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公开(公告)号：US20200014171A1
公开(公告)日：2020-01-09
申请号：US16573179
申请日：2019-09-17
IPC分类号： H01S5/022 , H01L23/482 , H01L23/00
摘要： A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
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公开(公告)号：US20160365328A1
公开(公告)日：2016-12-15
申请号：US14736943
申请日：2015-06-11
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065 , H01L21/56
CPC分类号： H01L24/17 , H01L21/563 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/11332 , H01L2224/11442 , H01L2224/11505 , H01L2224/11552 , H01L2224/1181 , H01L2224/11901 , H01L2224/13005 , H01L2224/13017 , H01L2224/13082 , H01L2224/13147 , H01L2224/13184 , H01L2224/14135 , H01L2224/14155 , H01L2224/16059 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17104 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81986 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06568 , H01L2924/20645 , H01L2224/11 , H01L2924/00014 , H01L2924/00012
摘要： Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
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公开(公告)号：US20160126695A1
公开(公告)日：2016-05-05
申请号：US14531291
申请日：2014-11-03
IPC分类号： H01S5/022
CPC分类号： H01S5/02272 , H01L23/4825 , H01L24/06 , H01L24/17 , H01L2224/05573 , H01L2224/05582 , H01L2224/0601 , H01L2224/1403 , H01L2224/1703 , H01L2924/12042 , H01L2924/152
摘要： A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
摘要翻译： 公开了一种用于具有激光芯片附件的晶片的双键焊盘结构和制造方法。 该方法包括在基板的表面上形成接合层。 该方法还包括在接合层上形成焊料凸块。 该方法还包括图案化结合层以形成其中包括其上的焊料凸点的焊盘。 该方法还包括使用形成在激光二极管上的焊料连接将激光二极管附接到选定的焊盘。 该方法还包括将内插衬底附接到形成在接合焊盘上的焊料凸块。
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公开(公告)号：US20190148328A1
公开(公告)日：2019-05-16
申请号：US16250429
申请日：2019-01-17
IPC分类号： H01L23/00 , H01L25/065 , H01L25/00
摘要： Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
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公开(公告)号：US20170125974A1
公开(公告)日：2017-05-04
申请号：US15407515
申请日：2017-01-17
IPC分类号： H01S5/022 , H01L23/00 , H01L23/482
CPC分类号： H01S5/02272 , H01L23/4825 , H01L24/06 , H01L24/17 , H01L2224/05573 , H01L2224/05582 , H01L2224/0601 , H01L2224/1403 , H01L2224/1703 , H01L2924/12042 , H01L2924/152
摘要： A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
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公开(公告)号：US20170125973A1
公开(公告)日：2017-05-04
申请号：US15407498
申请日：2017-01-17
IPC分类号： H01S5/022
摘要： A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
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公开(公告)号：US20160365329A1
公开(公告)日：2016-12-15
申请号：US15083852
申请日：2016-03-29
CPC分类号： H01L24/17 , H01L21/563 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/11332 , H01L2224/11442 , H01L2224/11505 , H01L2224/11552 , H01L2224/1181 , H01L2224/11901 , H01L2224/13005 , H01L2224/13017 , H01L2224/13082 , H01L2224/13147 , H01L2224/13184 , H01L2224/14135 , H01L2224/14155 , H01L2224/16059 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17104 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81986 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06568 , H01L2924/20645 , H01L2224/11 , H01L2924/00014 , H01L2924/00012
摘要： Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
摘要翻译： 公开了烧结连接结构和制造方法。 该方法包括将粉末放置在基底上并烧结粉末以形成多个支柱。 该方法还包括重复放置和烧结步骤，直到多个柱达到预定高度。 该方法还包括在多个柱上形成焊锡帽。 该方法还包括使用焊料盖将基板连接到板上。
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