公开(公告)号：US20210278263A1

公开(公告)日：2021-09-09

申请号：US17256908

申请日：2019-06-20

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Hiroki NAKATSUCHI ,  Yasuo ONOSE ,  Takayuki YOGO ,  Ryotaro SHIMADA

IPC: G01F1/692 ,  G01F1/38

Abstract: A flow-rate sensor is provided with a lead frame, a semiconductor chip that is disposed on one surface of the lead frame, and in which a diaphragm including a void portion on the lead frame side is formed, a flow rate detecting unit that is formed on the one surface including the diaphragm of the semiconductor chip, and resin that includes a flow passage opening portion exposing at least a portion of the flow rate detecting unit formed on the diaphragm, and covers the lead frame and the semiconductor chip. A lower side resin portion of the resin covering another surface side of the lead frame, on an opposite side to the one surface side thereof, has a thinned portion that is thinner than a periphery thereof in a region facing a peripheral edge portion of the diaphragm.

公开(公告)号：US20150338258A1

公开(公告)日：2015-11-26

申请号：US14759374

申请日：2013-11-18

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Tsutomu KONO ,  Keiji HANZAWA ,  Noboru TOKUYASU ,  Shinobu TASHIRO ,  Hiroki NAKATSUCHI

IPC: G01F15/16 ,  B81C1/00

CPC classification number: G01F15/16 ,  B81C1/00333 ,  G01F1/6845 ,  G01F1/692

Abstract: When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

Abstract translation: 当半导体芯片的暴露部分尺寸减小时，抑制了半导体芯片上的裂纹发展的倾向。 将树脂MR注入第二空间的压力在弹性膜LAF和半导体芯片CHP1接触的接触部分SEL上产生间隙，并且与树脂MR成分不同的树脂MR2渗透到间隙中。 结果，在从树脂MR露出的半导体芯片CHP1的区域中，树脂MR2形成在流动检测单元FDU以外的区域和周围的区域。 因此，从树脂MR和MR2露出的半导体芯片CHP1的面积可以减小。

公开(公告)号：US20210003437A1

公开(公告)日：2021-01-07

申请号：US16766771

申请日：2018-10-11

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Hiroki NAKATSUCHI ,  Tsutomu KONO ,  Shinobu TASHIRO ,  Ryotaro SHIMADA

IPC: G01F1/684

Abstract: A flow meter includes: a flat substrate; a housing that houses the substrate and has an open in at least one surface; a cover that covers the substrate and covers an open surface of the housing; a support that supports the substrate and is in contact with the cover and the substrate; and a fixing unit that connects the substrate and the housing, in which, in a first region and a second region formed by dividing the substrate into two parts at a center in a longitudinal direction, the support is disposed in the first region, and the fixing unit is disposed in the second region.