Invention Grant
- Patent Title: Treatment of micropores in mica materials
- Patent Title (中): 云母材料微孔的处理
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Application No.: US11656727Application Date: 2007-01-23
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Publication No.: US07955661B2Publication Date: 2011-06-07
- Inventor: Gary Stevens , James D. B. Smith , John W. Wood
- Applicant: Gary Stevens , James D. B. Smith , John W. Wood
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B05D3/00
- IPC: B05D3/00 ; B05D3/12

Abstract:
A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.
Public/Granted literature
- US20070114704A1 Treatment of micropores in mica materials Public/Granted day:2007-05-24
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