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公开(公告)号：US08277613B2
公开(公告)日：2012-10-02
申请号：US12690144
申请日：2010-01-20
Applicant: James D. B. Smith , Gary Stevens , John W. Wood
Inventor： James D. B. Smith , Gary Stevens , John W. Wood
IPC: D21F11/00
CPC classification number: B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
Abstract translation: 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，并且高导热性材料覆盖主体基质表面的15-55％。 多个表面，包括我有图案的子层。
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公开(公告)号：US07851059B2
公开(公告)日：2010-12-14
申请号：US11529453
申请日：2006-09-28
Applicant: Gary Stevens , James D. B. Smith , John W. Wood
Inventor： Gary Stevens , James D. B. Smith , John W. Wood
CPC classification number: H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
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公开(公告)号：US06989173B2
公开(公告)日：2006-01-24
申请号：US10661689
申请日：2003-09-12
Applicant: James D. B. Smith , F. Tim Emery
Inventor： James D. B. Smith , F. Tim Emery
CPC classification number: C08L63/00 , B82Y30/00 , C08G59/4215 , C08J5/005 , C08J2363/00 , C08K3/346 , H01F41/122
Abstract: The present invention comprises a polymeric epoxy patching resin containing metal intercalated AlSiO structures. The AlSiO structures are typically nanoclays, and the preferred metals are Cr, Sn and Zn, and mixtures thereof. The patching resin is applied to damaged mica tapes, where the metal intercalated nanoclays penetrate the damaged area, leaving a homogenous patch. The present invention may also be used to thicken an area of insulating tape.
Abstract translation: 本发明包括含有金属插层AlSiO结构的聚合物环氧树脂修补树脂。 AlSiO结构通常是纳米粘土，优选的金属是Cr，Sn和Zn及其混合物。 修补树脂应用于损坏的云母带，其中金属插层纳米粘土穿透损坏的区域，留下均匀的贴片。 本发明也可以用于增厚绝缘带的面积。
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4.发明授权Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers 有权从热固性环氧树脂和导电填料制造正温度系数导电聚合物的方法公开(公告)号：US06375867B1
公开(公告)日：2002-04-23
申请号：US09543469
申请日：2000-04-05
Applicant: James D. B. Smith , Karl F. Schoch, Jr.
Inventor： James D. B. Smith , Karl F. Schoch, Jr.
IPC: C08L6300
Abstract: A process for making an improved current limiting composition comprising mixing an epoxy thermosetting resin containing more than one 1,2 epoxy groups per molecule with an acid anhydride curing agent, an epoxy reactive diluent, first and second co-accelerators and conductive additive particles to form a liquid mixture. The liquid mixture is heated at a first temperature range below gelation temperature while drawing a vacuum to drive off volatiles and gases. Continued heating at a second temperature range promotes gelation and heating a third temperature range effects a final cure. A first co-accelerator becomes effective during the gelation temperature range and a second co-accelerator does not become effective until the final cure temperature range. Gelation takes about 2 to 4 hours at about 130° C. to 140° C. and final cure takes about 13 to 18 hours at about 140° C. to 160° C. The epoxy resin is preferably a diglycidyl ether of bisphenol A, the epoxy reactive diluent is preferably a diglycidyl ether of neopentyl glycol, the acid anhydride hardener is preferably 1-methyl tetrahydrophthalic anhydride and the conductive additive particles are selected from the group consisting of carbon black, nickel fiber, nickel flake, nickel beads and copper flake. An effective amount of said alumina trihydrate is employed in the mixture to prevent dielectric breakdown, arcing and carbon tracking under high voltage conditions in current limiting compositions. The first co-accelerator is 1-methyl imidazole and the second co-accelerator is chromium acetylacetonate.
Abstract translation: 一种制备改进的限流组合物的方法，包括将每分子含有多于一个1,2-环氧基的环氧热固性树脂与酸酐固化剂，环氧反应性稀释剂，第一和第二共同加速剂和导电添加剂颗粒混合以形成 液体混合物。 将液体混合物在低于凝胶化温度的第一温度范围内加热，同时抽真空以驱除挥发物和气体。 继续加热在第二温度范围促进凝胶化和加热第三温度范围实现最终固化。 第一共同促进剂在凝胶化温度范围内变得有效，而第二共促进剂直到最终固化温度范围才有效。 胶凝在约130℃至140℃下需要约2至4小时，最终固化在约140℃至160℃下约13至18小时。环氧树脂优选为双酚A的二缩水甘油醚， 环氧反应性稀释剂优选为新戊二醇的二缩水甘油醚，酸酐硬化剂优选为1-甲基四氢邻苯二甲酸酐，导电性添加剂粒子选自碳黑，镍纤维，镍片，镍珠，铜片 。 在混合物中使用有效量的所述三水合氧化铝以防止在限流组合物中的高电压条件下的电介质击穿，起弧和碳追踪。 第一共同促进剂是1-甲基咪唑，第二共促进剂是乙酰丙酮铬。
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公开(公告)号：US5904984A
公开(公告)日：1999-05-18
申请号：US734375
申请日：1996-10-17
Applicant: James D. B. Smith , Karl F. Schoch, Jr. , Wei-Fang A. Su
Inventor： James D. B. Smith , Karl F. Schoch, Jr. , Wei-Fang A. Su
CPC classification number: C09K19/388 , C08G59/22 , H01B3/40 , Y10T428/2971 , Y10T428/31525
Abstract: Liquid crystal thermoset epoxy resin is used as an electrical insulator on electrical conducting devices such as coils and transformers. The linear epoxy/mesogen/epoxy molecule of the liquid crystal thermoset epoxy resin results in a electrical insulator with a high degree of crystallinity. This results in an electrical insulator with mechanical and electrical properties suitable for use in high temperature, high stress environments.
Abstract translation: 液晶热固性环氧树脂用作诸如线圈和变压器的导电装置上的电绝缘体。 液晶热固性环氧树脂的线性环氧/介晶/环氧分子产生具有高结晶度的电绝缘体。 这导致具有适于在高温，高应力环境中使用的机械和电气性质的电绝缘体。
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Patent Agency Ranking
公开(公告)号：US5294310A
公开(公告)日：1994-03-15
申请号：US913658
申请日：1992-07-16
Applicant: James D. B. Smith , Karl F. Schoch, Jr. , David C. Grant
Inventor： James D. B. Smith , Karl F. Schoch, Jr. , David C. Grant
CPC classification number: C02F1/463 , C02F2101/327 , C02F2101/34
Abstract: Surfactants in an aqueous solution is recovered from polychlorinated biphenyls and other aromatic organic compounds contaminating the solution. An electrical current is passed through a surfactant-containing aqueous solution contaminated with a colloidal dispersion of organic compounds at a voltage sufficient to electrochemically breakup the dispersion without polymerizing the surfactant. The contaminating aromatic organic compounds are then separated from the surfactant-containing aqueous solution. The separated surfactant-containing aqueous solution may be recirculated to a waste treatment process for cleaning additional organic compounds from contaminated equipment.
Abstract translation: 从多氯联苯和其他污染溶液的芳族有机化合物中回收水溶液中的表面活性剂。 电流通过含有表面活性剂的水溶液，该水溶液以足以电化学分解分散体的电压而不会使表面活性剂聚合而被有机化合物的胶态分散体污染。 然后将污染的芳族有机化合物与含表面活性剂的水溶液分离。 分离的含表面活性剂的水溶液可以再循环到废物处理过程中，以从污染的设备中清除附加的有机化合物。
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公开(公告)号：US4474688A
公开(公告)日：1984-10-02
申请号：US264316
申请日：1981-05-18
Applicant: Peter M. Castle , James D. B. Smith , D. Colin Phillips
Inventor： Peter M. Castle , James D. B. Smith , D. Colin Phillips
CPC classification number: G21F9/167
Abstract: A method is disclosed of immobilizing actinide metal oxide ions. A liquid composition is prepared of the actinide metal oxide ions and a monomer which is capable during electropolymerization of complexing with the actinide metal ions. An optional polar solvent may be included in the composition if it is necessary to dissolve a solid monomer. The monomer is then electropolymerized to form a polymeric complex with the actinide metal oxide ion. The polymeric complex can be separated from the remainder of the liquid composition by the addition of a non-solvent for the polymeric complex which results in its precipitation. Vinylimidazoles have been found to be suitable monomers for use in this process.
Abstract translation: 公开了固定锕系金属氧化物离子的方法。 制备锕系金属氧化物离子的液体组合物和在与锕系金属离子络合的电聚合期间能够进行的单体。 如果需要溶解固体单体，则可以在组合物中包含任选的极性溶剂。 然后将单体电聚合以与锕系金属氧化物离子形成聚合物络合物。 聚合物配合物可以通过加入聚合物配合物的非溶剂而与液体组合物的其余部分分离，导致其沉淀。 已经发现乙烯基咪唑是用于该方法的合适的单体。
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公开(公告)号：US4246161A
公开(公告)日：1981-01-20
申请号：US64934
申请日：1979-08-08
Applicant: James D. B. Smith , Robert N. Kauffman
Inventor： James D. B. Smith , Robert N. Kauffman
CPC classification number: H02K3/30 , C08G59/68 , C08G59/70 , H01B3/40 , H01F27/323 , H01F27/327
Abstract: A highly fluid, solventless, resinous, impregnating and coating composition, suitable as a high voltage insulation for electrical members, is made from an admixture containing: 100 parts of an epoxy resin, about 25 to 200 parts of an acid anhydride reactive with the epoxy resin, and about 0.002 to 1.00 part of a selected metal carbonyl, acting as a latent accelerator.
Abstract translation: 适用于电气部件的高压绝缘的高流动性，无溶剂，树脂，浸渍和涂料组合物由含有100份环氧树脂的混合物制成，约25至200份与环氧树脂反应的酸酐 和约0.002至1.00份选择的羰基金属，用作潜在促进剂。
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公开(公告)号：US4241101A
公开(公告)日：1980-12-23
申请号：US39919
申请日：1979-05-17
Applicant: Howard E. Saunders , James D. B. Smith
Inventor： Howard E. Saunders , James D. B. Smith
CPC classification number: C08G59/4223 , C08G59/68 , C09D163/00 , H01B13/065 , H01B3/40
Abstract: A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70.degree., a solid polyanhydride curing agent at least about 50 mole % of which is trimellitic anhydride, and a cross-linking agent having the general formula R.sub.3 SnX where each R is selected from alkyl, aryl, aralkyl, and alkaryl up to C.sub.20 and X is selected from acetate, propionate, butyrate, halogen, and hydroxyl. The composition is dry-blended and then melt-mixed at 50.degree. to 150.degree. C. To prepare the coating powder, it is then cooled, crushed, and ground to a particle size of less than 100 microns. The coating powder is electrostatically applied to a conductor and is cured above the melting point of the resin.
Abstract translation: 公开了一种涂料粉末，其由环氧当量为约400至约8000，杜兰软化点至少为70的固体环氧树脂的无溶剂非水组合物制备，固体聚酐固化剂至少约 50摩尔％的偏苯三酸酐和具有通式R3SnX的交联剂，其中每个R选自烷基，芳基，芳烷基和烷芳基，直到C20，X选自乙酸酯，丙酸酯，丁酸酯，卤素， 和羟基。 将组合物干混，然后在50℃至150℃下熔融混合。为了制备涂层粉末，将其冷却，粉碎并研磨至小于100微米的粒度。 将涂层粉末静电施加到导体上，并在树脂的熔点之上固化。
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公开(公告)号：US4239802A
公开(公告)日：1980-12-16
申请号：US7051
申请日：1979-01-29
Applicant: James D. B. Smith , Robert N. Kauffman
Inventor： James D. B. Smith , Robert N. Kauffman
CPC classification number: H01B3/04 , H01B3/30 , H02K15/12 , H02K3/34 , Y10T428/2936 , Y10T428/294 , Y10T428/31656 , Y10T428/31692
Abstract: Anaerobic resins are cured in a gaseous atmosphere which does not contain oxygen. An insulated conductor is placed in a vacuum and is impregnated with an anaerobic resin under pressure. The conductor is then placed in a non-oxygen containing atmosphere, such as nitrogen, which cures the resin.
Abstract translation: 厌氧树脂在不含氧的气态气氛中固化。 将绝缘导体放置在真空中并在压力下用厌氧树脂浸渍。 然后将导体放置在固化树脂的非含氧气氛中，例如氮气。
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