公开(公告)号：US20180073905A1

公开(公告)日：2018-03-15

申请号：US15814036

申请日：2017-11-15

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Tsutomu KONO ,  Yuuki OKAMOTO ,  Takeshi MORINO ,  Keiji HANZAWA

IPC: G01F15/16 ,  H01L29/84 ,  G01F1/684 ,  H01L23/495 ,  G01F1/692

CPC classification number: G01F15/16 ,  G01F1/684 ,  G01F1/6842 ,  G01F1/692 ,  H01L23/495 ,  H01L29/84 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

公开(公告)号：US20150137282A1

公开(公告)日：2015-05-21

申请号：US14604792

申请日：2015-01-26

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Tsutomu KONO ,  Yuuki OKAMOTO ,  Takeshi MORINO ,  Keiji HANZAWA

IPC: G01F15/16 ,  H01L23/495 ,  H01L29/84

CPC classification number: G01F15/16 ,  G01F1/684 ,  G01F1/6842 ,  G01F1/692 ,  H01L23/495 ,  H01L29/84 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

Abstract translation: 流量传感器结构通过制造方法密封电气控制电路的表面和半导体器件的一部分，该制造方法通过模具夹紧半导体器件时可防止发生闪光或芯片裂纹。 流量传感器结构包括具有气流检测单元和隔膜的半导体器件，以及具有用于控制半导体器件的电气控制电路的电路板或引线框架，其中电气控制电路的表面和 半导体器件被树脂覆盖，同时使空气流感测单元部分暴露。 流量传感器结构可以包括环绕半导体器件的树脂模具，板或预模具部件的表面，其连续地不与半导体器件的三个壁接触，半导体器件的正面与气流感测单元部分 处置。