公开(公告)号：US11961958B2

公开(公告)日：2024-04-16

申请号：US16440961

申请日：2019-06-13

Applicant: International Business Machines Corporation

Inventor： John Collins ,  Bucknell C. Webb ,  Paul S. Andry ,  Teodor Krassimirov Todorov ,  Devendra K. Sadana

IPC: H01M10/0525 ,  C08K3/04 ,  C08K5/315 ,  C08L67/04 ,  C09J179/02 ,  H01M4/02 ,  H01M4/1315 ,  H01M4/505 ,  H01M10/0565

CPC classification number: H01M10/0525 ,  C08K3/04 ,  C08K5/315 ,  C08L67/04 ,  C09J179/02 ,  H01M4/1315 ,  H01M4/505 ,  H01M10/0565 ,  C08K2201/001 ,  C08K2201/005 ,  C08L2203/20 ,  H01M2004/021 ,  H01M2300/0082

Abstract: A composition includes an electrode made of Lithium Manganese Oxyfluoride (LMOF). A single layer separator adheres to a surface of the electrode, is a dielectric that is conductive for Lithium ions but not electrons, and has top and bottom sides. A solid polymer electrolyte (SPE) saturates the electrode so that the LMOF is between 55 percent and 85 percent by mass of a composition of the LMOF electrode and the SPE is between 7.5 percent and 20 percent by mass of the composition of the LMOF electrode. The SPE saturates the separator so that the SPE resides both on the separator top and bottom sides so that the SPE residing on the separator top side contacts the surface. The LMOF exhibits X-Ray Diffraction spectrum peaks between twenty-two and twenty-four 2-theta degrees, between forty-eight and fifty 2-theta degrees, between fifty-four and fifty-six 2-theta degrees, and between fifty-six and fifty-eight 2-theta degrees.

公开(公告)号：US11824037B2

公开(公告)日：2023-11-21

申请号：US17139298

申请日：2020-12-31

Applicant: International Business Machines Corporation

Inventor： Katsuyuki Sakuma ,  Mukta Ghate Farooq ,  Paul S. Andry ,  Russell Kastberg

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/768 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0016 ,  H01L21/76895 ,  H01L2224/81203

Abstract: An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.

公开(公告)号：US11411272B2

公开(公告)日：2022-08-09

申请号：US15811231

申请日：2017-11-13

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Jae-Woong Nah ,  Adinath Narasgond ,  Bucknell C. Webb

IPC: H01M50/10 ,  H01M50/209 ,  H01M6/40 ,  H01M10/04

Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.

公开(公告)号：US11127715B2

公开(公告)日：2021-09-21

申请号：US16238803

申请日：2019-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Mark D. Schultz ,  Cornelia K. Tsang

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/473 ,  H01L23/00 ,  H01L23/48

Abstract: An electrical device that includes at least two active wafers having at least one through silicon via, and at least one unitary electrical communication and spacer structure present between a set of adjacently stacked active wafers of the at least two active wafers. The unitary electrical communication and spacer structure including an electrically conductive material core providing electrical communication to the at least one through silicon via structure in the set of adjacently stacked active wafers and a substrate material outer layer. The at least one unitary electrical communication and spacer structure being separate from and engaged to the adjacently stacked active wafers, wherein coolant passages are defined between surfaces of the adjacently stacked active wafers and the at least one unitary electrical communication and spacer structure.

公开(公告)号：US10679887B2

公开(公告)日：2020-06-09

申请号：US15935537

申请日：2018-03-26

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/683 ,  H01L21/78

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US10581037B2

公开(公告)日：2020-03-03

申请号：US15061169

申请日：2016-03-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Paul A. Lauro ,  Jae-Woong Nah ,  Adinath Narasgond ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: H01M2/08 ,  H01M4/66 ,  H01M4/04 ,  H01M2/16 ,  H01M4/62 ,  H01M4/50 ,  H01M4/02

Abstract: A battery structure includes an anode packaging material having a first textured surface and an anode metal formed on the first textured surface. A separator is formed on the anode metal. A cathode packaging material includes a second textured surface. A cathode metal is formed on the second textured surface. An active cathode paste is formed on the cathode metal and brought into contact with the separator such that any gap is filled with electrolyte.

公开(公告)号：US10388929B2

公开(公告)日：2019-08-20

申请号：US14978535

申请日：2015-12-22

Applicant: International Business Machines Corporation ,  Johnson & Johnson Vision Care, Inc.

Inventor： Paul S. Andry ,  Eric Lewandowski ,  Adam Toner ,  Daniel Otts ,  James Daniel Riall ,  Cornelia T. Yang

IPC: H01M2/16 ,  H01M6/40

Abstract: In one example, a battery includes a negative terminal, a positive terminal, an electrolyte contained between the negative terminal and the positive terminal, and a hydrogel layer positioned between and physically separating the negative terminal and the positive terminal.

公开(公告)号：US10280077B2

公开(公告)日：2019-05-07

申请号：US15723324

申请日：2017-10-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Huan Hu ,  Katsuyuki Sakuma

IPC: H01L51/00 ,  B81C1/00 ,  B81B3/00

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.

公开(公告)号：US20180211924A1

公开(公告)日：2018-07-26

申请号：US15412479

申请日：2017-01-23

Applicant: International Business Machines Corporation ,  Johnson & Johnson Vision Care, Inc.

Inventor： Paul S. Andry ,  Cornelia K. Tsang ,  Adam Toner

IPC: H01L23/552 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13026 ,  H01L2224/13111 ,  H01L2224/94 ,  H01L2924/3025 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01082

Abstract: After forming a first electromagnetic radiation blocking layer over a front side of a device wafer, the device wafer is bonded to a handle substrate from the front side. A semiconductor substrate in the device wafer is thinned from its backside. Trenches are formed extending through the device wafer and the first electromagnetic radiation blocking layer such that the device wafer is singulated into semiconductor dies. A second electromagnetic radiation blocking layer portion is formed on a backside surface of and sidewalls surfaces of each of the semiconductor dies such that each of the semiconductor dies are fully encapsulated by the first and second electromagnetic radiation blocking layer portions.

公开(公告)号：US09806299B2

公开(公告)日：2017-10-31

申请号：US14340304

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M6/04 ,  H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.