Abstract:
A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.
Abstract:
The present disclosure provides heat-curable coating compositions for optical articles. The coating compositions include a multifunctional epoxy monomer in combination with a UV absorber. The inclusion of at least one multifunctional epoxy monomer and at least one UV absorber provide epoxy coatings that exhibit excellent adhesion on a variety of lens substrates.
Abstract:
The disclosure is directed to the use of dynamic cross-linked polymer compositions in soldering applications. Workpieces comprising a solder bonded to at least one component comprising a dynamic cross-linked polymer composition are also described.
Abstract:
An optical waveguide photosensitive resin composition containing an aliphatic resin having a polymerizable substituent and a photopolymerization initiator, in which the aliphatic resin having the polymerizable substituent is formed of a side-chain polyfunctional aliphatic resin (A) and a bifunctional long-chain aliphatic resin (B), is provided. Accordingly, the composition brings together high transparency, satisfactory roll-to-roll compatibility, and a high resolution patterning property, and has excellent reflow resistance. Therefore, the composition is useful as a material for forming an optical waveguide, especially a core layer-forming material.
Abstract:
A highly thermal-conductive and thermal-resistant electrically insulated coil with less outflow of a thermosetting resin composition can be produced, to provide a small-scale, light-weight rotating machine with high power. The thermosetting resin composition comprises (a) a polyfunctional epoxy resin containing three or more p-(2,3-epoxypropoxy) phenyl groups and a group represented by the Chemical formula 1; or an epoxy resin with a naphthalene backbone, represented by the Chemical formula 3, 4 or 5 or an epoxy resin with an anthracene backbone, such as diglycidyl ether of anthracene diol and triglycidyl ether of anthracene triol; (b) a bifunctional epoxy resin containing two p-(2,3-epoxypropoxy) phenyl groups; (c) an acid anhydride curing agent; and (d) a metal acetonate curing catalyst represented by the Chemical formula 2 at 0.1 to 5 parts by weight per 100 parts by weight of the epoxy resins.
Abstract:
The invention relates to a curable coating composition comprising: (a) a hydroxyl-containing polyester resin having a solubility parameter in the range of 10.0 to 12.0, (b) a polyepoxide, (c) a silicon compound having 1 to 20 silicon atoms in one molecule and represented by the rational formula SiO.sub.(4-(a+b))/2 (OR.sup.1).sub.a (OR.sup.2).sub.b (1) wherein R.sup.1 is an alkyl group having 1 to 3 carbon atoms, or a hydrogen atom, R.sup.2 is an aryl group, an aralkyl group, or a monovalent hydrocarbon group containing an ether linkage and/or ester linkage and having 4 to 24 carbon atoms, a represents a number between 0.10 to 3.95 and b represents a number between 0.05 and 1.95, provided that a+b=4 or less, (d) at least one chelate compound selected from the group consisting of aluminum chelate compounds, titanium chelate compounds, zirconium chelate compounds and tin chelate compounds, and (e) an organic solvent.
Abstract translation:本发明涉及一种可固化涂料组合物,其包含:(a)溶解度参数在10.0至12.0范围内的含羟基的聚酯树脂,(b)聚环氧化物,(c)具有1至20个硅原子的硅化合物 一个分子,由合理的式(4-(a + b))/ 2(OR1)a(OR2)b(1)表示,其中R1是具有1至3个碳原子的烷基或氢原子,R2是 芳基,芳烷基或含有醚键和/或酯键并具有4〜24个碳原子的一价烃基,a表示0.10〜3.95的数,b表示0.05〜1.95的数,条件是 a + b = 4以下,(d)至少一种选自铝螯合化合物,钛螯合物,锆螯合物和锡螯合物的螯合物,和(e)有机溶剂。
Abstract:
Curable mixtures comprising(a) an epoxy compound having on average more than one epoxy group per molecule,(b) a metal complex salt of formula IM(L).sub.a X'.sub.b X".sub.c .cndot.dY (I), whereinM is a cation of a transition metal,L is a Lewis base,a is a number from 2 to 6,X' is an anion of an acid radical,X" is an cation of an acid radical differing from X'b is 0 or a number which, together with the number c, which is greater than 0, corresponds to the valency of the cation of the transition metal,Y is a solvent molecule, andd is 0 or a number from 0 to 5, and,as optional component(c) a hardener for epoxy resins,are distinguished by good solubility of the metal salt in the epoxy resin and achieve uniform crosslinking during the curing of the epoxy resin.
Abstract:
A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.
Abstract:
Improved double metal cyanide catalysts are disclosed. The substantially amorphous catalysts of the invention are more active for polymerizing epoxides than conventional DMC catalysts, which have a substantial crystalline component. Polyol products made with the catalysts are unusually clear, have exceptionally low unsaturations, and contain no detectable amount of low molecular weight polyol impurities. A method of making the improved DMC catalysts, which involves intimately combining the reactants, is also disclosed.
Abstract:
A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.