Invention Application
- Patent Title: Method of Electrically Isolating Leads of a Lead Frame Strip
- Patent Title (中): 电线隔离引线框架带的方法
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Application No.: US14077742Application Date: 2013-11-12
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Publication No.: US20150132868A1Publication Date: 2015-05-14
- Inventor: Nee Wan Khoo , Vigneswaran Letcheemana
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/66
Abstract:
A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages.
Public/Granted literature
- US09437458B2 Method of electrically isolating leads of a lead frame strip Public/Granted day:2016-09-06
Information query
IPC分类:
