/249945 ,  Y10T442/643 ,  Y10T442/659 ,  Y10T442/668 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

摘要： A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.

摘要翻译： 形成50层第一沥青基碳纤维片的叠层，制成两组堆叠在其中的两个第二沥青基碳纤维片。 此时，第二碳纤维片的热膨胀系数大于第一碳纤维片的热膨胀系数。 接下来，将第一碳纤维片的叠层保持在两组第二碳纤维片之间。 然后将第一和第二碳纤维片材的叠层用环氧树脂基树脂组合物浸渍，并使树脂固化。 结果得到由第一和第二碳纤维片材构成的预浸料和由环氧基树脂组合物构成的树脂组分。 此后，在预浸料坯上形成互连等，从而完成多层互连板。

公开(公告)号：US20070077391A1

公开(公告)日：2007-04-05

申请号：US11339511

申请日：2006-01-26

申请人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

发明人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

IPC分类号： B32B5/26 ,  B32B3/12 ,  B32B7/02

CPC分类号： B32B5/26 ,  B32B3/02 ,  B32B5/024 ,  B32B7/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/00 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/24149 ,  Y10T428/24942 ,  Y10T428/249923 ,  Y10T428/24994 ,  Y10T428/249945 ,  Y10T442/643 ,  Y10T442/659 ,  Y10T442/668 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

摘要： A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.

摘要翻译： 形成50层第一沥青基碳纤维片的叠层，制成两组堆叠在其中的两个第二沥青基碳纤维片。 此时，第二碳纤维片的热膨胀系数大于第一碳纤维片的热膨胀系数。 接下来，将第一碳纤维片的叠层保持在两组第二碳纤维片之间。 然后将第一和第二碳纤维片材的叠层用环氧树脂基树脂组合物浸渍，并使树脂固化。 结果得到由第一和第二碳纤维片材构成的预浸料和由环氧基树脂组合物构成的树脂组分。 此后，在预浸料坯上形成互连等，从而完成多层互连板。

公开(公告)号：US20060175084A1

公开(公告)日：2006-08-10

申请号：US11138467

申请日：2005-05-27

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H05K1/11 ,  H05K3/42

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20070240901A1

公开(公告)日：2007-10-18

申请号：US11812124

申请日：2007-06-15

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H05K1/11

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07246435B2

公开(公告)日：2007-07-24

申请号：US11138467

申请日：2005-05-27

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H01K3/10

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07420130B2

公开(公告)日：2008-09-02

申请号：US11812124

申请日：2007-06-15

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20130096233A1

公开(公告)日：2013-04-18

申请号：US13637629

申请日：2011-03-22

申请人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

发明人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC分类号： C08L63/00 ,  C08K9/02 ,  C08K3/10 ,  C08K3/22

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

摘要翻译： 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US08158503B2

公开(公告)日：2012-04-17

申请号：US11474453

申请日：2006-06-26

申请人： Tomoyuki Abe

发明人： Tomoyuki Abe

IPC分类号： H01L21/44

CPC分类号： H05K3/4614 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/3473 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0215 ,  H05K2201/10378 ,  H01L2924/00

摘要： A multilayer interconnection substrate is disclosed that includes a multilayer interconnection layer having at least a first interconnection layer and a second interconnection layer stacked with an insulating layer provided therebetween, and a connection via configured to electrically connect the first interconnection layer and the second interconnection layer. The connection via includes an internal conductor and a metal film covering the internal conductor. The internal conductor is an aggregate of metal particles.

摘要翻译： 公开了一种多层互连衬底，其包括具有至少第一互连层和层叠有设置在其间的绝缘层的第二互连层的多层互连层，以及经配置以电连接第一互连层和第二互连层的连接通孔。 连接通孔包括内部导体和覆盖内部导体的金属膜。 内部导体是金属颗粒的聚集体。

公开(公告)号：US08119923B2

公开(公告)日：2012-02-21

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00 ,  B32B9/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。