Invention Application
- Patent Title: EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 嵌入式球栅阵列基板及其制造方法
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Application No.: US12972310Application Date: 2010-12-17
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Publication No.: US20120061833A1Publication Date: 2012-03-15
- Inventor: Tae Sung JEONG , Doo Hwan LEE , Seung Eun LEE
- Applicant: Tae Sung JEONG , Doo Hwan LEE , Seung Eun LEE
- Applicant Address: KR Gyunggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyunggi-do
- Priority: KR10-2010-0089021 20100910
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L21/60
Abstract:
Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.
Public/Granted literature
- US08692391B2 Embedded ball grid array substrate and manufacturing method thereof Public/Granted day:2014-04-08
Information query
IPC分类:
