公开(公告)号：US20150227174A1

公开(公告)日：2015-08-13

申请号：US14126285

申请日：2013-07-30

Applicant: INTEL CORPORATION

Inventor： Tod A. Byquist ,  Peter Bristol ,  Michael S. Brazel ,  Kristin L. Weihl ,  Stella Latscha ,  Alexander D. Williams ,  Nicolas Kurczewski ,  Barry T. Dale ,  Robert R. Atkinson, JR. ,  Stephen J. Allen ,  Patrick S. Johnson

IPC: G06F1/16 ,  E05D11/08

CPC classification number: G06F1/1681 ,  E05D11/08 ,  G06F1/1618 ,  G06F1/162 ,  G06F1/1679 ,  Y10T16/5403

Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Abstract translation: 在一个实施例中，用于电子设备的底架包括第一部分和第二部分以及将底盘的第一部分连接到用于电子设备的底盘的第二部分的组件，包括第一铰链组件，其被联接到第一部分 用于电子设备的底架的一部分，第二铰链组件，用于联接到用于电子设备的底盘的第二部分;第一刚性连接构件，其联接到第一铰链组件和第二铰链组件;第一电阻 以在所述第一铰链组件和所述第一刚性连接构件的第一端之间提供第一旋转阻力，以及在所述第二铰链组件和所述第一刚性连接构件的第二端之间提供第二旋转阻力的第一阻力元件。 可以描述其他实施例。

公开(公告)号：US20210365079A1

公开(公告)日：2021-11-25

申请号：US17444626

申请日：2021-08-06

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Magnetic force adjustment mechanisms are described herein. An electronic device includes a base, a first magnet carried by the base, a lid and a second magnet carried by the lid. The first and second magnets secure the base and the lid together with a holding force. A hinge pivotally couples the lid and the base. A slider displaces at least one of the first or second magnets relative to the other of the first or second magnets to reduce the holding force.

公开(公告)号：US09991223B2

公开(公告)日：2018-06-05

申请号：US14975532

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Michael R. Hui ,  Jonathon R. Carstens ,  Michael S. Brazel ,  Daniel P. Carter ,  Thomas A. Boyd ,  Shelby A. Ferguson ,  Rashelle Yee ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Anthony P. Valpiani

IPC: B23K3/08 ,  H04L23/00 ,  H01L23/00 ,  B23K1/00 ,  B23K101/42

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/087 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/75703 ,  H01L2224/75754 ,  H01L2224/81139 ,  H01L2224/81234 ,  H01L2924/15311 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/166 ,  H05K2203/167 ,  Y02P70/613

Abstract: Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed.

公开(公告)号：US20180350767A1

公开(公告)日：2018-12-06

申请号：US16054009

申请日：2018-08-03

Applicant: Intel Corporation

Inventor： Jonathon R. Carstens ,  Michael S. Brazel ,  Russell S. Aoki ,  Laura S. Mortimer

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H01L23/34 ,  H01L23/498 ,  B23K101/42 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K3/06 ,  B23K3/0638 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/345 ,  H01L23/49816 ,  H01L24/75 ,  H01L2224/81007 ,  H01L2224/81024 ,  H01L2224/81035 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/15321 ,  H05K3/1225 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2203/166

Abstract: Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.

公开(公告)号：US10321606B2

公开(公告)日：2019-06-11

申请号：US15471798

申请日：2017-03-28

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Kenan Arik ,  Michael S. Brazel

IPC: H05K7/20 ,  F28F1/40 ,  G06F1/20

Abstract: Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.

公开(公告)号：US09920771B2

公开(公告)日：2018-03-20

申请号：US15012754

申请日：2016-02-01

Applicant: Intel Corporation

Inventor： Ben M. Broili ,  Tod A. Byquist ,  Michael S. Brazel ,  Joseph A. Cervantes

IPC: H05K7/20 ,  F04D29/58 ,  F04D17/04 ,  F04D25/06 ,  F04D29/056 ,  F04D29/28 ,  F04D29/42

CPC classification number: F04D29/584 ,  F04D17/04 ,  F04D25/06 ,  F04D25/0606 ,  F04D29/056 ,  F04D29/282 ,  F04D29/4226 ,  H05K7/20136

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

公开(公告)号：US11106250B2

公开(公告)日：2021-08-31

申请号：US16694635

申请日：2019-11-25

Applicant: INTEL CORPORATION

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

公开(公告)号：US20200089286A1

公开(公告)日：2020-03-19

申请号：US16694635

申请日：2019-11-25

Applicant: INTEL CORPORATION

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

公开(公告)号：US20170017273A1

公开(公告)日：2017-01-19

申请号：US15242901

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/1654 ,  G06F1/1679

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

Abstract translation: 本文描述了用于形成和调节磁力机构的技术。 一种系统包括计算装置的第一部件中的第一磁性元件。 该系统包括计算装置的第二部件中的第二磁性元件，其中第一磁性部件和第二磁性部件将通过磁力保持紧张。 该系统还包括调节机构以调节去除磁性元件所需的力。