Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required.