Abstract:
A III-V semiconductor device is disclosed, which includes an emitter region, an emitter barrier region having such a barrier height as to substantially restrict a thermionic emission current as compared with a tunneling current and such a barrier width as to permit the tunneling current, a base region containing indium and having higher electron affinity than said emitter region and a collector barrier region having such a barrier height as to substantially prohibit a thermally distributed electron from overflowing and such a barrier width as to substantially prohibit the tunneling current.
Abstract:
A method for vapor deposition includes monitoring of growth of a semiconductor layer by way of in-situ monitoring. According to the invention, in-situ monitoring is performed by irradiating a light beam onto the surface of the growing layer in a direction nearly perpendicular to the surface. Growth parameters of the layer are detected by monitoring variation of the light reflected by the surface of the layer. A growth condition in a vapor deposition chamber is feedback controlled based on the detected growth parameter.
Abstract:
A semiconductor device or a hot electron transistor being constructed such that an InAs base layer is sandwiched between a GaSb emitter barrier layer and a GaInAsSb-system collector barrier layer, which results in preventing hot electrons of unnecessarily high energy from being injected into the collector and an avalanche current from being generated, thereby making it possible to improve the saturation characteristics of the device.
Abstract:
A semiconductor device includes an emitter layer: a base layer; and a collector layer, wherein the collector layer and the emitter layer each include a heavily doped thin sublayer having a high impurity concentration, and each of the heavily doped thin sublayers has an impurity concentration higher than those of semiconductor layers adjacent to each heavily doped thin sublayer.
Abstract:
A heterojunction bipolar transistor (HBT) with improved characteristics is provided. A III–V compound semiconductor having Bi added thereto is used for a base layer of a GaAs-based or InP-based HBT. For example, a GaAs-based HBT is formed by successively stacking a subcollector layer made of n+-GaAs, a collector layer made of n−-GaAs, a base layer made of p+-GaAsBi, an emitter layer made of n-InGaP, a first cap layer made of n-GaAs, and a second cap layer made of n+-InGaAs on a substrate 1 made of single crystal GaAs.
Abstract:
A semiconductor device includes an emitter layer: a base layer; and a collector layer, wherein the collector layer and the emitter layer each include a heavily doped thin sublayer having a high impurity concentration, and each of the heavily doped thin sublayers has an impurity concentration higher than those of semiconductor layers adjacent to each heavily doped thin sublayer.
Abstract:
A heterojunction bipolar transistor (HBT) with improved characteristics is provided. A III-V compound semiconductor having Bi added thereto is used for a base layer of a GaAs-based or InP-based HBT. For example, a GaAs-based HBT is formed by successively stacking a subcollector layer made of n+-GaAs, a collector layer made of n−-GaAs, a base layer made of p+-GaAsBi, an emitter layer made of n-InGaP, a first cap layer made of n-GaAs, and a second cap layer made of n+-InGaAs on a substrate 1 made of single crystal GaAs.
Abstract:
A heterojunction bipolar transistor (HBT) with improved characteristics is provided. A III-V compound semiconductor having Bi added thereto is used for a base layer of a GaAs-based or InP-based HBT. For example, a GaAs-based HBT is formed by successively stacking a subcollector layer made of n+-GaAs, a collector layer made of n—GaAs, a base layer made of p+-GaAsBi, an emitter layer made of n-InGaP, a first cap layer made of n-GaAs, and a second cap layer made of n+-InGaAs on a substrate 1 made of single crystal GaAs.
Abstract:
A semiconductor device having a heterojunction bipolar transistor capable of suppressing the deterioration of basic transistor characteristics, such as a decline of an injection efficiency from an emitter layer to a base layer due to the rising of emitter resistance, a decline of breakdown strength between the base layer and a collector layer, or a decline of reliability due to an introduction of a defect; configured to comprise a heterojunction bipolar transistor having an emitter layer, base layer and a collector layer, wherein an electron affinity of the base layer is smaller than that of the emitter layer and that of the collector layer, an interlayer is formed at least either between the emitter layer and the base layer or between the base layer and the collector layer, and the electron affinity of the interlayer has a value between the electron affinities of the two layers sandwiching the interlayer.
Abstract:
There is provided a semiconductor device capable of ensuring a complete enhancement-mode operation and realizing a power transistor excellent in the low-distortion, high-efficiency performance. On a surface of a substrate (1) composed of single crystal GaAs, a second barrier layer (3) composed of AlGaAs, a channel layer (4) composed of InGaAs, a third barrier layer (12) composed of InGaP and a first barrier layer (11) composed of AlGaAs are stacked in this order, while placing in between a buffer layer (2). Relation of χ1−χ3≦0.5*(Eg3-Eg1), where χ1 is electron affinity of the first barrier layer (11), Eg1 is a band gap of the same, χ3 is electron affinity of the third barrier layer (12), and Eg3 is a band gap of the same, is satisfied between the first barrier layer (11) and the third barrier layer (12).
Abstract translation:提供了能够确保完全增强模式操作并实现低失真,高效率性能优异的功率晶体管的半导体器件。 在由单晶GaAs构成的基板(1)的表面上,由AlGaAs构成的第二势垒层(3),由InGaAs构成的沟道层(4),由InGaP构成的第三势垒层(12) 依次层叠由AlGaAs构成的层(11),同时放置在缓冲层(2)之间。 i chi chi chi chi chi chi chi chi chi chi chi chi chi where <<<<<< 1是第一阻挡层(11)的电子亲和力,Eg 1是与之相同的带隙,chi 3是电子亲和力 在第一阻挡层(11)和第三阻挡层(12)之间,满足第三阻挡层(12)和第三阻挡层(12)和其间的带隙。