PROCESSING DEVICE, MEASUREMENT DEVICE, AND MEASUREMENT METHOD

    公开(公告)号:US20230120069A1

    公开(公告)日:2023-04-20

    申请号:US17688940

    申请日:2022-03-08

    IPC分类号: G06T7/70

    摘要: According to one embodiment, a processing device includes an acquisition part, and a processor. The acquisition part and the processor are configured to perform a first operation. The acquisition part is configured to acquire first image data, second image data, and third image data in the first operation. The first image data includes data related to a first object member image of an object member transmitting a first light. The second image data includes data related to a second object member image of the object member transmitting a second light. The third image data includes data related to a third object member image of the object member transmitting a third light. The processor is configured to derive first derived data based on the first, second, and third image data in the first operation.

    SURFACE-EMITTING SEMICONDUCTOR LIGHT-EMITTING DEVICE

    公开(公告)号:US20230070461A1

    公开(公告)日:2023-03-09

    申请号:US17653366

    申请日:2022-03-03

    摘要: A surface-emitting semiconductor light-emitting device includes a semiconductor substrate; a first semiconductor layer on a front surface of the semiconductor substrate, an active layer on the first semiconductor layer; a photonic crystal layer on the active layer, a second semiconductor layer on the photonic crystal layer, a first electrode on the second semiconductor layer; and a second electrode on a back surface of the semiconductor substrate. The photonic crystal layer includes a plurality of protrusions arranged along an upper surface of the active layer. The second electrode includes a planar contact portion contacting the back surface of the semiconductor substrate, and at least one fine wire contact portion extending into a surface-emitting region in the back surface of the semiconductor substrate. The light radiated from the active layer is externally emitted from the surface-emitting region. The fine wire contact portion is arranged in the surface-emitting region with rotationally asymmetric.

    OPTICAL INSPECTION METHOD, NON-TRANSITORY STORAGE MEDIUM STORING OPTICAL INSPECTION PROGRAM, AND OPTICAL INSPECTION APPARATUS

    公开(公告)号:US20230066704A1

    公开(公告)日:2023-03-02

    申请号:US17681396

    申请日:2022-02-25

    IPC分类号: G01N21/88

    摘要: According to the embodiment, an optical inspection method includes: emitting, acquiring, and comparing. The emitting includes emitting light beams having a first wavelength and a second wavelength toward an imaging unit in accordance with light beam directions from a subject, with light beam intensities of the first wavelength and the second wavelength being in a complementary relationship. The acquiring includes acquiring each of information of a first image related to the first wavelength and information of a second image related to the second wavelength with the imaging unit. The comparing includes comparing the information of the first image and the information of the second image to extract unevenness information of the subject.

    APPARATUS FOR INSPECTING OBJECT SURFACE

    公开(公告)号:US20210041372A1

    公开(公告)日:2021-02-11

    申请号:US17079668

    申请日:2020-10-26

    IPC分类号: G01N21/88 G01N21/47

    摘要: An apparatus for inspecting object surface according to an embodiment includes: an imaging device including an imaging area; an optical source; and a group of optical devices including a mirror and a lens, and causing a reflected light other than a regular reflection light from an object to be reflected by a mirror surface of the mirror, and to form an image in the imaging area of the imaging device through the lens, the regular reflection light being caused by a light incident to a surface of the object from the optical source, wherein the optical source, the mirror, the lens, and the imaging device are arranged in such a manner that the regular reflection light is not incident to the imaging area of the imaging device through the mirror and the lens.

    OPTICAL INSPECTION METHOD, NON-TRANSITORY STORAGE MEDIUM STORING OPTICAL INSPECTION PROGRAM, PROCESSING DEVICE, AND OPTICAL INSPECTION APPARATUS

    公开(公告)号:US20230304929A1

    公开(公告)日:2023-09-28

    申请号:US17823957

    申请日:2022-09-01

    IPC分类号: G01N21/47 G01N21/27 G01N21/25

    摘要: According to the embodiment, an optical inspection method includes: acquiring an image by capturing the image, using light from a surface of an object, which passes through a wavelength selection portion configured to selectively pass light components of a plurality of predetermined wavelengths different from each other, the image sensor including color channels configured to discriminately receive the light components of the plurality of predetermined wavelengths, performing color count estimation processing configured to estimate the number of colors based on the intensity ratio of the color channels that have received the light in each pixel of the image, and performing scattered light distribution identification processing configured to identify a scattered light distribution as BRDF from the surface of the object based on the number of colors or surface state identification processing configured to identify a state of the surface of the object based on the number of colors.

    OPTICAL MACHINING APPARATUS
    10.
    发明申请

    公开(公告)号:US20220080528A1

    公开(公告)日:2022-03-17

    申请号:US17185929

    申请日:2021-02-25

    发明人: Hiroshi OHNO

    IPC分类号: B23K26/36 B23K26/06

    摘要: According to one embodiment, an optical machining apparatus includes a first light source, and a second light source. The first light source is configured to radiate a first beam onto a first position of a surface of a work in such a manner as to transfer heat at a temperature lower than a melting temperature of the work from the first position of the work to a second position of a surface of the work on an opposite side to the first position. The second light source is configured to radiate a second beam onto the second position such that a temperature of the work exceeds the melting temperature of the work, in a state in which a temperature of the second position is raised by the transfer of the heat.