公开(公告)号：US10945353B2

公开(公告)日：2021-03-09

申请号：US15711468

申请日：2017-09-21

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Annie Chen ,  Jessica Gulbrand ,  Devdatta P. Kulkarni ,  Kristin L. Weldon ,  Joseph Andrew Broderick

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/44 ,  H05K3/22 ,  H05K1/18

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US12160971B2

公开(公告)日：2024-12-03

申请号：US17106042

申请日：2020-11-27

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Barrett M. Faneuf

IPC: H05K7/14 ,  G06F1/18 ,  H01R12/72 ,  H01R13/627

Abstract: An apparatus is described. The apparatus includes an electronic component to be plugged into an electronic system. The electronic component includes a housing. The housing includes a jam. The jam is to push through a first opening in a bottom of the housing and a second opening in a surface when the first and second openings are at least partially aligned. The surface is a mechanical component of the electronic system that the electrical component is to slide upon when being plugged into the electronic system. The jam includes tooth edges to engage with an edge of the second opening.

公开(公告)号：US20210216121A1

公开(公告)日：2021-07-15

申请号：US17214230

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC: G06F1/20 ,  H05K7/20

Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US20240407092A1

公开(公告)日：2024-12-05

申请号：US18806367

申请日：2024-08-15

Applicant: Intel Corporation

Inventor： Ariatne Ramirez Macias ,  Allison Van Horn ,  Kristin L. Weldon ,  Israel Cruz Ruiz ,  Fernando Gonzalez Lenero ,  Min Pei ,  Francisco Javier Colorado Alonso ,  Randall Scott Sanford ,  Emery Evon Frey ,  Eric W. Buddrius

IPC: H05K1/11

Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.

公开(公告)号：US20210365079A1

公开(公告)日：2021-11-25

申请号：US17444626

申请日：2021-08-06

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Magnetic force adjustment mechanisms are described herein. An electronic device includes a base, a first magnet carried by the base, a lid and a second magnet carried by the lid. The first and second magnets secure the base and the lid together with a holding force. A hinge pivotally couples the lid and the base. A slider displaces at least one of the first or second magnets relative to the other of the first or second magnets to reduce the holding force.

公开(公告)号：US11106250B2

公开(公告)日：2021-08-31

申请号：US16694635

申请日：2019-11-25

Applicant: INTEL CORPORATION

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

公开(公告)号：US20200089286A1

公开(公告)日：2020-03-19

申请号：US16694635

申请日：2019-11-25

Applicant: INTEL CORPORATION

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

公开(公告)号：US20170017273A1

公开(公告)日：2017-01-19

申请号：US15242901

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/1654 ,  G06F1/1679

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

Abstract translation: 本文描述了用于形成和调节磁力机构的技术。 一种系统包括计算装置的第一部件中的第一磁性元件。 该系统包括计算装置的第二部件中的第二磁性元件，其中第一磁性部件和第二磁性部件将通过磁力保持紧张。 该系统还包括调节机构以调节去除磁性元件所需的力。