公开(公告)号：US20210365079A1

公开(公告)日：2021-11-25

申请号：US17444626

申请日：2021-08-06

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Magnetic force adjustment mechanisms are described herein. An electronic device includes a base, a first magnet carried by the base, a lid and a second magnet carried by the lid. The first and second magnets secure the base and the lid together with a holding force. A hinge pivotally couples the lid and the base. A slider displaces at least one of the first or second magnets relative to the other of the first or second magnets to reduce the holding force.

公开(公告)号：US10917994B2

公开(公告)日：2021-02-09

申请号：US15393258

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/02 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

公开(公告)号：US20170314871A1

公开(公告)日：2017-11-02

申请号：US15393251

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: F28D15/02 ,  F28D15/04 ,  F28F13/16 ,  F28D21/00

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks are disclosed. An example embodiment includes: a base; and a plurality of fins in thermal coupling with the base, each fin of the plurality of fins having a wickless capillary driven constrained vapor bubble heat pipe embedded in the fin, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US10219409B2

公开(公告)日：2019-02-26

申请号：US15393263

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: G06F1/16 ,  H05K7/20 ,  G06F1/20 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  F28D15/02 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US20170318687A1

公开(公告)日：2017-11-02

申请号：US15393263

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K5/00 ,  G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  F28D15/04 ,  F28D15/02 ,  G02F1/1333 ,  F21V8/00

CPC classification number: H05K7/20336 ,  F28C3/08 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/046 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2215/06 ,  G02B6/0085 ,  G02F1/133385 ,  G06F1/1601 ,  G06F1/20 ,  G06F1/203 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/427 ,  H01L23/5389 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/0017 ,  H05K3/0044 ,  H05K5/0017 ,  H05K7/20318 ,  H05K7/20809 ,  H05K2201/064

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US11324139B2

公开(公告)日：2022-05-03

申请号：US16881409

申请日：2020-05-22

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/02 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

公开(公告)号：US20170318702A1

公开(公告)日：2017-11-02

申请号：US15392589

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  H05K3/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/427 ,  H05K1/02 ,  H05K1/18

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US20170314874A1

公开(公告)日：2017-11-02

申请号：US15393258

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: F28D15/04 ,  H05K7/20 ,  F28C3/08

CPC classification number: H05K7/20336 ,  F28C3/08 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/046 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2215/06 ,  G02B6/0085 ,  G02F1/133385 ,  G06F1/1601 ,  G06F1/20 ,  G06F1/203 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/427 ,  H01L23/5389 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/0017 ,  H05K3/0044 ,  H05K5/0017 ,  H05K7/20318 ,  H05K7/20809 ,  H05K2201/064

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

公开(公告)号：US11106250B2

公开(公告)日：2021-08-31

申请号：US16694635

申请日：2019-11-25

Applicant: INTEL CORPORATION

Inventor： Kristin L. Weldon ,  Michael S. Brazel ,  Jered H. Wikander ,  Lily Kolle ,  Weibo Chen ,  Aleksander Magi ,  Konstantin I. Kouliachev ,  Ralph V. Miele ,  Richard P. Crawford

IPC: G06F1/16

Abstract: Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

公开(公告)号：US10694641B2

公开(公告)日：2020-06-23

申请号：US15392589

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/02 ,  H01L23/427 ,  F28D15/04 ,  G06F1/20 ,  H01L21/48 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.