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公开(公告)号：US10338325B1
公开(公告)日：2019-07-02
申请号：US15995559
申请日：2018-06-01
Applicant: International Business Machines Corporation
Inventor： Barnim Alexander Janta-Polczynski , Tymon Barwicz , Elaine Cyr , Nicolas Boyer , Marie-Claude Paquet , Richard D. Langlois , Paul Francis Fortier
Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.
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公开(公告)号：US20180259728A1
公开(公告)日：2018-09-13
申请号：US15701960
申请日：2017-09-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Elaine Cyr , Paul F. Fortier , Takashi Hisada , Patrick Jacques , Koji Masuda , Masao Tokunari
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4214 , G02B6/423 , G02B6/4238 , G02B6/4245 , G02B6/4246 , G02B6/4249
Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.
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公开(公告)号：US20180259729A1
公开(公告)日：2018-09-13
申请号：US15948453
申请日：2018-04-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Elaine Cyr , Paul F. Fortier , Takashi Hisada , Patrick Jacques , Koji Masuda , Masao Tokunari
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4214 , G02B6/423 , G02B6/4238 , G02B6/4245 , G02B6/4246 , G02B6/4249
Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.
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公开(公告)号：US09897444B2
公开(公告)日：2018-02-20
申请号：US14580370
申请日：2014-12-23
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Elaine Cyr , Dominique L. Demers , Paul F. Fortier , Alexander Janta-Polczynski
CPC classification number: G01B21/16 , G01B11/0608 , G01B11/14 , G01B2210/56 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/75 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/75753 , H01L2224/75901 , H01L2224/81908 , H01L2924/14 , H01L2924/384 , H01L2924/014 , H01L2924/00014
Abstract: Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.
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公开(公告)号：US09093563B2
公开(公告)日：2015-07-28
申请号：US13939606
申请日：2013-07-11
Applicant: International Business Machines Corporation
Inventor： Edmund Blackshear , Elaine Cyr , Benjamin Vito Fasano , Paul Francis Fortier , Marcus E. Interrante , Roger Lam , Shidong Li , Thomas Edward Lombardi , Hilton T. Toy , Thomas Weiss
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L21/50 , H01L23/10 , H01L23/367 , H01L23/373 , H01L23/055 , H01L23/42 , H01L23/498
CPC classification number: H01L24/83 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L23/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , H01L2224/29036 , H01L2224/32245 , H01L2224/73253 , H01L2224/83862 , H01L2924/15311
Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.
Abstract translation: 公开了一种改进的电子模块组件和制造方法。 图案化的粘合剂阵列沉积在层叠体上，芯片附接到层压板上。 粘合剂的每个区域被称为盖子领带。 将盖子放置在层压板上，并与盖子接合。 盖子用于增加层压板的稳定性，并减少热加工和机械应力时的挠曲。
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Patent Agency Ranking
公开(公告)号：US20150014836A1
公开(公告)日：2015-01-15
申请号：US13939606
申请日：2013-07-11
Applicant: International Business Machines Corporation
Inventor： Edmund Blackshear , Elaine Cyr , Benjamin Vito Fasano , Paul Francis Fortier , Marcus E. Interrante , Roger Lam , Shidong Li , Thomas Edward Lombardi , Hilton T. Toy , Thomas Weiss
IPC: H01L23/02 , H01L21/50 , H01L23/498
CPC classification number: H01L24/83 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L23/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , H01L2224/29036 , H01L2224/32245 , H01L2224/73253 , H01L2224/83862 , H01L2924/15311
Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.
Abstract translation: 公开了一种改进的电子模块组件和制造方法。 图案化的粘合剂阵列沉积在层叠体上，芯片附接到层压板上。 粘合剂的每个区域被称为盖子领带。 将盖子放置在层压板上，并与盖子接合。 盖子用于增加层压板的稳定性，并减少热加工和机械应力时的挠曲。
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公开(公告)号：US11280968B2
公开(公告)日：2022-03-22
申请号：US16797199
申请日：2020-02-21
Applicant: International Business Machines Corporation
Inventor： Barnim Alexander Janta-Polczynski , Elaine Cyr , Richard D. Langlois , Paul Francis Fortier
Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.
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公开(公告)号：US09989713B1
公开(公告)日：2018-06-05
申请号：US15452128
申请日：2017-03-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Elaine Cyr , Paul F. Fortier , Takashi Hisada , Patrick Jacques , Koji Masuda , Masao Tokunari
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4214 , G02B6/423 , G02B6/4238 , G02B6/4245 , G02B6/4246 , G02B6/4249
Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.
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公开(公告)号：US20150093859A1
公开(公告)日：2015-04-02
申请号：US14567052
申请日：2014-12-11
Applicant: International Business Machines Corporation
Inventor： Edmund Blackshear , Elaine Cyr , Benjamin Vito Fasano , Paul Francis Fortier , Marcus E. Interrante , Roger Lam , Shidong Li , Thomas Edward Lombardi , Hilton T. Toy , Thomas Weiss
IPC: H01L23/00 , H01L23/373 , H01L23/367
CPC classification number: H01L24/83 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L23/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , H01L2224/29036 , H01L2224/32245 , H01L2224/73253 , H01L2224/83862 , H01L2924/15311
Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.
Abstract translation: 公开了一种改进的电子模块组件和制造方法。 图案化的粘合剂阵列沉积在层叠体上，芯片附接到层压板上。 粘合剂的每个区域被称为盖子领带。 将盖子放置在层压板上，并与盖子接合。 盖子用于增加层压板的稳定性，并减少热加工和机械应力时的挠曲。
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公开(公告)号：US20210263236A1
公开(公告)日：2021-08-26
申请号：US16797199
申请日：2020-02-21
Applicant: International Business Machines Corporation
Inventor： BARNIM ALEXANDER JANTA-POLCZYNSKI , Elaine Cyr , Richard D. Langlois , Paul Francis Fortier
Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.
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