Abstract:
A stack of a gate dielectric layer and a workfunction material layer are deposited over a plurality of semiconductor material portions, which can be a plurality of semiconductor fins or a plurality of active regions in a semiconductor substrate. A first gate conductor material applying a first stress is formed on a first portion of the workfunction material layer located on a first semiconductor material portion, and a second gate conductor material applying a second stress is formed on a second portion of the workfunction material layer located on a second semiconductor material portion. The first and second stresses are different in at least one of polarity and magnitude, thereby inducing different strains in the first and second portions of the workfunction material layer. The different strains cause the workfunction shift differently in the first and second portions of the workfunction material layer, thereby providing devices having multiple different workfunctions.
Abstract:
Embodiments of the present disclosure provide an integrated circuit (IC) structure, which can include: a doped semiconductor layer having a substantially uniform doping profile; a first gate structure positioned on the doped semiconductor layer; and a second gate structure positioned on the doped semiconductor layer, the second gate structure including a metal-insulator transition material and a gate dielectric layer separating the metal-insulator transition material from the doped semiconductor layer.
Abstract:
A method including installing solar pods at varying heights on a tower, where a size of each of the solar pods is inversely related its installation height on the tower, each of the solar pods including a transparent ovoid enclosure symmetrical about an axis, and a reflector and a solar cell both contained within the transparent ovoid enclosure, the solar cell positioned at a common focal point of the reflector such that substantially all light reflected by the reflector is directed at the solar cell.
Abstract:
Some embodiments of the present invention may include one, or more, of the following features, characteristics or advantages: (i) latch device including multiple Ecrit material regions all electrically connected to a common terminal (sometimes structured and shaped in the form of a storage plate conductor); (ii) bi-stable three-terminal latch device using two Ecrit property regions; (iii) three-terminal, two-Ecrit-region latch device where, for each Ecrit region, (Vdd−Vss) divided by (region thickness, dn) is greater than the region's Ecrit value; or (iv) use of multiple Ecrit material region latch devices to provide data storage instrumentality in a static memory device.
Abstract:
A device that includes a semiconductor device and a contact electrode with a first side that is opposite a second side. The first side abuts the semiconductor device. The contact electrode has a stoichiometry that varies from the first side to the second side. The stoichiometry of the first side inhibits the diffusion of metal from the semiconductor device into the first contact electrode.
Abstract:
Embodiments of the present disclosure provide an integrated circuit (IC) structure, which can include: a doped semiconductor layer having a substantially uniform doping profile; a first gate structure positioned on the doped semiconductor layer; and a second gate structure positioned on the doped semiconductor layer, the second gate structure including a metal-insulator transition material and a gate dielectric layer separating the metal-insulator transition material from the doped semiconductor layer.