PHYSICAL QUANTITY DETECTION DEVICE
    1.
    发明申请

    公开(公告)号:US20170268916A1

    公开(公告)日:2017-09-21

    申请号:US15532170

    申请日:2015-11-02

    CPC classification number: G01F1/684 G01F1/6842 G01F5/00 G01F15/14 G01M15/042

    Abstract: To improve measurement stability of a flow rate detection unit in a physical quantity detection device, a periphery of a synthetic resin material is provided with a protruding section protruding to a cover side. A physical quantity detection device includes a housing, a front cover fixed to the housing, a circuit board housed in the housing, a flow rate detection unit that detects, in a sub-path, the flow rate of a gas to be measured by being attached to the circuit board, a connecting wire that electrically connects the flow rate detection unit to the circuit board, and a synthetic resin material that seals a connecting wire-included connection portion between the circuit board and the flow rate detection unit, the front cover having a protruding section covering at least a part of the synthetic resin material by protruding into the sub-path.

    Air Flow Rate Detecting Device
    4.
    发明申请

    公开(公告)号:US20180313681A1

    公开(公告)日:2018-11-01

    申请号:US15534114

    申请日:2016-02-26

    CPC classification number: G01F1/684

    Abstract: The objective of the present invention is to provide an air flow rate detecting device with which the inflow of air to the reverse surface of a diaphragm is reduced, while stresses acting on a flow rate detecting unit are alleviated and variability in the mounting of the flow rate detecting unit is reduced. This air flow rate measuring device comprises: a flow rate detecting unit including a diaphragm which detects the air flow rate of a gas being measured; a circuit board on which the flow rate detecting unit is mounted; and a housing which accommodates the circuit board. The flow rate detecting unit and the circuit board are secured to one another using a sheet-like adhesive, and are secured in such a way that a surface of the flow rate detecting unit that is perpendicular to the direction of flow is sealed by means of a resilient body, and a surface of the flow rate detecting unit that is parallel to the direction of flow is open.

    Humidity Detection Device
    6.
    发明申请
    Humidity Detection Device 审中-公开
    湿度检测装置

    公开(公告)号:US20170037819A1

    公开(公告)日:2017-02-09

    申请号:US15301493

    申请日:2015-03-25

    Abstract: The purpose of the present invention is to reduce a load of preventing dew condensation, and to provide a highly reliable humidity detection device. In order to achieve the purpose, this humidity detection device is provided with: a humidity sensor having a humidity detection unit and a temperature detection unit; a heating resistor that heats the humidity sensor; and a heating control unit that controls a heating temperature of the heating resistor. The humidity detection device is characterized in having a target temperature storage unit that stores target temperatures of the heating resistor, said target temperatures having been determined corresponding to temperatures and humidities.

    Abstract translation: 本发明的目的是减少防止结露的负担,并提供高度可靠的湿度检测装置。 为了达到这个目的,该湿度检测装置具有:湿度传感器,其具有湿度检测单元和温度检测单元; 加热电阻器,加热湿度传感器; 以及加热控制单元,其控制加热电阻器的加热温度。 湿度检测装置的特征在于具有存储加热电阻器的目标温度的目标温度存储单元,所述目标温度已经根据温度和湿度确定。

    Flow-Rate Sensor
    7.
    发明申请

    公开(公告)号:US20210278263A1

    公开(公告)日:2021-09-09

    申请号:US17256908

    申请日:2019-06-20

    Abstract: A flow-rate sensor is provided with a lead frame, a semiconductor chip that is disposed on one surface of the lead frame, and in which a diaphragm including a void portion on the lead frame side is formed, a flow rate detecting unit that is formed on the one surface including the diaphragm of the semiconductor chip, and resin that includes a flow passage opening portion exposing at least a portion of the flow rate detecting unit formed on the diaphragm, and covers the lead frame and the semiconductor chip. A lower side resin portion of the resin covering another surface side of the lead frame, on an opposite side to the one surface side thereof, has a thinned portion that is thinner than a periphery thereof in a region facing a peripheral edge portion of the diaphragm.

    Thermal-Type Flowmeter
    8.
    发明申请

    公开(公告)号:US20210148743A1

    公开(公告)日:2021-05-20

    申请号:US16637654

    申请日:2018-07-17

    Abstract: Provided is a thermal-type flowmeter which can prevent a reduction of flow rate accuracy and reliability, and an increase of cost of the thermal-type flowmeter compared to the related art, and can add a function of an electrostatic scattering mechanism. The thermal-type flowmeter of the present invention includes a sub-passage into which part of a measurement target gas flowing in a main passage is taken, a flow rate detection element of a flow measurement unit which is disposed in the sub-passage, a circuit package which supports the flow rate detection element, and a substrate to which the circuit package is fixed. The flow rate detection element includes a detection surface to detect a flow rate of the measurement target gas. The detection surface is disposed to face the circuit substrate.

    AIR FLOW RATE MEASUREMENT DEVICE
    9.
    发明申请

    公开(公告)号:US20200049538A1

    公开(公告)日:2020-02-13

    申请号:US16338836

    申请日:2017-09-26

    Abstract: An air flow rate measurement device capable of suppressing disturbance of a flow of measured gas and reducing a characteristic influence due to water droplets flowing with intake air is realized. An edge 800 of the upstream side where air flows in a circuit board 400 on which a flow rate detection portion 602 is mounted is provided with a segmentation portion 801 to be a semicircular notch structure to segment the edge 800. Water droplets flowing with measured gas 30 can be captured by the segmentation portion 801 to inhibit the water droplets from arriving at the flow rate detection portion 602.

    SEMICONDUCTOR MODULE
    10.
    发明申请

    公开(公告)号:US20190267736A1

    公开(公告)日:2019-08-29

    申请号:US16348208

    申请日:2017-10-17

    Abstract: A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

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