公开(公告)号：US10424534B2

公开(公告)日：2019-09-24

申请号：US15584491

申请日：2017-05-02

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

公开(公告)号：US20210313294A1

公开(公告)日：2021-10-07

申请号：US17210693

申请日：2021-03-24

申请人： Infineon Technologies AG

发明人： Chau Fatt Chiang ,  Xavier Arokiasamy ,  Naveendran Chellamuthu ,  Chee Chiew Chong ,  Joo Ming Goa ,  Chee Hong Lee ,  Muhammat Sanusi Muhammad ,  Chee Voon Tan ,  Wee Boon Tay

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/495

摘要： A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.

公开(公告)号：US20170250125A1

公开(公告)日：2017-08-31

申请号：US15584491

申请日：2017-05-02

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

公开(公告)号：US20200294896A1

公开(公告)日：2020-09-17

申请号：US16351211

申请日：2019-03-12

申请人： Infineon Technologies AG

发明人： Arivindran Navaretnasinggam ,  Xavier Arokiasamy ,  Thomas Bemmerl ,  Ke Yan Tean

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00

摘要： A packaged semiconductor device includes a die paddle, a semiconductor die mounted on the die paddle, a plurality of fused leads extending away from a first side of the die paddle, a discrete lead that extends away from the first side of the die paddle and is physically detached from the plurality of fused leads, a first electrical connection between a first terminal of the semiconductor die and the discrete lead, an encapsulation material that encapsulates the semiconductor die, and a stabilizer bar connected to a first outer edge side of the discrete lead. The first outer edge side of the discrete lead is opposite from a second outer edge side of the discrete lead which faces the plurality of fused leads.

公开(公告)号：US09640465B2

公开(公告)日：2017-05-02

申请号：US14729672

申请日：2015-06-03

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

CPC分类号： H01L23/49513 ,  H01L21/4825 ,  H01L21/50 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/84 ,  H01L2224/03849 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40108 ,  H01L2224/40111 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/72 ,  H01L2224/80815 ,  H01L2224/84011 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

公开(公告)号：US20160358843A1

公开(公告)日：2016-12-08

申请号：US14729672

申请日：2015-06-03

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/48

CPC分类号： H01L23/49513 ,  H01L21/4825 ,  H01L21/50 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/84 ,  H01L2224/03849 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40108 ,  H01L2224/40111 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/72 ,  H01L2224/80815 ,  H01L2224/84011 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

摘要翻译： 半导体器件包括引线框架，引线框架包括管芯焊盘和引线，半导体芯片和夹子。 半导体芯片具有与第一侧相对的第一侧和第二侧。 第一侧附接到管芯焊盘，第二侧包括第一接合焊盘和第二接合焊盘。 夹子将第一接合焊盘电连接到引线。 夹子在与第二接合焊盘相邻的第一接合焊盘的第一边缘部分处接触第一接合焊盘，并且在第一接合焊盘的中心部分和夹子之间限定第一空腔。 焊料在第一腔内，以将夹子电耦合到第一接合焊盘。 半导体器件包括到第一腔的第一开口，以在回流焊接期间将通量从第二接合焊盘引出。

公开(公告)号：US09245837B1

公开(公告)日：2016-01-26

申请号：US14324349

申请日：2014-07-07

申请人： Infineon Technologies AG

发明人： Eljurey Azcarraga Fajardo ,  Siti Maznah Abdul Rahim ,  Victor dela cruz Del Rosario ,  Xavier Arokiasamy ,  Vittal Raja Manikam

IPC分类号： H01L25/00 ,  H01L23/498 ,  B23K31/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/49838 ,  B23K31/02 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.

摘要翻译： 电子射频功率器件包括晶体管芯片，器件输入端子和器件输出端子。 此外，电子RF功率器件包括输出阻抗变换电路，接合到晶体管芯片和输出器件端子的输出接触夹以及键合到输出阻抗变换电路和晶体管芯片的至少一个接合引线。

公开(公告)号：US20160005687A1

公开(公告)日：2016-01-07

申请号：US14324349

申请日：2014-07-07

申请人： Infineon Technologies AG

发明人： Eljurey Azcarraga Fajardo ,  Siti Maznah Abdul Rahim ,  Victor dela cruz Del Rosario ,  Xavier Arokiasamy ,  Vittal Raja Manikam

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  B23K31/02 ,  H01L23/00

CPC分类号： H01L23/49838 ,  B23K31/02 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.

摘要翻译： 电子射频功率器件包括晶体管芯片，器件输入端子和器件输出端子。 此外，电子RF功率器件包括输出阻抗变换电路，接合到晶体管芯片和输出器件端子的输出接触夹以及键合到输出阻抗变换电路和晶体管芯片的至少一个接合引线。