摘要:
The present invention provides a high-speed memory device that can be easily tested using the existing low-speed Automatic Test Equipment (ATE). In an embodiment of the invention, a memory device includes two channels. During normal communications with a host, one channel is used for bi-directional communications with a host. But during a test mode, a first channel is used to communicate with the ATE in one direction, and a second channel is used to communicate with the ATE in the opposite direction. The present invention also provides a memory module and a method for controlling the high-speed memory device.
摘要:
A multi-chip package memory includes an interface chip generating at least one reference signal defined in relation to a reference process variation, and a stacked plurality of memory chips electrically connected to the interface chip via a vertical connection path and receiving the reference clock signal via the vertical connection path, wherein each one of the stacked plurality of memory chips is characterized by a process variation and actively compensates for said process variation in relation to the reference signal.
摘要:
Provided is a memory system and a method that can initialize a data channel at a high speed without the need to increase the number of pins in a semiconductor memory device, and not requiring a circuit to perform an initialization. The memory system includes a memory module equipped with a plurality of semiconductor memory devices; a memory controller controlling the semiconductor memory devices; and a data channel and a command/address channel connected between the plurality of semiconductor memory devices and the memory controller, wherein read latencies and write latencies of the plurality of semiconductor memory devices are controlled by the memory controller.
摘要:
Provided is a memory system for seamless switching. The memory system includes first through mth chips, where m is a natural number, connected in the form of a daisy chain and configured to transmit at least one of signals and data, a (k−1)th chip of the first through mth chips, where k is a natural number and 2≦k≦m, configured to output a (k−1)th detection signal corresponding to a phase difference between (k−1)th test data of the (k−1)th chip and kth test data of a kth chip of the first through mth chips, and the kth chip including a clock phase control unit configured to control a phase of a received clock signal and to output the phase-controlled clock signal as a kth clock signal, where the clock phase control unit of the kth chip outputs the kth clock signal in response to the (k−1)th detection signal.
摘要:
A stacked memory apparatus operating with a compound read buffer is disclosed. The stacked memory apparatus includes an interface device having a main buffer and a plurality of memory devices each having a device read buffer. Systems incorporating one or more stacked memory apparatuses and related method of performing a read operation are also disclosed.
摘要:
A semiconductor memory device, having a test mode and a normal mode, includes a frequency multiplier and a test command sequence generator. The frequency multiplier receives a test clock signal in the test mode and generates multiple internal test clock signals, each of which has a frequency equal to a frequency of an operation clock signal in the normal mode. The test clock signal has a frequency lower than the frequency of the operation clock signal. The test command sequence generator generates at least one command signal in response to the internal test clock signals in the test mode. The at least one command signal corresponds to at least one operation timing parameter of the semiconductor memory device that is to be measured. The frequency multiplier may include a Phase Locked Loop (PLL) or a Delay Locked Loop (DLL).
摘要:
Provided is a memory system for seamless switching. The memory system includes first through mth chips, where m is a natural number, connected in the form of a daisy chain and configured to transmit at least one of signals and data, a (k−1)th chip of the first through mth chips, where k is a natural number and 2≦k≦m, configured to output a (k−1)th detection signal corresponding to a phase difference between (k−1)th test data of the (k−1)th chip and kth test data of a kth chip of the first through mth chips, and the kth chip including a clock phase control unit configured to control a phase of a received clock signal and to output the phase-controlled clock signal as a kth clock signal, where the clock phase control unit of the kth chip outputs the kth clock signal in response to the (k−1)th detection signal.
摘要翻译:提供了一种用于无缝切换的存储器系统。 存储器系统包括第一至第m个芯片,其中m是自然数,以菊链的形式连接并被配置为传输信号和数据中的至少一个,第一至第m个芯片的第(k-1)个芯片 ,其中k是自然数,2 <= k <= m,被配置为输出与第(k-1)次的第(k-1)个测试数据之间的相位差相对应的第(k-1) 芯片和第k个测试数据,第k个芯片包括时钟相位控制单元,其被配置为控制接收的时钟信号的相位,并输出相位控制的时钟信号作为第k个时钟信号 ,其中第k个芯片的时钟相位控制单元响应于第(k-1)个检测信号输出第k个时钟信号。
摘要:
In a communication system, data is selectively transmitted using single-ended or differential signaling. The data is transmitted in relation to a plurality of clock signals having different relative phases. When the data is transmitted using single-ended signaling, data on adjacent signal lines undergo logic transitions at different times in relation to the plurality of clock signals.
摘要:
A stacked memory apparatus operating with a compound read buffer is disclosed. The stacked memory apparatus includes an interface device having a main buffer and a plurality of memory devices each having a device read buffer. Systems incorporating one or more stacked memory apparatuses and related method of performing a read operation are also disclosed.
摘要:
The invention relates generally to a multi-chip package (MCP) memory device, and more particularly, but without limitation, to a MCP memory device having a reduced size. In one embodiment, the MCP memory device includes: a transfer memory chip; and a plurality of memory chips coupled to the transfer memory chip, each of the plurality of memory chips including an internal voltage generating circuit, the transfer memory chip configured to receive a plurality of command signals from outside the MCP memory device, the transfer memory chip further configured to output a plurality of control signals to the plurality of memory chips based on the plurality of command signals. Embodiments of the invention also relate to a method of controlling an internal voltage of the MCP memory device.