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公开(公告)号：US10959339B2
公开(公告)日：2021-03-23
申请号：US15871595
申请日：2018-01-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. Chamberlin , Andreas Huber , Harald Huels , Thomas-Michael Winkel
Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.
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公开(公告)号：US09398702B2
公开(公告)日：2016-07-19
申请号：US14282095
申请日：2014-05-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. Chamberlin , Andreas Huber , Harald Huels , Thomas-Michael Winkel
CPC classification number: H05K3/3494 , B23K1/0016 , B23K11/002 , H05K1/111 , H05K1/115 , H05K3/3421 , H05K2203/1115 , H05K2203/163 , Y10T29/49124 , Y10T29/49126 , Y10T29/53174
Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path.
Abstract translation: 制造产品，其中所述产品包括第一部分和第二部分，其中所述第一部分包括焊接引脚，并且所述第二部分包括焊料焊盘，其中每个所述焊接引脚具有匹配的焊盘，其中每个所述焊盘为 被匹配的焊膏珠覆盖。 将焊料对准焊盘，使焊锡销和匹配的焊锡焊盘通过匹配的焊膏珠热电连接。 将配合连接器连接到第一部件，其中配合连接器可操作以提供导电路径的一部分。 通过电阻加热来加热至少一个焊膏珠，其中电阻加热由流过导电路径的电流产生。
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公开(公告)号：US10734317B2
公开(公告)日：2020-08-04
申请号：US16438736
申请日：2019-06-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Andreas Huber , Harald Huels , Stefano S. Oggioni , Thomas Strach , Thomas-Michael Winkel
IPC: H01L23/49 , H01L23/498 , H01L25/065 , H01L25/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/18 , H05K3/34 , H05K3/46
Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
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公开(公告)号：US10149388B2
公开(公告)日：2018-12-04
申请号：US15175378
申请日：2016-06-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. Chamberlin , Andreas Huber , Harald Huels , Thomas Strach , Thomas-Michael Winkel
IPC: H05K1/18 , H05K3/34 , H05K3/00 , B23K1/00 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/46 , H05K1/16 , H05K3/42
Abstract: A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.
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公开(公告)号：US09980385B2
公开(公告)日：2018-05-22
申请号：US15494672
申请日：2017-04-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Andreas Huber , Harald Huels , Stefano S. Oggioni , Thomas Strach , Thomas-Michael Winkel
CPC classification number: H05K1/183 , H01L23/49838 , H01L25/0657 , H01L25/50 , H01L2225/06537 , H01L2225/06548 , H05K1/0219 , H05K1/115 , H05K1/144 , H05K1/181 , H05K3/0097 , H05K3/18 , H05K3/34 , H05K3/4697 , H05K2201/049 , H05K2201/10015 , H05K2201/10106
Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
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Patent Agency Ranking
公开(公告)号：US10354946B2
公开(公告)日：2019-07-16
申请号：US15945913
申请日：2018-04-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Andreas Huber , Harald Huels , Stefano S. Oggioni , Thomas Strach , Thomas-Michael Winkel
IPC: H01L23/49 , H01L23/498 , H01L25/065 , H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/18 , H05K3/34 , H05K3/46 , H01L25/00
Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
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公开(公告)号：US09094306B2
公开(公告)日：2015-07-28
申请号：US13912586
申请日：2013-06-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Martin Eckert , Roland Frech , Claudio Siviero , Jochen Supper , Otto A. Torreiter , Thomas-Michael Winkel
CPC classification number: H04L43/0823 , H04L12/10 , H04L41/065 , H04L41/0677
Abstract: Network power fault detection. At least one first network device is instructed to temporarily disconnect from a power supply path of a network, and at least one characteristic of the power supply path of the network is measured at a second network device connected to the network while the at least one first network device is temporarily disconnected from the network.
Abstract translation: 网络电源故障检测。 指示至少一个第一网络设备临时断开网络的电源路径，并且在连接到网络的第二网络设备处测量网络的电源路径的至少一个特性，而至少一个第一网络设备 网络设备暂时与网络断开连接。
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公开(公告)号：US20190295938A1
公开(公告)日：2019-09-26
申请号：US16438736
申请日：2019-06-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Andreas Huber , Harald Huels , Stefano S. Oggioni , Thomas Strach , Thomas-Michael Winkel
IPC: H01L23/498 , H01L25/065 , H05K1/14 , H05K1/02 , H05K3/46 , H05K3/34 , H05K1/18 , H05K3/00 , H01L25/00 , H05K3/18 , H05K1/11
Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
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公开(公告)号：US20180228028A1
公开(公告)日：2018-08-09
申请号：US15945913
申请日：2018-04-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Andreas Huber , Harald Huels , Stefano S. Oggioni , Thomas Strach , Thomas-Michael Winkel
CPC classification number: H01L23/49838 , H01L25/0657 , H01L25/50 , H01L2225/06537 , H01L2225/06548 , H05K1/0219 , H05K1/115 , H05K1/144 , H05K1/181 , H05K1/183 , H05K3/0097 , H05K3/18 , H05K3/34 , H05K3/4697 , H05K2201/049 , H05K2201/10015 , H05K2201/10106
Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
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公开(公告)号：US10010000B2
公开(公告)日：2018-06-26
申请号：US15158831
申请日：2016-05-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. Chamberlin , Andreas Huber , Harald Huels , Thomas-Michael Winkel
CPC classification number: H05K3/3494 , B23K1/0016 , B23K11/002 , H05K1/111 , H05K1/115 , H05K3/3421 , H05K2203/1115 , H05K2203/163 , Y10T29/49124 , Y10T29/49126 , Y10T29/53174
Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.
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