公开(公告)号：US20110083891A1

公开(公告)日：2011-04-14

申请号：US12631555

申请日：2009-12-04

Applicant: Hong Bok WE ,  Tae Sung JEONG ,  Dae Jun KIM

Inventor： Hong Bok WE ,  Tae Sung JEONG ,  Dae Jun KIM

IPC: H05K1/18 ,  B29C65/00 ,  B23K31/02

CPC classification number: H01L23/5389 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/186 ,  H05K1/189 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/10674

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：柔性膜; 形成在柔性膜的一侧上的绝缘层; 以面向下方式安装在柔性膜的一侧上的电子部件，使得电子部件埋设在绝缘层中; 以及电路层，其包括形成在柔性膜的一侧上的连接图案，并且通过连接构件与电子部件的连接端子连接。 电子元件嵌入式印刷电路板的优点在于，连接图案和连接端子之间的位置对准容易，并且其间的连接可靠性高，因为形成在柔性膜上的连接图案直接连接到柔性膜的连接端子 使用连接构件的电子部件，并且由于不需要额外的重新布线，可以减少其生产成本。

公开(公告)号：US20130119553A1

公开(公告)日：2013-05-16

申请号：US13438483

申请日：2012-04-03

Applicant: Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

Inventor： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L29/0657 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/15156 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H01L2924/00

Abstract: Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

Abstract translation: 本文公开了一种半导体封装，其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板，其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。

公开(公告)号：US20130081863A1

公开(公告)日：2013-04-04

申请号：US13607971

申请日：2012-09-10

Applicant: Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

Inventor： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

IPC: H05K1/16 ,  H05K3/10 ,  H05K1/09

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2924/12042 ,  H05K1/188 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/308 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2924/00

Abstract: Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.

Abstract translation: 提供了具有内置电子部件的基板及其制造方法。 用于制造具有内置电子部件的基板的方法包括：形成穿透并突出穿过预浸片的导电性临时凸块; 在突出的临时凸块上安装和附接电子部件; 通过将附着的电子元件层上的其它预浸渍片层叠在一起形成嵌入式基板，在层叠体的底部或层叠体的底部和顶部层压金属片，并且对预浸料片和金属片进行加压; 通过去除金属片的部分区域并且通过去除通过去除金属片区域暴露的临时凸块来形成接触槽; 并用导电金属填充接触槽并形成电路图案。

公开(公告)号：US20110164391A1

公开(公告)日：2011-07-07

申请号：US12775341

申请日：2010-05-06

Applicant: Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

Inventor： Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K3/445 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4641 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：金属基板，包括在其整个表面上形成的阳极氧化膜; 设置在形成在金属基板中的空腔中的两个电子部件分两级; 形成在所述金属基板的两侧的绝缘层，以埋置设置在所述空腔中的电子部件; 以及电路层，包括与电子部件的连接端子连接并形成在绝缘层的暴露表面上的通孔。 电子元件嵌入式印刷电路板的优点在于，由于使用金属基板代替传统的绝缘材料，因此可以提高其辐射电子元件产生的热量的辐射性能，并且可以降低其制造成本。

公开(公告)号：US20130098667A1

公开(公告)日：2013-04-25

申请号：US13478802

申请日：2012-05-23

Applicant: Jong In RYU ,  Yul Kyo CHUNG ,  Tae Sung JEONG

Inventor： Jong In RYU ,  Yul Kyo CHUNG ,  Tae Sung JEONG

IPC: H05K1/09

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K2201/10477 ,  H05K2203/1461 ,  H01L2924/00

Abstract: Disclosed herein is an embedded printed circuit board (PCB) including: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate. Since the surface space of the electronic component embedded in the substrate is utilized as a wiring space, a wiring design can be optimized, layers can be simplified, and an increase in the thickness of the substrate can be prevented.Also, malfunction of the embedded electronic component or a warping phenomenon of a PCB due to generated heat can be prevented.

Abstract translation: 本文公开了一种嵌入式印刷电路板（PCB），包括：铜箔层压板; 插入铜箔层压体中的内部电子部件; 形成在所述内部电子部件的表面上的第一电路图案; 以及形成在铜箔层叠体上的第二电路图案。 由于嵌入在基板中的电子部件的表面空间被用作布线空间，所以可以优化布线设计，可以简化层，并且可以防止基板厚度的增加。 此外，可以防止嵌入式电子部件的故障或由于发热引起的PCB翘曲现象。

公开(公告)号：US20120160550A1

公开(公告)日：2012-06-28

申请号：US13252777

申请日：2011-10-04

Applicant: Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

Inventor： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC: H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/1469 ,  Y10T29/4913

Abstract: Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed.

Abstract translation: 公开了一种具有嵌入式电子部件的印刷电路板，其包括第一绝缘层，设置在沿第一绝缘层的厚度方向形成的开口中并具有金属凸块的电子部件，形成在第一绝缘层的一侧的聚合物层 第一绝缘层，并且电子部件就座于其上，使得电子部件的金属凸块穿透聚合物层;第二绝缘层，形成在第一绝缘层的另一侧上以嵌入电子部件;第一绝缘层， 形成在第二绝缘层上的电路层和形成在聚合物层上的第二电路层，以直接电连接到穿透聚合物层的金属凸块，并且在聚合物层上形成粗糙度，使得力 增强了聚合物层对镀层的粘附性，从而确保电路层的电连接的可靠性， 随后形成。

公开(公告)号：US20110127076A1

公开(公告)日：2011-06-02

申请号：US12692413

申请日：2010-01-22

Applicant: Hong Won KIM ,  Tae Sung JEONG

Inventor： Hong Won KIM ,  Tae Sung JEONG

IPC: H05K1/00 ,  H05K3/30 ,  H05K1/16

CPC classification number: H05K3/306 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/185 ,  H05K3/007 ,  Y10T29/49139 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：基板，其厚度方向形成有空腔; 电子部件，其设置在所述空腔中，使得所述电子部件的有效表面与所述基板的一侧齐平; 绝缘材料层，其形成在所述基板的另一侧以埋置所述电子部件; 以及第一电路层，其形成在所述基板的一侧，并且包括与所述电子部件的连接端子接触的连接图案及其制造方法。 电子部件嵌入式印刷电路板的优点在于，电子部件的有源表面被设置为与基板的一侧齐平，使得不需要形成附加的通孔，结果是 可以省略需要高成本的激光工艺，从而简化印刷电路板的制造工艺并降低其制造成本。

公开(公告)号：US20120061833A1

公开(公告)日：2012-03-15

申请号：US12972310

申请日：2010-12-17

Applicant: Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

Inventor： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/11 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83001 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.

Abstract translation: 本文公开了嵌入式球栅阵列基板及其制造方法。 嵌入式球栅阵列包括：其中具有空腔的芯层; 嵌入在芯层的空腔中的半导体器件; 第一电路层，具有包括在其上形成的引线接合焊盘的电路图案; 第二电路层，其具有包括形成在其上的焊球图案的电路图案; 以及将半导体器件电连接到引线接合焊盘的线。