专利检索 ap:("Infineon Technologies AG") AND inv:"Naveendran Chellamuthu" 第 1 页

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发明申请
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME 有权

公开(公告)号：US20210313294A1

公开(公告)日：2021-10-07

申请号：US17210693

申请日：2021-03-24

申请人： Infineon Technologies AG

发明人： Chau Fatt Chiang , Xavier Arokiasamy , Naveendran Chellamuthu , Chee Chiew Chong , Joo Ming Goa , Chee Hong Lee , Muhammat Sanusi Muhammad , Chee Voon Tan , Wee Boon Tay

IPC分类号： H01L23/00 , H01L21/48 , H01L23/495

摘要： A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.