公开(公告)号：US09754834B2

公开(公告)日：2017-09-05

申请号：US15254454

申请日：2016-09-01

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/46 ,  H01L21/78 ,  H01L21/301 ,  H01L21/44 ,  H01L21/50 ,  H01L21/48 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  B23K101/40 ,  B23K103/16 ,  B23K103/00

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.

公开(公告)号：US09263419B2

公开(公告)日：2016-02-16

申请号：US14015148

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim

IPC: H01L21/66 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/89 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/157 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame strip includes connected unit lead frames each having a die paddle, a tie bar directly connecting the die paddle to a periphery of the unit lead frame, leads directly connected to the periphery of the unit lead frame and projecting toward the die paddle, and an opening in the periphery adjacent the tie bar. The openings in the periphery of the unit lead frames are spanned with an electrically insulating material that connects the tie bar of each unit lead frame to the periphery of the unit lead frame. The direct connections between the tie bars and the periphery of the unit lead frames are severed prior to subsequent processing, so that the tie bars remain connected to the periphery of the unit lead frames by the electrically insulating material and the die paddles are electrically disconnected from the periphery of the unit lead frames.

Abstract translation: 引线框架条包括连接的单元引线框架，每个引线框架都具有管芯焊盘，将管芯焊盘直接连接到单元引线框架的外围的引导杆直接连接到单元引线框架的周边并朝向管芯焊盘突出， 以及在连接杆附近的周边的开口。 单元引线框架周边的开口用电绝缘材料跨接，每个单元引线框架的连接杆连接到单元引线框架的外围。 在后续处理之前，连接杆和单元引线框架的周边之间的直接连接被切断，使得连接杆通过电绝缘材料保持连接到单元引线框架的外围，并且管芯焊盘与电绝缘材料电连接 单元引线框的周边。

公开(公告)号：US20160372374A1

公开(公告)日：2016-12-22

申请号：US15254454

申请日：2016-09-01

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/78 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯连接到每个管芯焊盘上，在将半导体管芯安装到管芯焊盘上之后，单元引线框架被模制化合物覆盖，并且激光束被引导到每个单元引线框架的周边区域 引线被定位，从而在每个单元引线框架的外围形成间隔开的切口。 间隔开的切口从每个单元引线框架的周边切断引线，并且在引线位于周边的区域中至少部分地延伸到模制化合物中，使得模制化合物在间隔开的切口之间保持完整。

公开(公告)号：US09437458B2

公开(公告)日：2016-09-06

申请号：US14077742

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/304 ,  H01L21/00 ,  H01L21/02 ,  H01L21/78 ,  H01L21/301 ,  H01L21/48 ,  B23K26/36 ,  B23K26/40 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 通过在将半导体管芯附接到管芯焊盘上之后，通过将半导体管芯附接到每个管芯焊盘并且用模制化合物覆盖单元引线框架来处理引线框架条。 在每个单元引线框架的周边形成间隔开的切口，其从每个单元引线框架的周边切断引线，并且在引线所在的周边的区域中至少部分地延伸到模制化合物中，使得模制化合物保持 切割之间完好无损。 在形成切口之后处理引线框条，然后将单元引线框架分离成单个封装。

公开(公告)号：US20160005663A1

公开(公告)日：2016-01-07

申请号：US14324295

申请日：2014-07-07

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim ,  Tian San Tan

IPC: H01L21/66 ,  H01L21/78

CPC classification number: H01L22/14 ,  H01L21/78 ,  H01L22/32 ,  H01L2224/97

Abstract: A leadframe strip includes a plurality of unit leadframes connected to a periphery of the leadframe strip, each unit leadframe having a die paddle, a plurality of leads and a semiconductor die attached to the die paddle. The leadframe strip is tested by electrically isolating at least the leads from the periphery of the leadframe strip such that at least some of the leads extend uninterrupted beyond a final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The semiconductor dies are tested, which includes probing the die paddles and the leads that extend uninterrupted beyond the final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The unit leadframes are severed from the leadframe strip along the final lead outline of the unit leadframes after testing the semiconductor dies.

Abstract translation: 引线框条包括连接到引线框带的周边的多个单元引线框架，每个单元引线框架具有管芯焊盘，多个引线和连接到管芯焊盘的半导体管芯。 引线框条通过至少将引线与引线框带的周边电隔离来进行测试，使得至少一些引线在与引线框带的外围电隔离之后不间断地延伸超出单元引线框架的最终引线轮廓。 测试半导体管芯，其包括在与引线框架条的周边电绝缘之后探测管芯焊盘和引线，其延伸不间断地超过单元引线框架的最终引线轮廓。 在测试半导体裸片之后，单元引线框架沿引线框架沿着单元引线框架的最终引线轮廓被切断。

公开(公告)号：US10041973B2

公开(公告)日：2018-08-07

申请号：US14017358

申请日：2013-09-04

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Horst Groeninger

IPC: H01L21/68 ,  G01R1/04 ,  H01L23/00

Abstract: A semiconductor device is aligned by placing the semiconductor device in a nest between first and second sections of the nest when the nest is in a receiving position in which the first and second sections are spaced further apart from one another than when the nest is in an aligning position. The nest is moved from the receiving position to the aligning position with the semiconductor device in the nest so that the first and second sections are spaced closer to one another and align the semiconductor device in the nest. The semiconductor device is removed from the nest after the semiconductor device is aligned.

公开(公告)号：US09594111B2

公开(公告)日：2017-03-14

申请号：US13779544

申请日：2013-02-27

Applicant: Infineon Technologies AG

Inventor： Theng Chao Long ,  Nee Wan Khoo

IPC: G01R31/26 ,  G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/26 ,  G01R31/28 ,  G01R31/2893

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

Abstract translation: 在一个实施例中，测试半导体部件的方法包括将多个半导体部件加载到转台处理器的主转台中，使用主转台将多个半导体部件传送到测试区域，并将多个半导体部件分成 第一组和第二组。 该方法还包括使用测试仪在第一测试垫中测试第一组中的第一半导体组件，同时将第二组中的第二半导体组件传输到第二测试焊盘，并使用测试仪测试第二半导体组件，同时传送第一半导体 组件出第一个测试板。 第一组和第二组被合并到多个半导体部件中，并且使用主转台将多个半导体部件从测试区域运送出去。

公开(公告)号：US09252063B2

公开(公告)日：2016-02-02

申请号：US14324295

申请日：2014-07-07

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim ,  Tian San Tan

IPC: H01L21/44 ,  H01L21/46 ,  H01L21/66 ,  H01L21/78

CPC classification number: H01L22/14 ,  H01L21/78 ,  H01L22/32 ,  H01L2224/97

Abstract: A leadframe strip includes a plurality of unit leadframes connected to a periphery of the leadframe strip, each unit leadframe having a die paddle, a plurality of leads and a semiconductor die attached to the die paddle. The leadframe strip is tested by electrically isolating at least the leads from the periphery of the leadframe strip such that at least some of the leads extend uninterrupted beyond a final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The semiconductor dies are tested, which includes probing the die paddles and the leads that extend uninterrupted beyond the final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The unit leadframes are severed from the leadframe strip along the final lead outline of the unit leadframes after testing the semiconductor dies.

Abstract translation: 引线框条包括连接到引线框带的周边的多个单元引线框架，每个单元引线框架具有管芯焊盘，多个引线和连接到管芯焊盘的半导体管芯。 引线框条通过至少将引线与引线框带的周边电隔离来进行测试，使得至少一些引线在与引线框带的外围电绝缘之后不间断延伸超过单元引线框架的最终引线轮廓。 测试半导体管芯，其包括在与引线框架条的周边电绝缘之后探测管芯焊盘和引线，其延伸不间断地超过单元引线框架的最终引线轮廓。 在测试半导体裸片之后，单元引线框架沿引线框架沿着单元引线框架的最终引线轮廓被切断。

公开(公告)号：US20150132868A1

公开(公告)日：2015-05-14

申请号：US14077742

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/48 ,  H01L21/66

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 通过在将半导体管芯附接到管芯焊盘上之后，通过将半导体管芯附接到每个管芯焊盘并且用模制化合物覆盖单元引线框架来处理引线框架条。 在每个单元引线框架的周边形成间隔开的切口，其从每个单元引线框架的周边切断引线，并且在引线所在的周边的区域中至少部分地延伸到模制化合物中，使得模制化合物保持 切割之间完好无损。 在形成切口之后处理引线框条，然后将单元引线框架分离成单个封装。

公开(公告)号：US20240302426A1

公开(公告)日：2024-09-12

申请号：US18119076

申请日：2023-03-08

Applicant: Infineon Technologies AG

Inventor： Soon Lai Kho ,  Nee Wan Khoo

IPC: G01R31/26

CPC classification number: G01R31/2601

Abstract: A method includes providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body, providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.