FLOW METER
    1.
    发明申请

    公开(公告)号:US20210003437A1

    公开(公告)日:2021-01-07

    申请号:US16766771

    申请日:2018-10-11

    Abstract: A flow meter includes: a flat substrate; a housing that houses the substrate and has an open in at least one surface; a cover that covers the substrate and covers an open surface of the housing; a support that supports the substrate and is in contact with the cover and the substrate; and a fixing unit that connects the substrate and the housing, in which, in a first region and a second region formed by dividing the substrate into two parts at a center in a longitudinal direction, the support is disposed in the first region, and the fixing unit is disposed in the second region.

    Thermal Type Air Flow Meter Having a Reinforcing Structure Provided on the Base Member between the Board Fixing Part and the Secondary Passage Constituting Part
    3.
    发明申请
    Thermal Type Air Flow Meter Having a Reinforcing Structure Provided on the Base Member between the Board Fixing Part and the Secondary Passage Constituting Part 有权
    热式空气流量计具有在板固定部件和辅助通道构成部件之间的基座上提供的加强结构

    公开(公告)号:US20140360261A1

    公开(公告)日:2014-12-11

    申请号:US14470034

    申请日:2014-08-27

    CPC classification number: G01F1/6842 G01F1/69 G01F5/00

    Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

    Abstract translation: 公开了一种能够抑制成型时基体的变形的热式空气流量计,从而确保尺寸精度并减小尺寸变化对测量精度的影响。 仪表包括放置在内燃机的进气通道中的壳体构件和固定到壳体构件的基座构件,并且包括二次空气通道,通过进气通道的空气的一部分流动。 基座部件是由合成树脂材料形成的板状树脂模制部件,并且包括一体地形成在固定电路板的板固定部件之间的加强结构; 以及形成在所述板固定部的前端部的副通路构成部,所述加强结构提高所述基体的强度。

    PHYSICAL QUANTITY DETECTING DEVICE

    公开(公告)号:US20210302211A1

    公开(公告)日:2021-09-30

    申请号:US17057811

    申请日:2019-02-13

    Abstract: It is possible to suppress overcorrection.
    A physical quantity detecting device includes: a physical quantity detecting sensor that detects a physical quantity of a measurement target fluid and outputs a detection signal; a compensation amount calculation unit that calculates, by using the detection signal, a lead compensation amount used in lead compensation for the detection signal; and a gain control unit that adjusts the lead compensation amount based on a deviation that is an amount of change in lead compensation amount over time.

    Method of Manufacturing Thermal Flow Meter
    7.
    发明申请
    Method of Manufacturing Thermal Flow Meter 有权
    制造热流量计的方法

    公开(公告)号:US20160146652A1

    公开(公告)日:2016-05-26

    申请号:US14899567

    申请日:2014-02-07

    CPC classification number: G01F1/692 G01F1/684 G01F5/00

    Abstract: An objective of the present invention is, in a thermal flowmeter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm 201.

    Abstract translation: 本发明的目的在于,在具有使用模具形成在隔膜结构部附近的树脂部的结构的热式流量计中,为了防止压模时的膜结构部的破坏, 制造热流量计的方法包括:在支撑部件102b和111上支撑气体流量测量元件200,气体流量测量元件200包括由与基板表面倾斜的基板倾斜部分202a包围的空腔部分202,隔膜 201,其形成在隔膜201中;电阻元件, 并用形成有模具的树脂部分104覆盖气体流量测量元件200和支撑构件102b和111,以将模具14设置成使得模制树脂部分104的模具的压力作用部分位于外部 基板倾斜部分202a在隔膜201的整个周边。

    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same
    8.
    发明申请
    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 审中-公开
    流量传感器及其制造方法及其流程传感器模块及其制造方法

    公开(公告)号:US20140109691A1

    公开(公告)日:2014-04-24

    申请号:US14143553

    申请日:2013-12-30

    Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

    Abstract translation: 提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中,半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元(FDU)暴露的状态下被树脂(MR)覆盖。 由于树脂(MR)的上表面SUR(MR)高于半导体芯片(CHP1)的上表面SUR(CHP),所以通过在上表面SUR(CHP)的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上,可以使流量检测单元(FDU)周围的空气流稳定。 此外,通过增加半导体芯片(CHP1)和树脂(MR)之间的接触面积,可以防止半导体芯片(CHP1)和树脂(MR)之间的界面剥离。

Patent Agency Ranking