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公开(公告)号：US10699926B2
公开(公告)日：2020-06-30
申请号：US16113930
申请日：2018-08-27
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Brian Duffy , Mike VonDenHoff , Andrew Cross , Kaushik Sah , Antonio Mani
Abstract: Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.
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2.发明申请公开(公告)号：US20180204315A1
公开(公告)日：2018-07-19
申请号：US15863753
申请日：2018-01-05
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Ankit Jain
CPC classification number: G06T7/001 , G06K9/20 , G06K9/6256 , G06K9/6267 , G06K9/627 , G06T7/0004 , G06T7/70 , G06T2200/04 , G06T2207/10016 , G06T2207/10148 , G06T2207/20081 , G06T2207/30148
Abstract: A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by an inspection system for a location of a defect detected on a wafer by the inspection system are acquired. The location on the wafer is comprised of a plurality of stacked layers, and each image of the plurality of images is generated by the inspection system at the location using a different focus setting. Further, a classification of the defect is determined, utilizing the plurality of images.
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公开(公告)号：US20180197714A1
公开(公告)日：2018-07-12
申请号：US15835399
申请日：2017-12-07
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
CPC classification number: H01J37/222 , G01N23/04 , G05B19/41875 , G05B2219/32186 , G05B2219/32196 , H01J37/28 , H01J2237/22 , H01J2237/2817 , H01L21/67288
Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
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公开(公告)号：US09582869B2
公开(公告)日：2017-02-28
申请号：US14614202
申请日：2015-02-04
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Vidyasagar Anantha
CPC classification number: G06T7/0004 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8854 , G06K9/00 , G06K9/52 , G06K9/6255 , G06T7/001 , G06T2207/30148
Abstract: Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected.
Abstract translation: 提供了用于生成晶片缺陷样品的方法和系统。 一种方法包括将在晶片上检测到的缺陷分离成具有缺陷的一个或多个第一属性的第一组的值的多样性的箱。 该方法还包括基于缺陷的一个或多个第二属性的第二组中的多样性来独立于从一个或多个箱中选择箱内的缺陷。 然后使用所选择的缺陷来为晶片创建缺陷样品。 以这种方式，可以容易地选择具有多个属性的不同值的缺陷。
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公开(公告)号：US09518934B2
公开(公告)日：2016-12-13
申请号：US14931226
申请日：2015-11-03
Applicant: KLA-Tencor Corporation
Inventor： Hong Chen , Kenong Wu , Martin Plihal , Vidur Pandita , Ravikumar Sanapala , Vivek Bhagat , Rahul Lakhawat , Oksen Baris , Rajesh Ramachandran , Naoshin Haque
CPC classification number: H01J37/28 , G01N21/8851 , G01N21/9501 , G01N2021/8854 , G01N2021/8883 , G03F7/70625 , G03F7/7065 , H01J2237/24592
Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。
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Patent Agency Ranking
公开(公告)号：US20160258879A1
公开(公告)日：2016-09-08
申请号：US15058115
申请日：2016-03-01
Applicant: KLA-Tencor Corporation
Inventor： Ardis Liang , Martin Plihal , Raghav Babulnath , Sankar Venkataraman
CPC classification number: G01N21/8806 , G01N21/9501 , G01N23/20008 , G01N2021/8809 , G01N2201/061 , G01N2201/0683
Abstract: Methods and systems for generating inspection results for a specimen with an adaptive nuisance filter are provided. One method includes selecting a portion of events detected during inspection of a specimen having values for at least one feature of the events that are closer to at least one value of at least one parameter of the nuisance filter than the values for at least one feature of another portion of the events. The method also includes acquiring output of an output acquisition subsystem for the sample of events, classifying the events in the sample based on the acquired output, and determining if one or more parameters of the nuisance filter should be modified based on results of the classifying. The nuisance filter or the modified nuisance filter can then be applied to results of the inspection of the specimen to generate final inspection results for the specimen.
Abstract translation: 提供了一种用于产生具有自适应扰动滤波器的样本检测结果的方法和系统。 一种方法包括选择在样本检查期间检测到的事件的一部分，该样本具有关于事件的至少一个特征的值，该值至少与有害过滤器的至少一个参数的值相比， 另一部分事件。 该方法还包括获取用于事件采样的输出采集子系统的输出，基于所获取的输出对样本中的事件进行分类，以及基于分类结果确定是否应该修改妨扰滤波器的一个或多个参数。 然后可以将妨扰过滤器或修改后的滋扰过滤器应用于样品的检查结果，以产生样品的最终检验结果。
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公开(公告)号：US20160110857A1
公开(公告)日：2016-04-21
申请号：US14614202
申请日：2015-02-04
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Vidyasagar Anantha
IPC: G06T7/00 , G01N21/956 , G06K9/52 , G01N21/95
CPC classification number: G06T7/0004 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8854 , G06K9/00 , G06K9/52 , G06K9/6255 , G06T7/001 , G06T2207/30148
Abstract: Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected.
Abstract translation: 提供了用于生成晶片缺陷样品的方法和系统。 一种方法包括将在晶片上检测到的缺陷分离成具有缺陷的一个或多个第一属性的第一组的值的多样性的箱。 该方法还包括基于缺陷的一个或多个第二属性的第二组中的多样性来独立于从一个或多个箱中选择箱内的缺陷。 然后使用所选择的缺陷来为晶片创建缺陷样品。 以这种方式，可以容易地选择具有多个属性的不同值的缺陷。
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公开(公告)号：US08948494B2
公开(公告)日：2015-02-03
申请号：US13793709
申请日：2013-03-11
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Vidyasagar Anantha , Saravanan Paramasivam , Chris W. Lee
CPC classification number: G06T7/0008 , F04C2270/0421 , G06T5/50 , G06T7/0004 , G06T2207/30148
Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.
Abstract translation: 提供了用于产生无偏置晶片缺陷样品的方法和系统。 一种方法包括选择通过在一个或多个缺陷属性中具有最多分集的晶片上执行的多次扫描中检测到的缺陷，从而跨越每个扫描选择不同的缺陷集。 此外，该方法可以包括选择缺陷，使得两个或更多个扫描选择并且是共同的任何缺陷不被选择两次，并且所选择的任何缺陷相对于共同的所选择的缺陷是多种多样的。 此外，在选择缺陷之前，可以不进行采样，分类或缺陷分类，以便通过任何采样，合并或分类方法对采样缺陷进行不偏见。
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公开(公告)号：US11119060B2
公开(公告)日：2021-09-14
申请号：US15904379
申请日：2018-02-25
Applicant: KLA-TENCOR CORPORATION
Inventor： Jagdish Chandra Saraswatula , Martin Plihal
IPC: G01N23/2251 , H01J37/28 , G06T7/00 , G03F7/20
Abstract: Defect location accuracy can be increased using shape based grouping with pattern-based defect centering. Design based grouping of defects on a wafer can be performed. A spatial distribution of the defects around at least one structure on the wafer, such as a predicted hot spot, can be determined. At least one design based defect property for a location around the structure can be determined. The defects within an x-direction threshold and a y-direction threshold of the structure may be prioritized.
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公开(公告)号：US20200126212A1
公开(公告)日：2020-04-23
申请号：US16364161
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Martin Plihal , Santosh Bhattacharyya , Gordon Rouse , Chris Maher , Erfan Soltanmohammadi
IPC: G06T7/00 , H01L21/66 , G06T7/11 , G01R31/308 , G03F7/20
Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.
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