公开(公告)号：US08277613B2

公开(公告)日：2012-10-02

申请号：US12690144

申请日：2010-01-20

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: D21F11/00

CPC classification number: B32B29/02 ,  B32B29/06 ,  B32B2255/12 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/54 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2554/00 ,  B32B2581/00 ,  D21H13/44 ,  D21H17/67 ,  D21H17/69 ,  D21H19/64 ,  D21H21/54 ,  Y10T428/24793 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/2475 ,  Y10T442/2992

Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

Abstract translation: 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，​​并且高导热性材料覆盖主体基质表面的15-55％。 多个表面，包括我有图案的子层。

公开(公告)号：US07851059B2

公开(公告)日：2010-12-14

申请号：US11529453

申请日：2006-09-28

Applicant: Gary Stevens ,  James D. B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D. B. Smith ,  John W. Wood

IPC: B32B5/16 ,  B32B27/38 ,  B32B29/00

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

公开(公告)号：US07955661B2

公开(公告)日：2011-06-07

申请号：US11656727

申请日：2007-01-23

Applicant: Gary Stevens ,  James D. B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D. B. Smith ,  John W. Wood

IPC: B05D3/00 ,  B05D3/12

CPC classification number: D21H25/005 ,  D21H13/44 ,  D21H17/13 ,  D21H17/20 ,  D21H27/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249953

Abstract: A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.

Abstract translation: 一种用于处理云母纸内的微孔的方法，包括：获得分子量介于约15和300之间的硅烷，将硅烷加入到云母纸中，并使硅烷与微孔的内表面反应， 云母纸。 此后，将树脂浸渍到云母纸中，并且树脂通过硅烷与云母纸结合到微孔的内表面。 在一个实施例中，云母纸被压缩其原始厚度的5％至30％之间的量。 在另一个实施方案中，云母纸在硅烷反应之前和在树脂浸渍期间被压缩。

公开(公告)号：US07776392B2

公开(公告)日：2010-08-17

申请号：US11396990

申请日：2006-04-03

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: B05D1/36

CPC classification number: B32B29/02 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B27/20 ,  B32B2255/04 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2581/00 ,  B32B2605/00 ,  H01B3/004

Abstract: In one embodiment of the present invention as used for impregnating a composite tape (56) with HTC particles provides for permeating a fabric layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (51). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer (52) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Abstract translation: 在本发明的一个实施方案中，用于浸渍具有HTC颗粒的复合带（56）提供用HTC颗粒渗透复合带的织物层（51）并通过织物层将浸渍树脂浸渍到复合带中 51）。 渗透到织物层中的至少5％的HTC颗粒由织物层进入并通过浸渍树脂进入与织物层结合的云母层（52）中。 在一些实施方案中，浸渍树脂本身含有HTC颗粒。

公开(公告)号：US20100213413A1

公开(公告)日：2010-08-26

申请号：US12779380

申请日：2010-05-13

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: C09K19/00 ,  C08L63/00 ,  B05D1/36

CPC classification number: C08L101/00 ,  B32B17/04 ,  B32B19/02 ,  B32B19/06 ,  B32B2250/02 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2457/04 ,  C09D201/00 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50 ,  C08L2666/14

Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.

Abstract translation: 本发明提供了一种树脂混合物，其包含高度结构化的树脂40和较少结构的树脂50.高度结构化的树脂40和较少结构的树脂50以1:9至4:1的比例混合， 更特定的比例为1:5至3:1。 高度结构化的树脂形成有序的微区域，并且有序的微区域对周围较少结构化的树脂分子施加秩序。 微区本质上是HS树脂的组成，其自然形成顺序结构。

公开(公告)号：US20100120928A1

公开(公告)日：2010-05-13

申请号：US12695279

申请日：2010-01-28

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: C08J9/00 ,  C08L63/00 ,  C08K9/00

CPC classification number: C08G59/4085 ,  C08L63/00 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/249959 ,  Y10T428/26

Abstract: In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix 32 with a first class of grafted 31 high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted 30 high thermal conductivity particles that are not directly grafted the host resin matrix 32. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

Abstract translation: 在一个应用中，混合物接枝和非接枝发明提供了高导热性树脂，其包含具有接枝到主体树脂基质上的第一类接枝31高导热性颗粒的主体树脂基质32。 还有第二类非接枝的30高导热性颗粒，其不直接接枝主体树脂基质32.第一类和第二类包含约2-60体积％的高导热性树脂。 第一类接枝颗粒和第二类非接枝颗粒是高热导率填料，长度为1-1000nm，纵横比在3-100之间。

公开(公告)号：US07651963B2

公开(公告)日：2010-01-26

申请号：US11396999

申请日：2006-04-03

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: B32B5/22 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B17/02 ,  B32B17/06

CPC classification number: B32B29/02 ,  B32B29/06 ,  B32B2255/12 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/54 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2554/00 ,  B32B2581/00 ,  D21H13/44 ,  D21H17/67 ,  D21H17/69 ,  D21H19/64 ,  D21H21/54 ,  Y10T428/24793 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/2475 ,  Y10T442/2992

Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.

Abstract translation: 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，​​并且高导热性材料覆盖主体基质表面的15-55％。 包括子层的多个表面可以具有图案化。

公开(公告)号：US07592045B2

公开(公告)日：2009-09-22

申请号：US11397000

申请日：2006-04-03

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: B05D5/00

CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，其包括将HTC种子42加入到主体树脂基质中。 HTC种子已经被表面官能化以基本上不相互反应。 然后，种子积聚HTC构件块42，并且HTC构建块也被表面功能化以基本上不相互反应。 然后将HTC构建块与HTC种子组装，以在主体树脂基质内产生HTC树枝状填料40。

公开(公告)号：US08383007B2

公开(公告)日：2013-02-26

申请号：US12779380

申请日：2010-05-13

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: C09K19/52 ,  C09K19/54 ,  C09K19/34 ,  B05D1/36 ,  H01L23/34

CPC classification number: C08L101/00 ,  B32B17/04 ,  B32B19/02 ,  B32B19/06 ,  B32B2250/02 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2457/04 ,  C09D201/00 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50 ,  C08L2666/14

Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.

Abstract translation: 本发明提供了一种树脂混合物，其包含高度结构化的树脂40和较少结构的树脂50.高度结构化的树脂40和较少结构的树脂50以1:9至4:1的比例混合， 更特定的比例为1:5至3:1。 高度结构化的树脂形成有序的微区域，并且有序的微区域对周围较少结构化的树脂分子施加秩序。 微区本质上是HS树脂的组成，其自然形成顺序结构。

公开(公告)号：US07781057B2

公开(公告)日：2010-08-24

申请号：US11396988

申请日：2006-04-03

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: B32B7/12 ,  H01L23/34

CPC classification number: C08L101/00 ,  B32B17/04 ,  B32B19/02 ,  B32B19/06 ,  B32B2250/02 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2457/04 ,  C09D201/00 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50 ,  C08L2666/14

Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.

Abstract translation: 本发明提供了一种树脂混合物，其包含高度结构化的树脂40和较少结构的树脂50.高度结构化的树脂40和较少结构的树脂50以1:9至4:1的比例混合， 更特定的比例为1:5至3:1。 高度结构化的树脂形成有序的微区域，并且有序的微区域对周围较少结构化的树脂分子施加秩序。 微区本质上是HS树脂的组成，其自然形成顺序结构。