公开(公告)号：US09640465B2

公开(公告)日：2017-05-02

申请号：US14729672

申请日：2015-06-03

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

CPC分类号： H01L23/49513 ,  H01L21/4825 ,  H01L21/50 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/84 ,  H01L2224/03849 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40108 ,  H01L2224/40111 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/72 ,  H01L2224/80815 ,  H01L2224/84011 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

公开(公告)号：US20240355772A1

公开(公告)日：2024-10-24

申请号：US18135828

申请日：2023-04-18

申请人： Infineon Technologies AG

发明人： Suhaimi Azizan ,  Melvin Levardo ,  Milad Mostofizadeh

IPC分类号： H01L23/00 ,  H01L25/07

CPC分类号： H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L25/072 ,  H01L23/3107 ,  H01L2224/37012 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/37664 ,  H01L2224/37669 ,  H01L2224/40101 ,  H01L2224/40111 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/84815 ,  H01L2924/13055 ,  H01L2924/13064 ,  H01L2924/13091

摘要： A electrical connection element includes a planar mating surface adapted for mating with a metal bonding surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.

公开(公告)号：US20160358843A1

公开(公告)日：2016-12-08

申请号：US14729672

申请日：2015-06-03

申请人： Infineon Technologies AG

发明人： Xavier Arokiasamy ,  Chun Ching Liew

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/48

CPC分类号： H01L23/49513 ,  H01L21/4825 ,  H01L21/50 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/84 ,  H01L2224/03849 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40108 ,  H01L2224/40111 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/72 ,  H01L2224/80815 ,  H01L2224/84011 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

摘要翻译： 半导体器件包括引线框架，引线框架包括管芯焊盘和引线，半导体芯片和夹子。 半导体芯片具有与第一侧相对的第一侧和第二侧。 第一侧附接到管芯焊盘，第二侧包括第一接合焊盘和第二接合焊盘。 夹子将第一接合焊盘电连接到引线。 夹子在与第二接合焊盘相邻的第一接合焊盘的第一边缘部分处接触第一接合焊盘，并且在第一接合焊盘的中心部分和夹子之间限定第一空腔。 焊料在第一腔内，以将夹子电耦合到第一接合焊盘。 半导体器件包括到第一腔的第一开口，以在回流焊接期间将通量从第二接合焊盘引出。