Abstract:
A thin film device and a method of providing thermal assistance therein is disclosed. Accordingly, a heater material is utilized to thermally assist in the operation of the thin film device. By utilizing a heater material to thermally assist in the operation of the thin film device, a substantial improvement in the accuracy and performance of the thin film device is achieved. A first aspect of the present invention is a thin film device. The thin film device includes at least one patterned thin film layer, a heater material coupled to the at least one patterned thin film layer for providing thermal assistance to the at least one of the patterned thin film layers and a conductor coupled to the heater material for supplying energy to the heater material.
Abstract:
A thin film device and a method of providing thermal assistance therein is disclosed. Accordingly, a heater material is utilized to thermally assist in the operation of the thin film device. By utilizing a heater material to thermally assist in the operation of the thin film device, a substantial improvement in the accuracy and performance of the thin film device is achieved. A first aspect of the present invention is a thin film device. The thin film device includes at least one patterned thin film layer, a heater material coupled to the at least one patterned thin film layer for providing thermal assistance to the at least one of the patterned thin film layers and a conductor coupled to the heater material for supplying energy to the heater material.
Abstract:
This invention provides a controlled temperature, thermal-assisted magnetic memory device. In a particular embodiment, there is an array of SVM cells, each characterized by an alterable orientation of magnetization and including a material wherein the coercivity is decreased upon an increase in temperature. In addition, at least one reference SVM (RSVM) cell substantially similar to and in close proximity to the SVM cells of the array is provided. A provided feedback control temperature controller receives a feedback voltage from the reference SVM cell, corresponding to temperature, and adjusts power applied to the RSVM cell and SVM cell. An associated method of use is further provided.
Abstract:
An information storage device is provided. The information storage device may be a magnetic random access memory (MRAM) device including a resistive cross point array of spin dependent tunneling (SDT) junctions or magnetic memory elements, with word lines extending along rows of the SDT junctions and bit lines extending along the columns of the SDT junctions. The present design includes a plurality of heating elements connected in series with associated magnetic memory elements, each heating element comprising a diode. Voltage applied to a magnetic memory element and associated heating element causes reverse current to flow through the diode, thereby producing heat from the diode and heating the magnetic memory element, thereby facilitating the write function of the device.
Abstract:
A magnetic memory cell write current threshold detector. The magnetic memory cell write current threshold detector includes a first MRAM test cell receiving a write current and sensing when the write current exceeds a first threshold, and a second MRAM test cell receiving the write current and sensing when the write current exceeds a second threshold.
Abstract:
A list sort static random access memory (LSSRAM) unit cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data and a dynamic/static (D/S) mode selector to selectably switch the LSSRAM unit cell between a dynamic storage mode and a static storage mode. The LSSRAM unit cell further includes a swap selector to swap the stored data with data stored in an adjacent memory cell during the dynamic storage mode when the swap selector is activated, and a data comparator to compare the stored data in the SRAM cell with the data stored in the adjacent memory cell and to activate the swap selector according to a result of the comparison.
Abstract:
A multi-plane circuit structure has at least a first circuit plane and a second circuit plane, and each circuit plane has a plurality of row wire segments, a plurality of column wire segments, and a plurality of crosspoint devices formed at intersections of the row wire segments and the column wire segments. The row and column wire segments have a segment length for forming a preselected number of crosspoint devices thereon. Each row wire segment in the second circuit plane is connected to a row wire segment in the first circuit plane with no offset in a row direction and in a column direction, and each column wire segment in the second circuit plane is connected to a column wire segment in the first circuit plane with an offset length in both the row direction and the column direction. The offset length corresponds to half of the preselected number of crosspoint devices.
Abstract:
A metal-insulator transition switching device includes a first electrode and a second electrode. A channel region which includes a bulk metal-insulator transition material separates the first electrode and the second electrode. A method for forming a metal-insulator transition switching device includes depositing a layer of bulk metal-insulator transition material in between a first electrode and a second electrode to form a channel region and forming a gate electrode operatively connected to the channel region.
Abstract:
A method for reading a memory element within a crossbar array, the method including selecting a column line connected to a target memory element of the crossbar array by applying a supply voltage to a source follower, a gate terminal of the source follower connected to the column line; applying bias voltages to row lines of the crossbar array; storing an output voltage of the source follower in a storage element; applying a sense voltage to a row line connected to the target memory element; and outputting a difference between the voltage stored in the storage element and an output voltage of the source follower while the sense voltage is applied to the row line.
Abstract:
A memory device includes a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, a second layer of MRAM memory cells that is fabricated over the first layer of MRAM memory cells, and a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device. The method of fabricating the memory device includes fabricating a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, fabricating a second layer of MRAM memory cells over the first layer of MRAM memory cells, and fabricating a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device.