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    Method for producing substrate with metal body
    4.
    发明授权
    Method for producing substrate with metal body 有权
    用金属体制造衬底的方法

    公开(公告)号：US09150962B2

    公开(公告)日：2015-10-06

    申请号：US14159444

    申请日：2014-01-21

    申请人： JSR Corporation

    发明人： Tatsuya Sakai ,  Hideki Nishimura ,  Masahiro Yamamoto ,  Hisashi Nakagawa ,  Ryuuichi Saitou ,  Hideyuki Aoki ,  Tsuyoshi Furukawa

    IPC分类号： C23C16/06 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/768 ,  C23C16/18

    CPC分类号： C23C16/06 ,  C23C16/18 ,  H01L21/28556 ,  H01L21/32051 ,  H01L21/76843 ,  H01L21/76877

    摘要： Provided is a method for producing a substrate with a metal body. This method provides excellent film-forming properties (reflectance and adhesion), is easy to be used on a large substrate, and can be carried out at a low cost. The method includes the steps of: (A) heating a complex to a first temperature so as to generate a vapor of the complex; and (B) contacting the vapor with a substrate heated to a second temperature that is not higher than the first temperature so as to form a metal body containing a central metal of the complex, either in uncombined form or as a compound thereof (exclusive of the complex), on at least part of a surface of the substrate. The second temperature in step (B) is lower than the decomposition temperature of the complex. The central metal of the complex is aluminum or titanium.

    摘要翻译： 提供一种用金属体制造衬底的方法。 该方法提供优异的成膜性（反射率和粘合性），易于在大的基板上使用，并且可以以低成本进行。 该方法包括以下步骤：（A）将络合物加热至第一温度以产生复合物的蒸气; 和（B）使蒸气与加热到不高于第一温度的第二温度的基底接触，以形成含有复合体的中心金属的金属体，或者以未组合的形式或作为其化合物（不包括 该复合物）在基材的表面的至少一部分上。 步骤（B）中的第二温度低于络合物的分解温度。 复合体的中心金属是铝或钛。

    Pattern-forming method
    6.
    发明授权
    Pattern-forming method 有权

    公开(公告)号：US10520815B2

    公开(公告)日：2019-12-31

    申请号：US15460503

    申请日：2017-03-16

    申请人： JSR CORPORATION

    发明人： Takehiko Naruoka ,  Tomohisa Fujisawa ,  Motohiro Shiratani ,  Hisashi Nakagawa

    IPC分类号： G03F7/004 ,  G03F7/30 ,  G03F7/20 ,  G03F7/038 ,  G03F7/16 ,  G03F7/32 ,  H01L21/027

    摘要： A pattern-forming method includes applying a radiation-sensitive composition on a substrate to provide a film on the substrate. The film is exposed. The film exposed is developed. The radiation-sensitive composition includes a metal-containing component that is a metal compound having a hydrolyzable group, a hydrolysis product of the metal compound having a hydrolyzable group, a hydrolytic condensation product of the metal compound having a hydrolyzable group, or a combination thereof. A content of a transition metal atom in the metal-containing component with respect to total metal atoms in the metal-containing component is no less than 50 atomic %.

    Chemically amplified resist material and resist pattern-forming method
    7.
    发明授权
    Chemically amplified resist material and resist pattern-forming method 有权

    公开(公告)号：US10120282B2

    公开(公告)日：2018-11-06

    申请号：US15259200

    申请日：2016-09-08

    申请人： JSR CORPORATION

    发明人： Hisashi Nakagawa ,  Takehiko Naruoka ,  Tomoki Nagai

    IPC分类号： G03F7/004 ,  G03F7/38 ,  C08F220/24 ,  G03F7/039 ,  G03F7/20 ,  G03F7/32 ,  C08F220/38 ,  C08F228/02

    摘要： A chemically amplified resist material comprises: a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid; and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The polymer component comprises: a first polymer comprising a first structural unit that comprises a fluorine atom and does not comprise a salt structure; or a second polymer comprising a second structural unit that comprises a fluorine atom and a salt structure. The generative component comprises: a radiation-sensitive acid-and-sensitizer generating agent; any two of the radiation-sensitive acid-and-sensitizer generating agent, a radiation-sensitive sensitizer generating agent and a radiation-sensitive acid generating agent; or the radiation-sensitive acid-and-sensitizer generating agent, the radiation-sensitive sensitizer generating agent and the radiation-sensitive acid generating agent.